Patents by Inventor Ting-Yuan Lin

Ting-Yuan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200378689
    Abstract: A heat pipe, a heat pipe assembly and a method for assembling the heat pipe assembly. The heat pipe includes a main body part and an insertion part. The insertion part is connected to the main body part. The main body part and the insertion part together form a single hollow pipe. The insertion part has an outer surface and at least one recessed part formed on the outer surface.
    Type: Application
    Filed: August 13, 2019
    Publication date: December 3, 2020
    Inventors: Chi-Zen PENG, Chia-Chen CHEN, Ting-Yuan LIN
  • Patent number: 10775842
    Abstract: A portable electronic device including host body, display body, hinge and heat pipe assembly. The host body includes base and heat source disposed on base. Side of positioning structure is connected to first fixed part. First fixed part is fixed to base. Second fixed part is fixed to metal casing. Heat pipe assembly includes first heat pipe and second heat pipe. End part of first heat pipe has insertion hole. End part of second heat pipe is pivotally inserted into insertion hole of end part of first heat pipe. Another end part of first heat pipe is in thermal contact with heat source. Another end part of second heat pipe is in thermal contact with metal casing. Another side of positioning structure is fixed to end part of first heat pipe so as to keep pivot part and end part of first heat pipe coaxial.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: September 15, 2020
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Chi-Zen Peng, Chia-Chen Chen, Ting-Yuan Lin
  • Patent number: 10694621
    Abstract: An image capturing assembly including a composite circuit board, an image capturing component and a first audio component. The composite circuit board includes a hard board part and a first flexible board part that are directly connected to each other. The image capturing component is disposed on and electrically connected to the hard board part. The first audio component is disposed on and electrically connected to the first flexible board part.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: June 23, 2020
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Chi-Zen Peng, Chia-Chen Chen, Pin-Chang Chu, Ting-Yuan Lin