Patents by Inventor Ting Tan
Ting Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240179783Abstract: Techniques are described for a communication device to trigger an aggregation operation. An example wireless communication method includes transmitting, by a first network device to a first communication device, a first message that includes the aggregation related information of a second communication device with which the first communication device is configured to perform an aggregation operation with the second communication device; and receiving, from the first communication device, a second message that indicates that the first communication device received the first message.Type: ApplicationFiled: February 6, 2024Publication date: May 30, 2024Inventors: Xiubin SHA, Bo DAI, Ting LU, Li NIU, Jie TAN
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Publication number: 20240179706Abstract: Provided are a feedback information transmission method and apparatus, a base station, a user equipment and a storage medium. The method includes sending a setting parameter of a physical downlink control channel (PDCCH) search space; sending a scheduled dedicated uplink resource grant or a scheduled dedicated downlink resource grant through the PDCCH search space; and in response to receiving a physical uplink shared channel (PUSCH) of a user equipment (UE), sending a PUSCH feedback indication to the UE through the PDCCH search space so that the UE stops sending the remaining repetition number of the PUSCH.Type: ApplicationFiled: January 14, 2022Publication date: May 30, 2024Inventors: Xiubin SHA, Bo DAI, Ting LU, Li NIU, Jie TAN
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Patent number: 11994011Abstract: The present invention discloses a permanent packer and an extended gas lift method using the permanent packer, the method comprising: S1. imbedding the extended gas lift embedded pipe when setting the permanent packer, wherein the extended gas lift embedded pipe has an upper end being closed and a lower end being open, is provided therein with a one-way valve through which the fluid can pass from top to bottom; S2. lowering a breaking device from the production casing when in the extended gas lift, to break the upper end of the extended gas lift embedded pipe such that the upper and lower ends of the extended gas lift embedded pipe are communicated; and S3. injecting gas into the production casing, lifting the accumulated liquid in the bottom hole to the ground surface, to complete the extended gas lift.Type: GrantFiled: September 16, 2020Date of Patent: May 28, 2024Assignees: PetroChina Company Limited, Sichuan Shengnuo Oil. and Gas Engineering Technology Service Co. LtdInventors: Weilin Wang, Huiyun Ma, Changqing Ye, Hao Tan, Hanbing Tang, Daogang Cai, Xueqiang Wang, Yukui Hong, Fengjing Sun, Wei Zhou, Ting Zhang, Zonghao Dong, Yan Huang, Yun Miao
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Publication number: 20240172039Abstract: Provided are a quality of service flow transmission method, a base station, a terminal, and a storage medium. The quality of service flow transmission method includes acquiring at least one protocol data unit (PDU) session sent by a core network, where the information frame format of the PDU session carries indication information; and determining the category to which each PDU session belongs according to the indication information.Type: ApplicationFiled: October 14, 2021Publication date: May 23, 2024Inventors: Xiubin SHA, Bo DAI, Ting LU, Jie TAN
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Patent number: 11973285Abstract: A terminal and a receptacle connector are provided. The terminal comprises a soldering segment, an upright arm and a bending arm. The soldering segment has a first end portion and the upright arm extends upwardly from the first end portion. The bending arm bends back and obliquely extends upwardly close to the upright arm and includes an upper bending segment and a contact segment extends upwardly from the upper bending segment. A shoulder portion is formed at each of at least one side edge of two side edges of each of at least one of the upright arm and the bending arm, the two side edges are connected with the soldering segment, the shoulder portion protrudes relative to a corresponding side edge of the soldering segment.Type: GrantFiled: November 10, 2021Date of Patent: April 30, 2024Assignee: Molex, LLCInventors: Hien-Hwee Tan, Yueh-Ting Chiang, Yao-Ting Wang
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Patent number: 11960211Abstract: In an embodiment, an apparatus includes an energy source, a support platform for holding a wafer, an optical path extending from the energy source to the support platform, and a photomask aligned such that a patterned major surface of the photomask is parallel to the force of gravity, where the optical path passes through the photomask, where the patterned major surface of the photomask is perpendicular to a topmost surface of the support platform.Type: GrantFiled: July 9, 2021Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hung-Jui Kuo, Ting-Yang Yu, Ming-Tan Lee
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Publication number: 20240098842Abstract: Service-related parameters may be communicated for a survival time measurement. Those parameters can be wirelessly communicated on the Radio Access Network (“RAN”) side. A measurement of the survival time and implementation of a survival time timer is based on those parameters and/or a timer for a packet delay budget.Type: ApplicationFiled: August 31, 2023Publication date: March 21, 2024Applicant: ZTE CorporationInventors: Jie Tan, Xiubin Sha, Bo Dai, Ting Lu
