Abstract: A temperature measurement system includes a plurality of filaments. The plurality of filaments are configured to emit thermal radiation in a relatively broad and substantially continuous wavelength band at least partially representative of a temperature of the plurality of filaments. A first and second portion of the filaments has a differing first and a second diameter and/or emissivity, respectively. The system also includes a detector array configured to generate electrical signals at least partially representative of the thermal radiation received from the filaments. The system further includes a controller communicatively coupled to the detector array configured to transform the first electrical signals to a first temperature indication at least partially as a function of the first diameter and/or first emissivity and transform the second electrical signals to a second temperature indication at least partially as a function of the second diameter and/or emissivity.

Abstract: A system and method for lowering the structural natural frequency of a synthetic jet actuator is disclosed. A synthetic jet actuator is provided that includes a first plate, a second plate spaced apart from the first plate and arranged parallelly thereto, and a spacer element configured to space the first plate apart from the second plate and define a chamber along with the first and second plates. The spacer element includes at least one orifice formed therein such that the chamber is in fluid communication with an environment external to the chamber, and the spacer element is constructed to deform in a bending motion in response to a deflection of at least one of the first and second plates.

Abstract: A system and method for lowering the structural natural frequency of a synthetic jet actuator is disclosed. A synthetic jet actuator is provided that includes a first plate, a second plate spaced apart from the first plate and arranged parallelly thereto, and a spacer element configured to space the first plate apart from the second plate and define a chamber along with the first and second plates. The spacer element includes at least one orifice formed therein such that the chamber is in fluid communication with an environment external to the chamber, and the spacer element is constructed to deform in a bending motion in response to a deflection of at least one of the first and second plates.

Abstract: A component is disclosed. The component includes a substrate comprising an outer surface and an inner surface. The inner surface defines at least one hollow, interior space, and the outer surface defines one or more grooves that extend at least partially along the outer substrate surface and have a respective base. One or more access holes are formed through the base of a respective groove, to connect the groove in fluid communication with the respective hollow interior space. The component further includes a coating comprising one or more layers disposed over at least a portion of the outer substrate surface. The groove(s) and the coating together define one or more channels for cooling the component. One or more trenches are formed through one or more coating layers and at least partially define at least one exit region for the cooling channel(s). A method of fabricating a component is also provided.

Abstract: A synthetic jet assembly includes a synthetic jet having a cavity and an opening formed therein. The synthetic jet assembly also includes an actuator element coupled to a second surface of the body to selectively cause displacement of the second surface, and a control unit electrically coupled to the actuator element. The control unit is configured to transmit a multi-frequency drive signal to the actuator element, the multi-frequency drive signal comprising a cooling frequency component and an acoustic frequency component superimposed on the cooling frequency component. The cooling frequency component causes a cooling jet to eject from the opening of the body. The acoustic frequency component produces a desired audible output.

Abstract: A temperature measurement system includes at least one filament configured to emit thermal radiation in a relatively broad and substantially continuous wavelength band that is at least partially representative of a temperature of the at least one filament. The system also includes an optical system configured to receive at least a portion of the thermal radiation emitted from the filament. The optical system includes a wavelength splitting device configured to split the emitted thermal radiation into at least one relatively narrow wavelength band of thermal radiation. The optical system also includes a detector array configured to receive the at least one relatively narrow wavelength band of thermal radiation and to generate electrical signals at least partially representative of the received thermal radiation. The temperature measurement system further includes a controller communicatively coupled to the detector array.

Abstract: An article and method of forming the article is disclosed. The article includes a heat source, a substrate, and a thermal interface element having a plurality of freestanding nanosprings disposed in thermal communication with the substrate and the heat source. The nanosprings of the article include at least one inorganic material and also at least 50% of the nanosprings have a thermal conductivity of at least 1 watt/mK per nano spring.

Abstract: A locking device providing thermal management for an electrical assembly board is described and includes a fluid-permeable member saturated with a fluid and disposed between the electrical assembly board and a heat sink; a pair of locking device substrates substantially orthogonal to the electrical assembly board and the heat sink; and an actuator coupled to at least one of the locking device substrates. The fluid-permeable member is disposed between the locking device substrates. The actuator is configured to compress the fluid-permeable member by at least one of the locking device substrates forcing a portion of the fluid out of the fluid-permeable member and forming at least one fluid contact interface with the electrical assembly board and the heat sink in a reversible process. A method for making a locking device is also described.

