Abstract: The present invention relates to a method and a device for lifting a load, wherein at least one aerial drone carries at least a portion of the load. In order to lift a load, it is proposed to yoke together a plurality of aerial drones or at least one aerial drone and a lifting hook of a crane, and provide a common control system for the plurality of aerial drones or the at least one aerial drone and the lifting hook of the crane, in order not to have to control a plurality of aerial drones at the same time, or also an aerial drone in addition to the crane hook, using separate control means, in a “multi-handed” manner.

Abstract: The present invention relates to component, in particular a top plate (2) for a gas hob (1) and/or a burner cap (6a, 6b) of a gas burner (5a, 5b) for a gas hob (1), having a non-stick and/or non-wetting coating (12) obtainable by a process characterised by the following steps, a) providing a component, in particular a top plate (2) and/or a burner cap (6a, 6b), having an upper surface (7a) and a bottom surface (11b), b) preferably, pretreating of at least the upper surface of the component, in particular the top plate or the burner cap, for providing a surface having a roughness being suitable for applying a non-stick and/or non-wetting coating, by mechanical treatment, physical treatment or chemical treatment, in particular by sand-blasting and/or laser treatment and/or a surface activation treatment, particularly a plasma treatment, and/or an enameling process to form a ground layer (13), thus applying an enamel layer onto the upper surface of the component, in particular the top plate or the burner cap, c)

Abstract: A half bridge power module (1) comprising a substrate (2) comprising an inner load track (11), two intermediate load tracks (12, 14) and two outer load tracks (10,13), wherein an external terminal is mounted on one of the intermediate load tracks (12, 14), an external terminal (3, 4) is mounted on one of the outer load tracks (10, 13) and an external terminal (5) is mounted on the inner load track (11); wherein semiconductor switches (101, 12, 105, 106) are mounted on the outer load tracks (10, 13) and are electrically connected to the intermediate load track (12); and semiconductor switches (103, 104, 107, 108) are mounted on the intermediate load tracks (12, 14) and are electrically connected to the inner load track (11).

Abstract: The present invention relates to a baking tray (20) or baking grid, in particular a baking tray (20) for a cooking appliance (1), having a non-stick and/or non-wetting coating (12) obtainable by a process characterised by the following steps, a) providing a baking tray (20) or baking grid having a surface, in particular having an upper surface (7a) and a bottom surface (7b), b) preferably, pretreating of the surface (7a, 7b) of the baking tray (20) or baking grid at least partially, in particular completely, for providing a surface having a roughness being suitable for applying a non-stick and/or non-wetting coating (12) by mechanical treatment, physical treatment or chemical treatment, in particular by sandblasting and/or laser treatment and/or a surface activation treatment, particularly a plasma treatment, and/or an enamelling process to form a ground layer (13), c) applying the non-stick and/or non-wetting coating (12) to the pretreated surface (7a, 7b) of the baking tray (20) or baking grid or a surface

Abstract: A half bridge power module (1) comprising a substrate (2) comprising an inner load track (11), two intermediate load tracks (12, 14) and two outer load tracks (10,13), wherein an external terminal is mounted on one of the intermediate load tracks (12, 14), an external terminal (3, 4) is mounted on one of the outer load tracks (10, 13) and an external terminal (5) is mounted on the inner load track (11); wherein semiconductor switches (101, 12, 105, 106) are mounted on the outer load tracks (10, 13) and are electrically connected to the intermediate load track (12); and semiconductor switches (103, 104, 107, 108) are mounted on the intermediate load tracks (12, 14) and are electrically connected to the inner load track (11).

Abstract: A power module (1) providing a half bridge, the power module including: at least one substrate (2) including an inner load track (3), two intermediate load tracks (4) and two outer load tracks (5), each of which load tracks is elongated and extends substantially across the at least one substrate (2) in a first direction (6); wherein the two intermediate load tracks (4) are arranged adjacent to the inner load track (3), and each outer load track (5) is arranged on the opposite side of one of the two intermediate load tracks (4) with respect to a second direction (7) substantially orthogonal to the first direction (6).