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Patent number: 11936126Abstract: A terminal and a receptacle connector are provided. The terminal comprises a soldering segment, an upright arm and a bending arm. The soldering segment has a first end portion and the upright arm extends upwardly from the first end portion. The bending arm bends back and obliquely extends upwardly close to the upright arm and includes an upper bending segment and a contact segment extends upwardly from the upper bending segment. A shoulder portion is formed at each of at least one side edge of two side edges of each of at least one of the upright arm and the bending arm, the two side edges are connected with the soldering segment, the shoulder portion protrudes relative to a corresponding side edge of the soldering segment.Type: GrantFiled: November 10, 2021Date of Patent: March 19, 2024Assignee: Molex, LLCInventors: Hien-Hwee Tan, Yueh-Ting Chiang, Yao-Ting Wang
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Publication number: 20240079317Abstract: Methods, systems, and devices for techniques to manufacture inter-layer vias are described. In some examples, a manufacturing process for a via to one or more metal lines within an integrated circuit may not include forming a metal pad for the via. For example, the manufacturing process may include forming a layer of dielectric material over a set of metal lines. The manufacturing process may further include forming a cavity through the dielectric layer (e.g., using an etching procedure), exposing the upper surfaces and sidewalls of one or more metal lines of the set. Subsequently, the via may be formed by depositing a conductive material within the cavity. In some cases, the conductive material may be deposited to contact the sidewalls of the one or more metal lines. Such an assembly may establish electrical connection to other electrical components of the integrated circuit.Type: ApplicationFiled: September 6, 2022Publication date: March 7, 2024Inventors: Jun Rong Tan, Keen Wah Chow, Hao Ting Teo, Hoong Shing Wong
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Publication number: 20240071887Abstract: A semiconductor package includes a first die, a second die and a redistribution layer structure. The first die and the second die are disposed laterally. The redistribution layer structure is disposed over and electrically connected to the first die and the second die, wherein the redistribution layer structure includes a plurality of vias and a plurality of lines stacked alternately and electrically connected to each other and embedded by a plurality of polymer layers, and wherein from a top view, first vias of the plurality of vias overlapping with the first die or the second die have an elliptical-like shape.Type: ApplicationFiled: August 23, 2022Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Zi-Jheng Liu, Ting-Yang Yu, Ming-Tan Lee, Hung-Jui Kuo
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Publication number: 20210169159Abstract: A muscular stress-reducing glove (100), comprising a thumb (150) with a thumb ball profile (155); a plurality of fingers (161-164) with one or more flattened fingers to improve the matching of physical profile between the glove and fingers of a glove user; flattened palm (120) and backhand (130) profile to resemble the physical profile of glove user's palm and backhand; a cuff region (110); a plurality of crotch regions; a plurality of concave profiles (145) to mimic the physical profile of glove user's finger crotches or one or more grooves (170) at the palm region (120) and/or backhand region (130) to provide additional flexibility and stretchability for the comfort of glove user.Type: ApplicationFiled: December 8, 2020Publication date: June 10, 2021Applicant: Top Glove International Sdn. Bhd.Inventors: CHONG BAN WONG, AI TING TAN, ZU XIAN TEO
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Patent number: 11027519Abstract: Self-stressing engineered composites that include a matrix containing self-stressing reinforcement that is activated by an activator that causes, in situ, the self-stressing reinforcement to transfer at least some of its pre-stress into portions of the matrix adjacent the self-stressing reinforcement. In some embodiments, the activator can be of a self-activating, an internal activating, and/or an external activating type. In some embodiments, the self-stressing reinforcement includes an active component that holds and transfers pre-stress to a matrix and a releasing component that causes the active component to transfer its pre-stress to the matrix. In some embodiments, the self-stressing reinforcement is initially unstressed and becomes stressed upon activation. Various engineered composites, self-stressing reinforcement, and applications of self-stressing engineered composites are disclosed.Type: GrantFiled: April 29, 2016Date of Patent: June 8, 2021Assignee: The University of Vermont and State Agricultural CollegeInventors: Patrick Chang Dong Lee, Dryver R. Huston, Ting Tan
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Publication number: 20210030086Abstract: A method of manufacturing a textured former and a glove made therefrom, wherein the method comprises preparing a hand-shaped ceramic greenware, scanning the hand-shaped ceramic greenware to generate a digital 3D hand-shaped greenware model, modelling a pair of stencil covers with curvy texture line based on the digital 3D hand-shaped greenware model, printing the stencil covers, creating a curvy palm texture on the hand-shaped ceramic greenware with the aid of the stencil covers, firing the hand-shaped ceramic greenware with curvy palm texture in a kiln and dipping the hand-shaped ceramic former with curvy palm texture in an aqueous colloidal dispersion to produce glove with curvy palm texture.Type: ApplicationFiled: July 15, 2020Publication date: February 4, 2021Inventors: CHONG BAN WONG, AI TING TAN, ZU XIAN TEO
