Patents by Inventor Ting-Wei Lin
Ting-Wei Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240168568Abstract: An electronic device includes an image capturing module and a processing module. The image capturing module is configured to capture a hand to obtain a first hand image. The processing module is configured to receive the first hand image, process the first hand image through an artificial intelligence model to generate a first hand landmark, and control the electronic device to enter the unlock mode according to a first gesture corresponding to the first hand landmark.Type: ApplicationFiled: October 17, 2023Publication date: May 23, 2024Inventors: Cheng-Wei LIN, Ruey-Jer WENG, Po-Lung WU, Ting-Hao GUO
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Patent number: 11983267Abstract: A data processing method based on Trojan circuit detection includes controlling a processor, in a testing stage, to perform following steps: obtaining a plurality of characteristic values corresponding to a logic gate circuit; performing a distribution adjustment operation on the characteristic values to generate a plurality of adjusted characteristic values; and performing classification on the adjusted characteristic values to generate a logic identification result.Type: GrantFiled: November 30, 2021Date of Patent: May 14, 2024Assignee: INSTITUTE FOR INFORMATION INDUSTRYInventors: Jian Wei Liao, Ting Yu Lin, Kai Chiang Wu, Jung Che Tsai
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Publication number: 20240118316Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.Type: ApplicationFiled: December 19, 2023Publication date: April 11, 2024Applicant: MPI CorporationInventors: Chin-Yi Lin, Che-Wei Lin, Ting-Ju Wu, Chien-Kai Hung
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Patent number: 11955397Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.Type: GrantFiled: November 9, 2020Date of Patent: April 9, 2024Assignee: Vanguard International Semiconductor CorporationInventors: Shin-Cheng Lin, Cheng-Wei Chou, Ting-En Hsieh, Yi-Han Huang, Kwang-Ming Lin, Yung-Fong Lin, Cheng-Tao Chou, Chi-Fu Lee, Chia-Lin Chen, Shu-Wen Chang
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Publication number: 20240113856Abstract: The present invention provides an encryption determining method. The method includes the following steps: receiving a side channel signal; generating a filtered side channel signal by filtering noise within the side channel signal; generating a phasor signal by utilizing a filter to covert the filtered side channel signal; locating the encrypted segment by calculating a periodicity of the phasor signal utilizing a standard deviation window; extracting at least one encrypted characteristic from the encrypted segment; and generating an encryption analytic result by recognizing the at least one encrypted characteristic according to a characteristic recognition model; wherein the encryption analytic result includes a position of the encrypted segment within the side channel signal, and an encryption type corresponding to the side channel signal. The present invention is able to automatically and efficiently locate the encryption segment and analyze the encryption type corresponding to the side channel signal.Type: ApplicationFiled: October 31, 2022Publication date: April 4, 2024Applicant: INSTITUTE FOR INFORMATION INDUSTRYInventors: Jian-Wei LIAO, Cheng-En LEE, Ting-Yu LIN
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Publication number: 20240099086Abstract: A display may have an array of pixels. Display driver circuitry may supply data and control signals to the pixels. Each pixel may have seven transistors, a capacitor, and a light-emitting diode such as an organic light-emitting diode. The seven transistors may receive control signals using horizontal control lines. Each pixel may have first and second emission enable transistors that are coupled in series with a drive transistor and the light-emitting diode of that pixel. The first and second emission enable transistors may be coupled to a common control line or may be separately controlled so that on-bias stress can be effectively applied to the drive transistor. The display driver circuitry may have gate driver circuits that provide different gate line signals to different rows of pixels within the display. Different rows may also have different gate driver strengths and different supplemental gate line loading structures.Type: ApplicationFiled: November 17, 2023Publication date: March 21, 2024Inventors: Cheng-Ho Yu, Chin-Wei Lin, Shyuan Yang, Ting-Kuo Chang, Tsung-Ting Tsai, Warren S. Rieutort-Louis, Shih-Chang Chang, Yu Cheng Chen, John Z. Zhong
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Publication number: 20240083742Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.Type: ApplicationFiled: November 15, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ting-Li YANG, Kai-Di WU, Ming-Da CHENG, Wen-Hsiung LU, Cheng Jen LIN, Chin Wei KANG
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Publication number: 20240069618Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.Type: ApplicationFiled: April 27, 2023Publication date: February 29, 2024Inventors: Wen Che CHUNG, Hui Chuan LO, Hao-Hsuan LIN, Chun TSAO, Jun-Fu CHEN, Ming-Hung YAO, Jia-Wei ZHANG, Kuan-Lun CHEN, Ting-Chao LIN, Cheng-Yen LIN, Chunyen LAI