Abstract: A half bridge power module (1) comprising a substrate (2) comprising an inner load track (11), two intermediate load tracks (12, 14) and two outer load tracks (10,13), wherein an external terminal is mounted on one of the intermediate load tracks (12, 14), an external terminal (3, 4) is mounted on one of the outer load tracks (10, 13) and an external terminal (5) is mounted on the inner load track (11); wherein semiconductor switches (101, 12, 105, 106) are mounted on the outer load tracks (10, 13) and are electrically connected to the intermediate load track (12); and semiconductor switches (103, 104, 107, 108) are mounted on the intermediate load tracks (12, 14) and are electrically connected to the inner load track (11).

Abstract: A feedthrough includes a first printed circuit board, a first flexible conductive element coupled to and extending from an edge of the first printed circuit board, a second printed circuit board, and a second flexible conductive element coupled to and extending from an edge of the second printed circuit board.

Abstract: A shielded direct current link (“DC link”) busbar includes a central planar element that includes a first surface and a second surface axially opposed to the first surface. The shielded DC link busbar further includes a first conductive lamina disposed over the first surface and a second conductive lamina disposed over the second surface. Further, the first conductive lamina and the second conductive lamina are electrically coupled.

Abstract: An electronic module is presented. The electronic module includes one or more electronic devices and a first bus electrically coupled to at least one of the one or more electronic devices. The first bus includes a first electrically conductive plate, a second electrically conductive plate, and a first electrically insulating plate disposed between the first electrically conductive plate and the second electrically conductive plate, where in a first portion of the first bus, the first electrically insulating plate is disposed such that the first electrically insulating plate is not in direct physical contact with at least one of the first electrically conductive plate and the second electrically conductive plate to form at least one cavity between the first electrically insulating plate and at least one of the first electrically conductive plate and the second electrically conductive plate. An electronic module assembly having low loop inductance is also presented.

Abstract: A feedthrough includes a first printed circuit board, a first flexible conductive element coupled to and extending from an edge of the first printed circuit board, a second printed circuit board, and a second flexible conductive element coupled to and extending from an edge of the second printed circuit board.

Abstract: A shielded direct current link (“DC link”) busbar includes a central planar element that includes a first surface and a second surface axially opposed to the first surface. The shielded DC link busbar further includes a first conductive lamina disposed over the first surface and a second conductive lamina disposed over the second surface. Further, the first conductive lamina and the second conductive lamina are electrically coupled.

Abstract: An electronic module is presented. The electronic module includes one or more electronic devices and a first bus electrically coupled to at least one of the one or more electronic devices. The first bus includes a first electrically conductive plate, a second electrically conductive plate, and a first electrically insulating plate disposed between the first electrically conductive plate and the second electrically conductive plate, where in a first portion of the first bus, the first electrically insulating plate is disposed such that the first electrically insulating plate is not in direct physical contact with at least one of the first electrically conductive plate and the second electrically conductive plate to form at least one cavity between the first electrically insulating plate and at least one of the first electrically conductive plate and the second electrically conductive plate. An electronic module assembly having low loop inductance is also presented.

Abstract: There are provided methods and systems for operating insulated gate bipolar transistors (IGBTs). For example, there is provided a method that can include detecting a desaturation condition in an IGBT and initiating a turn off procedure when desaturation is detected. The turn off procedure can include holding a gate of the IGBT at at least one voltage level intermediate between a positive rail voltage and a negative rail voltage of an operational range of the IGBT.

Abstract: Embodiments presented herein are directed to a system comprising, a semiconductor device including a semiconductor junction, an optical fiber, a proximal end of said optical fiber in electromagnetic communication with said semiconductor junction, and a processing unit in electromagnetic communication with a distal end of said optical fiber, said processing unit capable of receiving electromagnetic information available at said distal end and processing the electromagnetic information.