Abstract: A curved display panel includes a first substrate and a second substrate that are opposite to each other, a liquid crystal layer disposed in a gap between the first substrate and the second substrate, wherein the first substrate is provided with spacers for supporting the first substrate and the second substrate to form the gap, and arrangement densities of the spacers are gradually reduced from the center of the curved display panel to either side of non-curved edges of the curved display panel.

Abstract: A light source module includes a lighting structure, a light diffusing layer, a wavelength converting layer, and a cover plate. The lighting structure includes a plurality of light emitting elements that are all blue-light emitting elements. The light diffusing layer is disposed on the lighting structure, the wavelength converting layer is disposed on the light diffusing layer, and the cover plate is disposed on the wavelength converting layer.

Abstract: A light-emitting device includes a light-emitting structure with a side surface, and a reflective layer covering the side surface. The light-emitting structure has a first light-emitting angle and a second light-emitting angle. The difference between the first light-emitting angle and the second light-emitting angle is larger than 15°.

Abstract: A detector module is provided. The detector module may include a plurality of detector sub-modules. Each of the plurality of detector sub-modules may include a detection layer, at least one data acquisition circuitry, a frame for supporting the detection layer, and a positioning element for assembling the plurality of detector sub-modules. The frame may include a plurality of heat transfer fins that are thermally connected with the at least one data acquisition circuitry for dissipating heat produced by the at least one data acquisition circuitry.

Abstract: A curved display panel includes a first substrate and a second substrate that are opposite to each other, a liquid crystal layer disposed in a gap between the first substrate and the second substrate, wherein the first substrate is provided with spacers for supporting the first substrate and the second substrate to form the gap, and arrangement densities of the spacers are gradually reduced from the center of the curved display panel to either side of non-curved edges of the curved display panel.

Abstract: A light-emitting device includes a light-emitting structure with a side surface, and a reflective layer covering the side surface, and a light-transmitting body. The light-transmitting body encloses the light-emitting structure and has a first side surface, a second side surface, a third side surface and a fourth side surface. The reflective layer covers the first side surface and the third side surface without covering the second side surface and the fourth side surface. The light-emitting structure has a first light-emitting angle and a second light-emitting angle different from the first light-emitting angle.

Abstract: A headlamp module comprises a connecting base, a substrate, and at least two edge-type light emitting diode (LED) units. The at least two edge-type LED units are mounted to opposite surfaces of the substrate facing away from each other. Each edge-type LED unit comprises an LED chip, a wavelength converting layer, and a light reflecting layer. The LED chip comprises a bottom surface, a light emitting surface facing away from the bottom surface, and first sidewalls. The wavelength converting layer covers the light emitting surface and the first sidewalls. The wavelength converting layer converts emitted light to a desired range of wavelengths. The light reflecting layer reflects the converted light toward the second sidewalls, thus expanding the angle and brightness of light around the headlamp module and avoiding an unlit or dark area immediately around the headlamp module.

Abstract: The present disclosure provides a collimator. The collimator includes a slice module, a filter module, and a support and protection module. The slice module and the filter module are detachably connected with the support and protection module. The rays strike on the collimator and pass through the slice module and the filter module in order. The slice module is configured to adjust the fan-beam width of the rays striking on the collimator. The filter module is configured to make the rays pass through different filters to implement different types of scanning.

Abstract: The present invention provides a semiconductor light-emitting module and a semiconductor LED chip thereof. The semiconductor LED chip includes a semiconductor light-emitting structure, a light-guiding structure layer, and a light-reflecting structure layer. The semiconductor light-emitting structure includes a light-emitting layer for generating a projection light source. The light-guiding structure layer is connected to the semiconductor light-emitting structure. The light-reflecting structure layer is connected to the light-guiding structure layer. The projection light source generated by the light-emitting layer is projected into the light-guiding structure layer and onto the light-reflecting structure layer. The projection light source is guided and reflected by matching the light-guiding structure layer and the light-reflecting structure layer to form a wide-angle light source that is projected outwardly from an outer surface of the light-guiding structure layer.

Abstract: A light emitting device includes a light emitting chip, a reflecting cup arranged on a side of the light emitting chip, and a package encapsulating the light emitting chip and the reflecting cup. The light emitting chip includes a first light emitting surface and a second light emitting surface coupled to the first light emitting surface. The reflecting cup has an inner surface facing the second light emitting surface of the light emitting chip. The reflecting cup arranges around a periphery of the second light emitting surface. The inner surface of the reflecting cup is a multifocal paraboloid. The multifocal paraboloid includes multistage paraboloids. The corresponding focus points of the multistage paraboloids are symmetrically distributed on the first light emitting surface of the light emitting chip.