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Publication number: 20240069069Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.Type: ApplicationFiled: November 10, 2023Publication date: February 29, 2024Applicant: Alliance Material Co., Ltd.Inventors: Chun-Fa Chen, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin
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Patent number: 11903735Abstract: An apparatus and method for examining an organism surface includes a pliable member including a contact layer, a plurality of channels, and a reaction layer, wherein the plurality of channels are disposed between the contact layer and the reaction layer; each of the channels having a size in the range of micrometers and formed of biocompatibility materials, and the contact layer including a plurality of spherical projections having a size in the range of micrometers and formed of biocompatible materials, and the reaction layer including examining molecules and a reaction unit.Type: GrantFiled: April 30, 2021Date of Patent: February 20, 2024Assignees: CHANG GUNG UNIVERSITY, CHANG GUNG MEMORIAL HOSPITAL, LINKOUInventors: Hsin-Yao Wang, Ting-Wei Lin, Jang-Jih Lu
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Patent number: 11865588Abstract: A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.Type: GrantFiled: March 10, 2022Date of Patent: January 9, 2024Assignee: Alliance Material Co., Ltd.Inventors: Chun-Fa Chen, Chi-Hua Huang, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin, Chin-Kai Lin, Chen-Ju Lee
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Patent number: 11749905Abstract: A dual-band patch array antenna module and an electronic device using the same are provided. The dual-band patch array antenna module includes an insulative carrier substrate, a common conductive metal layer, a common grounding metal layer, an outer surrounding shielding structure, a plurality of first band antenna structures, and a plurality of second band antenna structures. The common conductive metal layer is disposed inside the insulative carrier substrate. The common grounding metal layer is disposed on the insulative carrier substrate. The outer surrounding shielding structure is electrically connected between the common conductive metal layer and the common grounding metal layer. Each first band antenna structure includes a first radiator, two first metal elements, two first feeding elements, and two first inner surrounding shielding assemblies.Type: GrantFiled: January 4, 2022Date of Patent: September 5, 2023Assignee: Taiwan Inpaq electronic Co., Ltd.Inventors: Ta-Fu Cheng, Cheng-Yi Wang, Ting-Wei Lin
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Publication number: 20230267641Abstract: A device position correction method applicable to a wearable device is provided. The device position correction method includes the following steps. A wearable device image is received. An object detector detects the wearable device position, which is the position in the wearable device image. A limb detection model detects a plurality of skeleton points and a limb position, which is the position of a limb in the wearable device image, in order to determine which body part corresponds to the limb. According to the skeleton points and the limb position, correction information related to the wearable device position is generated.Type: ApplicationFiled: August 30, 2022Publication date: August 24, 2023Applicant: HTC CorporationInventors: Ting-Wei LIN, Min-Chia WEI
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Patent number: 11693485Abstract: The embodiments of the disclosure provide a method for improving quality of a visual content, a host, and a computer readable storage medium. The method includes: determining a first gesture of a first hand and accordingly providing a first hand object in the visual content; determining a second gesture of a second hand and accordingly providing a second hand object in the visual content; in response to determining that the first gesture and the second gesture respectively correspond to a first predetermined gesture and a second predetermined gesture, determining a specific distance between the first gesture and the second gesture; and in response to determining that the specific distance is smaller than a distance threshold, refining the first hand object and the second hand object.Type: GrantFiled: October 2, 2022Date of Patent: July 4, 2023Assignee: HTC CorporationInventors: Ting-Wei Lin, Min Chia Wei, Chien-Min Wu