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Publication number: 20180111348Abstract: Self-stressing engineered composites that include a matrix containing self-stressing reinforcement that is activated by an activator that causes, in situ, the self-stressing reinforcement to transfer at least some of its pre-stress into portions of the matrix adjacent the self-stressing reinforcement. In some embodiments, the activator can be of a self-activating, an internal activating, and/or an external activating type. In some embodiments, the self-stressing reinforcement includes an active component that holds and transfers pre-stress to a matrix and a releasing component that causes the active component to transfer its pre-stress to the matrix. In some embodiments, the self-stressing reinforcement is initially unstressed and becomes stressed upon activation. Various engineered composites, self-stressing reinforcement, and applications of self-stressing engineered composites are disclosed.Type: ApplicationFiled: April 29, 2016Publication date: April 26, 2018Inventors: Patrick Chang Dong Lee, Dryver R. Huston, Ting Tan
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Patent number: 9728669Abstract: A method of manufacturing solar cell includes providing a semiconductor substrate. A coating layer is then formed on a plurality of sides. Subsequently, an anti-reflective layer is formed on the layer. Finally at least one first electrode and at least one second electrode are formed. The first and second electrodes respectively and electrically connect to the second conductive amorphous substrate and the semiconductor substrate. The potential induced degradation is greatly reduced.Type: GrantFiled: June 24, 2013Date of Patent: August 8, 2017Assignee: Sino-American Silicon Products Inc.Inventors: Budi Tjahjono, Ming-Jui Yang, Chuan-Wen Ting, Yu-Ting Chiu, Jen-Ting Tan, Wen Sheng Wu, Kuo-Wei Shen, Fang-Wei Hu
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Publication number: 20160032889Abstract: A vertical wind turbine having a plurality of blades having an aerodynamic helix core laminated with natural bamboo is provided. Each blade with its aerodynamic core laminated with natural bamboo also includes: a framework which is resistant to stress fractures and minimizes or eliminates traveling stress concentrations. The hybrid helical blade construction includes honeycombed ABS plastic core which provides superior lightweight mechanical strength.Type: ApplicationFiled: August 2, 2015Publication date: February 4, 2016Inventors: Ting Tan, Tian Xia
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Patent number: 8863585Abstract: Embodiments for apparatuses for testing reversal bending fatigue in an elongated beam are disclosed. Embodiments are configured to be coupled to first and second end portions of the beam and to apply a bending moment to the beam and create a pure bending condition in an intermediate portion of the beam. Embodiments are further configured to cyclically alternate the direction of the bending moment applied to the beam such that the intermediate portion of the beam cyclically bends in opposite directions in a pure bending condition.Type: GrantFiled: February 14, 2012Date of Patent: October 21, 2014Assignee: UT-Battelle, LLCInventors: Jy-An John Wang, Hong Wang, Ting Tan
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Publication number: 20140286737Abstract: A data storage library comprising a stack of storage modules, each storage module comprising an array of storage slots, the data storage library comprising: a plurality of transmission robots, each transmission robot comprising a tray for transporting a data storage medium to and from a storage slot; and a transmission apparatus configured for effecting movement of at least one of the plurality of transmission robots between two adjacent storage modules in the data storage library.Type: ApplicationFiled: June 3, 2014Publication date: September 25, 2014Inventors: Kan YANG, Hongli BAI, Chin Ting TAN, Sheau Yeng WEI, Yeow Seng VOON
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Publication number: 20140251421Abstract: A method of manufacturing solar cell includes providing a semiconductor substrate. A coating layer is then formed on a plurality of sides. Subsequently, an anti-reflective layer is formed on the layer. Finally at least one first electrode and at least one second electrode are formed. The first and second electrodes respectively and electrically connect to the second conductive amorphous substrate and the semiconductor substrate. The potential induced degradation is greatly reduced.Type: ApplicationFiled: June 24, 2013Publication date: September 11, 2014Inventors: BUDI TJAHJONO, MING-JUI YANG, CHUAN-WEN TING, YU-TING CHIU, JEN-TING TAN, WEN SHENG WU, KUO-WEI SHEN, FANG-WEI HU
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Publication number: 20130205911Abstract: Embodiments for apparatuses for testing reversal bending fatigue in an elongated beam are disclosed. Embodiments are configured to be coupled to first and second end portions of the beam and to apply a bending moment to the beam and create a pure bending condition in an intermediate portion of the beam. Embodiments are further configured to cyclically alternate the direction of the bending moment applied to the beam such that the intermediate portion of the beam cyclically bends in opposite directions in a pure bending condition.Type: ApplicationFiled: February 14, 2012Publication date: August 15, 2013Inventors: Jy-An John Wang, Hong Wang, Ting Tan