Abstract: The present invention provides a light-emitting diode (LED) package structure and the method for manufacturing the same. First, a ceramic substrate is provided. Then, an ultraviolet (UV) LED chip, a light-guiding layer, and a metal reflective layer are disposed on the substrate sequentially. By means of the metal reflective layer, the emission light of the UV LED from the light-emitting side is reflected laterally and thus making the UV LED package structure output a plane light source.

Abstract: A light source module includes a light guide plate, a reflecting film, and a plurality of edge-type light emitting diode (LED) units. Grooves are defined in a lower surface of the light guide plate. The reflecting film is below the lower surface and covers the entire lower surface and the grooves. An air gap is defined between the reflecting film and the lower surface. The edge-type LED units are located in the grooves. Each edge-type LED unit includes an LED chip, a wavelength converting layer, and a light reflecting layer. Light emitted is converted by the wavelength converting layer, reflected towards sidewalls of the wavelength converting layer, and transmitted to the lower surface. The reflecting film reflects light that enters the air gap towards an upper surface of the light guide plate, enabling uniform emission of light from the upper surface.

Abstract: An illumination device includes at least one semiconductor light emitting element, a supporting base, and a lamp housing. The semiconductor light emitting element is disposed on the supporting base. The lamp housing is disposed on the supporting base to cover the semiconductor light emitting element, and includes a first illuminating part and a lateral illuminating part surrounding the first illuminating part. A micro-structure is formed on a side of the first illuminating part and facing the semiconductor light emitting element for reflecting the light emitted from the semiconductor light emitting element.

Abstract: A headlamp module comprises a connecting base, a substrate, and at least two edge-type light emitting diode (LED) units. The at least two edge-type LED units are mounted to opposite surfaces of the substrate facing away from each other. Each edge-type LED unit comprises an LED chip, a wavelength converting layer, and a light reflecting layer. The LED chip comprises a bottom surface, a light emitting surface facing away from the bottom surface, and first sidewalls. The wavelength converting layer covers the light emitting surface and the first sidewalls. The wavelength converting layer converts emitted light to a desired range of wavelengths. The light reflecting layer reflects the converted light toward the second sidewalls, thus expanding the angle and brightness of light around the headlamp module and avoiding an unlit or dark area immediately around the headlamp module.

Abstract: A light emitting diode assembly structure includes a light emitting chip, a color converting layer, a light guiding member, and a reflecting member. The color converting layer coats the light emitting chip and the light guiding member coats the color converting layer. The planar or non-planar reflecting member is arranged over the light guiding member. The reflecting member is faced towards the light emitting chip and changes the range of illumination of the light emitted by the light emitting chip. The reflecting member can be arranged on a side of the color converting layer and light can be irradiated towards the exterior of the light emitting diode assembly structure.

Abstract: A light source module includes a light guide plate, a reflecting film, and a plurality of edge-type light emitting diode (LED) units. Grooves are defined in a lower surface of the light guide plate. The reflecting film is below the lower surface and covers the entire lower surface and the grooves. An air gap is defined between the reflecting film and the lower surface. The edge-type LED units are located in the grooves. Each edge-type LED unit includes an LED chip, a wavelength converting layer, and a light reflecting layer. Light emitted is converted by the wavelength converting layer, reflected towards sidewalls of the wavelength converting layer, and transmitted to the lower surface. The reflecting film reflects light that enters the air gap towards an upper surface of the light guide plate, enabling uniform emission of light from the upper surface.

Abstract: A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base.

Abstract: A light emitting device includes a side-emitting assembly, a reflecting cup arranged on a side of the side-emitting assembly, and a package for accommodating the side-emitting assembly and the reflecting cup. The side-emitting assembly with a side surface includes a light emitting chip, a wavelength conversion layer coated on the light emitting chip, and a reflecting layer arranged above the wavelength conversion layer. The reflecting cup has an inner surface facing the side surface of the side-emitting assembly. The inner surface of the reflecting cup is a multifocal paraboloid. The multifocal paraboloid includes multistage paraboloids. The corresponding focal points of the multistage paraboloids are symmetrically distributed on the side surface of the side-emitting assembly.

Abstract: A light-emitting device includes a light-emitting structure with a side surface, and a reflective layer covering the side surface. The light-emitting structure has a first light-emitting angle and a second light-emitting angle. The difference between the first light-emitting angle and the second light-emitting angle is larger than 15°.