Patents by Inventor Tingyu He

Tingyu He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soft touch clamp actuation mechanism
    Patent number: 7532428
    Abstract: A clamping mechanism having clamping jaws is provided for holding an object. The clamping mechanism comprises a solenoid pad connected to at least one of the clamping jaws which is operative to actuate movement of the clamping jaw, and a solenoid motor that is operative to attract the solenoid pad towards it when it is energized. Further, a voice coil motor is rigidly coupled to the solenoid pad to drive the solenoid pad in directions towards or away from the solenoid motor.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: May 12, 2009
    Assignee: ASM Technology Singapore Pte Ltd.
    Inventors: Ka Shing Kenny Kwan, Tingyu He
  • SOFT TOUCH CLAMP ACTUATION MECHANISM
    Publication number: 20080174132
    Abstract: A clamping mechanism having clamping jaws is provided for holding an object. The clamping mechanism comprises a solenoid pad connected to at least one of the clamping jaws which is operative to actuate movement of the clamping jaw, and a solenoid motor that is operative to attract the solenoid pad towards it when it is energized. Further, a voice coil motor is rigidly coupled to the solenoid pad to drive the solenoid pad in directions towards or away from the solenoid motor.
    Type: Application
    Filed: January 19, 2007
    Publication date: July 24, 2008
    Inventors: Ka Shing Kenny KWAN, Tingyu HE
  • Stud bumping apparatus
    Patent number: 7303109
    Abstract: The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas supply for supplying an inert gas into the chamber system. A support table is provided for supporting the semiconductor devices during bumping, and the said support table is operative to move the semiconductor devices from a bumping site into the chamber system after bumping.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: December 4, 2007
    Assignee: ASM Technology Singapore Pte Ltd.
    Inventors: Ka Shing Kwan, Guoshen Hu, Tingyu He, Yie Mi, Yam Mo Wong
  • Stud bumping apparatus
    Publication number: 20050001018
    Abstract: The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas supply for supplying an inert gas into the chamber system. A support table is provided for supporting the semiconductor devices during bumping, and the said support table is operative to move the semiconductor devices from a bumping site into the chamber system after bumping.
    Type: Application
    Filed: July 1, 2003
    Publication date: January 6, 2005
    Inventors: Ka Kwan, Guoshen Hu, Tingyu He, Yie Mi, Yam Wong