Patents by Inventor Toby Woodbridge

Toby Woodbridge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging for fused fiber devices for high power applications
    Patent number: 8317413
    Abstract: A packaged fused-fiber device includes a fused-fiber device having at least one input fiber and at least one output fiber, and a fused portion between the input fiber and output fiber. A concave shaped substrate has an inside surface and an outside surface, wherein a minimum distance from the inside surface to the outside surface that is generally set by the substrate thickness is substantially constant throughout the substrate. An affixment material secures the first and second ends of the fused portion to the inside surface of the substrate. A thermally conductive housing is in thermal contact with the outside surface of the substrate. In one embodiment the substrate has an L-shaped cross section and the housing is a hollow housing that has a rectangular cross section.
    Type: Grant
    Filed: November 25, 2008
    Date of Patent: November 27, 2012
    Assignee: Gooch and Hoosego PLC
    Inventors: Norman Edward Fisher, Toby Woodbridge, Andrew Richard Rider
  • PACKAGING FOR FUSED FIBER DEVICES FOR HIGH POWER APPLICATIONS
    Publication number: 20100129042
    Abstract: A packaged fused-fiber device includes a fused-fiber device having at least one input fiber and at least one output fiber, and a fused portion between the input fiber and output fiber. A concave shaped substrate has an inside surface and an outside surface, wherein a minimum distance from the inside surface to the outside surface that is generally set by the substrate thickness is substantially constant throughout the substrate. An affixment material secures the first and second ends of the fused portion to the inside surface of the substrate. A thermally conductive housing is in thermal contact with the outside surface of the substrate. In one embodiment the substrate has an L-shaped cross section and the housing is a hollow housing that has a rectangular cross section.
    Type: Application
    Filed: November 25, 2008
    Publication date: May 27, 2010
    Inventors: Norman Edward Fisher, Toby Woodbridge, Andrew Richard Rider