Abstract: An outlet guide vane assembly for turbomachines is provided. The outlet guide vane assembly comprises one or more outlet guide vanes, wherein each of the one or more outlet guide vanes comprises a first surface and a second surface, and wherein the one or more outlet guide vanes are disposed between an inner wall and an outer wall of an engine and a surface cooler layer disposed on at least a portion of the first surface, the second surface, or both of the one or more outlet guide vanes, wherein the surface cooler layer comprises a metal foam, a carbon foam, or a combination thereof, wherein the metal foam, the carbon foam or the combination thereof is configured to augment heat transfer and enhance acoustic absorption.

Abstract: A component is disclosed. The component includes a substrate comprising an outer surface and an inner surface. The inner surface defines at least one hollow, interior space, and the outer surface defines one or more grooves that extend at least partially along the outer substrate surface and have a respective base. One or more access holes are formed through the base of a respective groove, to connect the groove in fluid communication with the respective hollow interior space. The component further includes a coating comprising one or more layers disposed over at least a portion of the outer substrate surface. The groove(s) and the coating together define one or more channels for cooling the component. One or more trenches are formed through one or more coating layers and at least partially define at least one exit region for the cooling channel(s). A method of fabricating a component is also provided.

Abstract: A locking device providing thermal management for an electrical assembly board is described and includes a fluid-permeable member saturated with a fluid and disposed between the electrical assembly board and a heat sink; a pair of locking device substrates substantially orthogonal to the electrical assembly board and the heat sink; and an actuator coupled to at least one of the locking device substrates. The fluid-permeable member is disposed between the locking device substrates. The actuator is configured to compress the fluid-permeable member by at least one of the locking device substrates forcing a portion of the fluid out of the fluid-permeable member and forming at least one fluid contact interface with the electrical assembly board and the heat sink in a reversible process. A method for making a locking device is also described.

Abstract: In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.

Abstract: Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.

Abstract: A system and method for lowering the structural natural frequency of a synthetic jet actuator is disclosed. A synthetic jet actuator is provided that includes a first plate, a second plate spaced apart from the first plate and arranged parallelly thereto, and a spacer element configured to space the first plate apart from the second plate and define a chamber along with the first and second plates. The spacer element includes at least one orifice formed therein such that the chamber is in fluid communication with an environment external to the chamber, and the spacer element is constructed to deform in a bending motion in response to a deflection of at least one of the first and second plates.

Abstract: A device, such as an absorption chiller sub-system, is provided. The absorption chiller sub-system can include an evaporator and an absorber. The evaporator can be configured to receive a liquid first working fluid and to produce first working fluid vapor. The absorber can be configured to receive and combine first working fluid vapor and a second working fluid, for example, so as to release thermal energy. A divider having opposing first and second sides in respective fluid communication with the evaporator and the absorber can also be included. The divider can be configured to allow first working fluid vapor to pass therethrough between the first and second sides and to inhibit movement of liquid first working fluid therethrough between the first and second sides. Associated systems and methods are also provided.

Abstract: A surface cooler for turbomachines is provided. The surface cooler comprises an inner layer and an outer layer disposed adjacent to the inner layer and comprising a metal foam, a carbon foam, or a combination thereof, wherein the metal foam, the carbon foam or a combination thereof is configured to augment heat transfer and enhance acoustic absorption. Further, the outer layer comprises a plurality of fins, wherein the plurality of fins is configured to augment heat transfer and enhance acoustic absorption, and wherein the plurality of fins comprises metal foam, a carbon foam, or a combination thereof.

Abstract: A thermal management system includes graphene paper disposed between a heat source and a heat sink to transfer heat therebetween. The graphene paper is oriented such that the individual layers are substantially perpendicular to the plane of the heat source and the plane of the heat sink to maximize heat transfer. The heat source and the heat sink can be any physical structure that emits and absorbs thermal energy, respectively. The graphene paper may be bonded to the heat source and the heat sink using a bonding agent, such as a thermally conductive material, and the like. The graphene paper may be formed in several different configurations, such as a spring structure, and the like.

Abstract: An outlet guide vane assembly for turbomachines is provided. The outlet guide vane assembly comprises one or more outlet guide vanes, wherein each of the one or more outlet guide vanes comprises a first surface and a second surface, and wherein the one or more outlet guide vanes are disposed between an inner wall and an outer wall of an engine and a surface cooler layer disposed on at least a portion of the first surface, the second surface, or both of the one or more outlet guide vanes, wherein the surface cooler layer comprises a metal foam, a carbon foam, or a combination thereof, wherein the metal foam, the carbon foam or the combination thereof is configured to augment heat transfer and enhance acoustic absorption.

Abstract: Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.

Abstract: In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.