Abstract: Provided are a package structure having stacked semiconductor dies with wavy sidewalls and a method of forming the same. The package structure includes: a first die and a second die bonded together; a first encapsulant laterally encapsulating the first die; and a second encapsulant laterally encapsulating the second die, wherein a second interface of the second die in contact with the second encapsulant is a wavy interface in a cross-sectional plane.

Abstract: A device includes first and second gate structures respectively extending across the first and second fins, and a gate isolation plug between a longitudinal end of the first gate structure and a longitudinal end of the second gate structure. The gate isolation plug comprises a first dielectric layer and a second dielectric layer over the first dielectric layer. The first dielectric layer has an upper portion and a lower portion below the upper portion. The upper portion has a thickness smaller than a thickness of the lower portion of the first dielectric layer.

Abstract: An integrated circuit package including integrated circuit dies with slanted sidewalls and a method of forming are provided. The integrated circuit package may include a first integrated circuit die, a first gap-fill dielectric layer around the first integrated circuit die, a second integrated circuit die underneath the first integrated circuit die, and a second gap-fill dielectric layer around the second integrated circuit die. The first integrated circuit die may include a first substrate, wherein a first angle is between a first sidewall of the first substrate and a bottom surface of the first substrate, and a first interconnect structure on the bottom surface of the first substrate, wherein a second angle is between a first sidewall of the first interconnect structure and the bottom surface of the first substrate. The first angle may be larger than the second angle.

Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.

Abstract: A Quality of Experience (QoE) optimization system and method are provided. An electronic device inputs key performance indicators (KPIs) and system control parameters collected from a core network, a base station and a user equipment (UE) into a QoE optimization model. The QoE optimization model then optimizes the system control parameters based on the KPIs and a user QoE fed back from the UE to output optimized system control parameters. Furthermore, a strategy emulator controls at least one of a base station emulator and a UE emulator, so as to emulate the QoE optimization model using the at least one of the base station emulator and the UE emulator. Non-real-time optimization adjustments to the QoE optimization model are made based on the result of the emulation performed by the at least one of the base station emulator and the UE emulator.

Abstract: A method for fault diagnosis in a communication network is to be implemented by a processor. The method includes obtaining key performance indicator (KPI) data related to the communication network, performing a deep-learning-based classification algorithm by using the KPI data as input to a deep neural network model, and determining, based on output of the deep neural network model after performing the deep-learning-based classification algorithm, at least one type of network condition the communication network currently satisfies, and a severity level of the at least one type of network condition when the output of the deep neural network model contains information related to severity levels of the at least one type of network condition.

Abstract: A Quality of Experience (QoE) optimization system and method are provided. An electronic device inputs key performance indicators (KPIs) and system control parameters collected from a core network, a base station and a user equipment (UE) into a QoE optimization model. The QoE optimization model then optimizes the system control parameters based on the KPIs and a user QoE fed back from the UE to output optimized system control parameters. Furthermore, a strategy emulator controls at least one of a base station emulator and a UE emulator, so as to emulate the QoE optimization model using the at least one of the base station emulator and the UE emulator. Non-real-time optimization adjustments to the QoE optimization model are made based on the result of the emulation performed by the at least one of the base station emulator and the UE emulator.