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Patent number: 11670872Abstract: A movable device and a block-type millimeter wave array antenna module thereof are provided. The block-type millimeter wave array antenna module includes an antenna carrying substrate, an antenna signal transmitting group, an antenna signal receiving group, and a dummy antenna group. The antenna carrying substrate includes a plurality of block-shaped carrier bodies that are divided into a plurality of first, second, third, and fourth antenna carrier blocks. The antenna signal transmitting group includes a plurality of signal transmitting antenna structures respectively carried by the first antenna carrier blocks. The antenna signal receiving group includes a plurality of signal receiving antenna structures respectively carried by the second antenna carrier blocks. The dummy antenna group includes a plurality of first dummy antenna structures respectively carried by the third antenna carrier blocks, and a plurality of second dummy antenna structures respectively carried by the fourth antenna carrier blocks.Type: GrantFiled: November 26, 2021Date of Patent: June 6, 2023Assignee: Taiwan Inpaq electronic Co., Ltd.Inventors: Ta-Fu Cheng, Ting-Wei Lin, Cheng-Yi Wang
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Patent number: 11648233Abstract: The present invention is related to an active substance of Hericium erinaceus having a pain-relieving effect, and a pharmaceutical composition including the active substance. The active substance is prepared using the following steps: (a) inoculating a mycelium of H. erinaceus on an agar plate and incubating at 15-32° C. for 8-16 days; (b) inoculating the incubated H. erinaceus mycelia from step (a) into a medium in a flask and incubating at 20-30° C. and pH 4.5-6.5 for 3-5 days; (c) inoculating the incubated H. erinaceus mycelia from step (b) into a medium in a fermentation tank and incubating at 24-32° C. and pH 4.5-5.5 for 8-16 days to obtain a fermented medium of the H. erinaceus mycelia; and (d) desiccating the fermented medium of the H. erinaceus mycelia from step (c) to obtain the powder of the H. erinaceus mycelia, which is further purified and isolated to obtain a novel compound of H. erinaceus.Type: GrantFiled: November 5, 2019Date of Patent: May 16, 2023Assignee: GRAPE KING BIO LTD.Inventors: Pei-Shan Liu, Chien-Chih Chen, Chin-Chu Chen, Li-Ya Lee, Wan-Ping Chen, Ting-Wei Lin, Jui-Hsia Hsu, Wei-Ching Chu
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Publication number: 20230116495Abstract: A dual-band patch array antenna module and an electronic device using the same are provided. The dual-band patch array antenna module includes an insulative carrier substrate, a common conductive metal layer, a common grounding metal layer, an outer surrounding shielding structure, a plurality of first band antenna structures, and a plurality of second band antenna structures. The common conductive metal layer is disposed inside the insulative carrier substrate. The common grounding metal layer is disposed on the insulative carrier substrate. The outer surrounding shielding structure is electrically connected between the common conductive metal layer and the common grounding metal layer. Each first band antenna structure includes a first radiator, two first metal elements, two first feeding elements, and two first inner surrounding shielding assemblies.Type: ApplicationFiled: January 4, 2022Publication date: April 13, 2023Inventors: Ta-Fu Cheng, Cheng-Yi Wang, Ting-Wei Lin
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Publication number: 20230031712Abstract: A movable device and a block-type millimeter wave array antenna module thereof are provided. The block-type millimeter wave array antenna module includes an antenna carrying substrate, an antenna signal transmitting group, an antenna signal receiving group, and a dummy antenna group. The antenna carrying substrate includes a plurality of block-shaped carrier bodies that are divided into a plurality of first, second, third, and fourth antenna carrier blocks. The antenna signal transmitting group includes a plurality of signal transmitting antenna structures respectively carried by the first antenna carrier blocks. The antenna signal receiving group includes a plurality of signal receiving antenna structures respectively carried by the second antenna carrier blocks. The dummy antenna group includes a plurality of first dummy antenna structures respectively carried by the third antenna carrier blocks, and a plurality of second dummy antenna structures respectively carried by the fourth antenna carrier blocks.Type: ApplicationFiled: November 26, 2021Publication date: February 2, 2023Inventors: Ta-Fu Cheng, Ting-Wei Lin, Cheng-Yi Wang
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Publication number: 20220306792Abstract: Provided are graft copolymers, methods of making graft copolymers, polymer blends made from graft copolymers, methods of making polymer blends, and articles made from graft copolymers and blends thereof. The graft copolymers may be made from ethylene and isotactic polypropylene. The polymer blends may be made from semi-crystalline polyethylene, polypropylene, and a graft copolymer of the present disclosure.Type: ApplicationFiled: September 14, 2020Publication date: September 29, 2022Inventors: Geoffrey W. Coates, Anne M. Lapointe, Kristine Klimovica, Ting-Wei Lin, James M. Eagan
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Publication number: 20220193733Abstract: A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.Type: ApplicationFiled: March 10, 2022Publication date: June 23, 2022Applicant: Alliance Material Co., Ltd.Inventors: Chun-Fa Chen, Chi-Hua Huang, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin, Chin-Kai Lin, Chen-Ju Lee