Patents by Inventor Todd Eckhardt
Todd Eckhardt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240085257Abstract: A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Inventors: Vishal Shalitkumar KUSANALE, Todd ECKHARDT, Palani THANIGACHALAM, Vignesh MURUGESAN
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Patent number: 11860055Abstract: A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.Type: GrantFiled: August 31, 2022Date of Patent: January 2, 2024Assignee: Honeywell International Inc.Inventors: Vishal Shalitkumar Kusanale, Todd Eckhardt, Palani Thanigachalam, Vignesh Murugesan
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Publication number: 20220412826Abstract: A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.Type: ApplicationFiled: August 31, 2022Publication date: December 29, 2022Inventors: Vishal Shalitkumar KUSANALE, Todd ECKHARDT, Palani THANIGACHALAM, Vignesh MURUGESAN
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Patent number: 11460363Abstract: A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.Type: GrantFiled: March 20, 2020Date of Patent: October 4, 2022Assignee: HONEYWELL INTERNATIONAL INC.Inventors: Vishal Shalitkumar Kusanale, Todd Eckhardt, Palani Thanigachalam, Vignesh Murugesan
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Patent number: 11085837Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.Type: GrantFiled: August 20, 2019Date of Patent: August 10, 2021Assignee: HONEYWELL INTERNATIONAL INC.Inventors: Jason Dennis Patch, Todd Eckhardt, Jim Machir, Richard Wade, Jim Cook
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Publication number: 20200326252Abstract: A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.Type: ApplicationFiled: March 20, 2020Publication date: October 15, 2020Inventors: Vishal Shalitkumar KUSANALE, Todd ECKHARDT, Palani THANIGACHALAM, Vignesh MURUGESAN
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Publication number: 20200003637Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.Type: ApplicationFiled: August 20, 2019Publication date: January 2, 2020Applicant: Honeywell International Inc.Inventors: Jason Dennis Patch, Todd Eckhardt, Jim Machir, Richard Wade, Jim Cook
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Patent number: 10444090Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.Type: GrantFiled: May 15, 2017Date of Patent: October 15, 2019Assignee: Honeywell International Inc.Inventors: Jason Dennis Patch, Todd Eckhardt, Jim Machir, Richard Wade, Jim Cook
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Publication number: 20190150754Abstract: A circulatory system monitor may include a sensor array having a plurality of sensor assemblies and a controller in communication with the sensor array. The sensor array may be configured to be pressed against a patient's body and the controller may identify a sensor assembly of the plurality of sensor assemblies from which a signal is to be used to determine a circulatory system parameter of the patient's body. The controller may use a signal from the identified sensor assembly to determine the circulatory system parameter. The circulatory system monitor may include an inflatable member and a pump. The configuration of the sensor array and the inflatable member may facilitate ensuring alignment of at last one sensor assembly of the sensor array with a target artery to be monitored.Type: ApplicationFiled: November 17, 2017Publication date: May 23, 2019Inventors: Dinesh Naik, Vishal Shalitkumar Kusanale, Ramkrishna Uchanski Pal, Palani Thanigachalam, Todd Eckhardt
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Patent number: 10247632Abstract: A pressure sensor can include a housing having a sense side cavity formed on a first side of the housing; a sense side diaphragm attached to the first side and over the sense side cavity, a sense die assembly placed in the cavity and attached to the housing; a reference side cavity formed in the housing, a reference side diaphragm attached to a second side of the housing and over the reference side cavity, and pin(s) electrically connected to the sense die assembly and extending outside the housing from the second side. The cavities are filled with oil. Manufacturing the pressure sensor can include mounting the sense die assembly onto the housing, attaching the sense side diaphragm to the first side of the housing, filling the cavities with oil, and attaching the reference side diaphragm on the second side of the housing and over the reference side cavity.Type: GrantFiled: June 23, 2016Date of Patent: April 2, 2019Assignee: Honeywell InternationalInventors: Ryan Jones, Alistair David Bradley, Todd Eckhardt
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Patent number: 10215655Abstract: A pressure sensor assembly having a sensor unit, a pressure port, and an electrical connector. The sensor unit may include a printed circuit board (PCB), a pressure sensor, a support, and a media isolation layer. The PCB may have a first side and an opposite second side, where the pressure sensor may be secured to the first side. The support may also be secured to the first side of the PCB and may circumferentially surround the pressure sensor and/or may define a media sensing opening. The media isolation layer (e.g., a gel or other material) may be provided in the media sensing opening and encase the pressure sensor, where the media isolation layer may transfer a pressure provided by the media in the pressure port to the pressure sensor and may act as a barrier between the media and the pressure sensor.Type: GrantFiled: December 31, 2015Date of Patent: February 26, 2019Assignee: Honeywell International Inc.Inventors: Todd Eckhardt, Lamar Floyd Ricks
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Patent number: 10197465Abstract: Systems and methods for sensing pressure, and protecting a sensor within a sensor assembly. A sensor assembly may comprise a sensor having at least one pressure input port; a first housing configured to encapsulate the sensor; a second housing configured to attach to the first housing to encapsulate the sensor; a first O-ring located between the first housing and the sensor; a second O-ring located between the second housing and the sensor; and a printed circuit board configured to receive detected pressure information from the sensor.Type: GrantFiled: January 12, 2017Date of Patent: February 5, 2019Assignee: Honeywell International Inc.Inventors: Jason Dennis Patch, Ian Bentley, Jim Cook, Todd Eckhardt
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Publication number: 20180328800Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.Type: ApplicationFiled: May 15, 2017Publication date: November 15, 2018Inventors: Jason Dennis Patch, Todd Eckhardt, Jim Machir, Richard Wade, Jim Cook
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Patent number: 10094726Abstract: Embodiments generally relate to assembly and methods for detecting force. A force sensor assembly may comprise a sense element, an isolation medium, a thin membrane, and a substrate. Typically, the sense element may be located adjacent to the substrate, the isolation medium may be located adjacent to the sense element, and the thin membrane may be located adjacent to the isolation medium. Generally, the thin membrane may be configured to provide a shield between an external medium and the isolation medium and transfer a force from the external medium to the isolation medium. In this manner, the isolation medium may be configured to transfer the detected force to the sense element. The sense element may electrically communicate the force data as output signals to the electrical traces on the substrate.Type: GrantFiled: February 1, 2017Date of Patent: October 9, 2018Assignee: Honeywell International Inc.Inventors: Todd Eckhardt, Jim Machir, Ron Myers
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Publication number: 20180217018Abstract: Embodiments generally relate to assembly and methods for detecting force. A force sensor assembly may comprise a sense element, an isolation medium, a thin membrane, and a substrate. Typically, the sense element may be located adjacent to the substrate, the isolation medium may be located adjacent to the sense element, and the thin membrane may be located adjacent to the isolation medium. Generally, the thin membrane may be configured to provide a shield between an external medium and the isolation medium and transfer a force from the external medium to the isolation medium. In this manner, the isolation medium may be configured to transfer the detected force to the sense element. The sense element may electrically communicate the force data as output signals to the electrical traces on the substrate.Type: ApplicationFiled: February 1, 2017Publication date: August 2, 2018Inventors: Todd Eckhardt, Jim Machir, Ron Myers
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Publication number: 20180195924Abstract: Systems and methods for sensing pressure, and protecting a sensor within a sensor assembly. A sensor assembly may comprise a sensor having at least one pressure input port; a first housing configured to encapsulate the sensor; a second housing configured to attach to the first housing to encapsulate the sensor; a first O-ring located between the first housing and the sensor; a second O-ring located between the second housing and the sensor; and a printed circuit board configured to receive detected pressure information from the sensor.Type: ApplicationFiled: January 12, 2017Publication date: July 12, 2018Inventors: Jason Dennis Patch, Ian Bentley, Jim Cook, Todd Eckhardt
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Publication number: 20180106694Abstract: Embodiments relate generally to methods and systems for detecting pressure. A pressure sensor assembly may comprise a sensor unit having a pressure input port on one side, the sensor unit comprising a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and a media isolation layer comprising a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port, wherein the media isolation layer is configured to transfer a pressure caused by a sense media to the pressure sensor.Type: ApplicationFiled: October 13, 2016Publication date: April 19, 2018Inventors: Vishal Shalitkumar Kusanale, Palani Thanigachalam, Todd Eckhardt, Lamar Floyd Ricks, Jim Cook, Pavan R. Kashyap, Vignesh Murugesan
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Patent number: 9945747Abstract: Embodiments relate generally to methods and systems for detecting pressure. A pressure sensor assembly may comprise a sensor unit having a pressure input port on one side, the sensor unit comprising a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and a media isolation layer comprising a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port, wherein the media isolation layer is configured to transfer a pressure caused by a sense media to the pressure sensor.Type: GrantFiled: October 13, 2016Date of Patent: April 17, 2018Assignee: Honeywell International Inc.Inventors: Vishal Shalitkumar Kusanale, Palani Thanigachalam, Todd Eckhardt, Lamar Floyd Ricks, Jim Cook, Pavan R. Kashyap, Vignesh Murugesan
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Publication number: 20170370795Abstract: A pressure sensor can include a housing having a sense side cavity formed on a first side of the housing; a sense side diaphragm attached to the first side and over the sense side cavity, a sense die assembly placed in the cavity and attached to the housing; a reference side cavity formed in the housing, a reference side diaphragm attached to a second side of the housing and over the reference side cavity, and pin(s) electrically connected to the sense die assembly and extending outside the housing from the second side. The cavities are filled with oil. Manufacturing the pressure sensor can include mounting the sense die assembly onto the housing, attaching the sense side diaphragm to the first side of the housing, filling the cavities with oil, and attaching the reference side diaphragm on the second side of the housing and over the reference side cavity.Type: ApplicationFiled: June 23, 2016Publication date: December 28, 2017Inventors: Ryan Jones, Alistair David Bradley, Todd Eckhardt
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Publication number: 20170191895Abstract: A pressure sensor assembly having a sensor unit, a pressure port, and an electrical connector. The sensor unit may include a printed circuit board (PCB), a pressure sensor, a support, and a media isolation layer. The PCB may have a first side and an opposite second side, where the pressure sensor may be secured to the first side. The support may also be secured to the first side of the PCB and may circumferentially surround the pressure sensor and/or may define a media sensing opening. The media isolation layer (e.g., a gel or other material) may be provided in the media sensing opening and encase the pressure sensor, where the media isolation layer may transfer a pressure provided by the media in the pressure port to the pressure sensor and may act as a barrier between the media and the pressure sensor.Type: ApplicationFiled: December 31, 2015Publication date: July 6, 2017Inventors: Todd Eckhardt, Lamar Floyd Ricks