Abstract: Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to active optical plugs used to cover optical connectors of a photonics package to protect the connectors. The active optical plugs may also be used to perform testing of the photonics package, including generating light to be sent to the photonics package and to detect light received from the photonics package as part of the test protocol. This allows testing the optical connection and the photonics package, without exposing the optical connections of the package to damage from dust or physical contact. Other embodiments may be described and/or claimed.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to incorporating photonics integrated circuitry into a base die, the base die including an optical interconnect at a bottom of the base die to transmit and to receive light signals from outside the base die. The top of the base die includes one or more electrical connectors that are electrically coupled with the photonics integrated circuitry. The base die may be referred to as the photonics die. A system-on-a-chip (SOC) may be electrically coupled with and stacked onto the top of the photonics die. Other embodiments may be described and/or claimed.

Abstract: A photonic connector comprises a first ferrule having a first plurality of optical fibers. A membrane cover is attached to the first ferrule and covers ends of the first plurality of optical fibers. Once the first ferrule is mated with a second ferrule having a second plurality of optical fibers, the membrane cover is pierced by the first plurality of optical fibers, the second plurality of optical fibers, or both.

Abstract: Embodiments of alignment fixtures for integrated circuit (IC) packages, and related techniques, are disclosed herein. In some embodiments, an alignment fixture for an IC package may include: a first socket having a recess dimensioned to receive a first surface of the IC package and having a first magnet arrangement disposed outside of the recess, wherein the IC package has a second surface opposite to the first surface and has a first electrical contact element on the second surface; and a second socket having a second electrical contact element and having a second magnet arrangement. The first and second electrical contact elements may be aligned when the IC package is disposed in the recess, the IC package is disposed between the first and second sockets, and the first magnet arrangement is in a predetermined equilibrium relation with the second magnet arrangement to mate the first and second sockets.

Abstract: Embodiments of alignment fixtures for integrated circuit (IC) packages, and related techniques, are disclosed herein. In some embodiments, an alignment fixture for an IC package may include: a first socket having a recess dimensioned to receive a first surface of the IC package and having a first magnet arrangement disposed outside of the recess, wherein the IC package has a second surface opposite to the first surface and has a first electrical contact element on the second surface; and a second socket having a second electrical contact element and having a second magnet arrangement. The first and second electrical contact elements may be aligned when the IC package is disposed in the recess, the IC package is disposed between the first and second sockets, and the first magnet arrangement is in a predetermined equilibrium relation with the second magnet arrangement to mate the first and second sockets.

Abstract: Embodiments of the present disclosure are directed towards systems and apparatuses for delivery of thermal transfer fluid to and/or from a thermal head of thermal test equipment and for driving the thermal head and associated techniques. In one embodiment, a fluid delivery assembly includes a chamber assembly having an inlet channel and outlet channel for a thermal transfer fluid, and a piston assembly having an inlet channel and outlet channel for the thermal transfer fluid, the inlet channel of the piston assembly configured to route the thermal transfer fluid from the inlet channel of the chamber assembly and the outlet channel of the piston assembly configured to route the thermal transfer fluid to the outlet channel of the chamber assembly and a thermal head coupled with the piston assembly and configured to thermally couple with a device under test (DUT). Other embodiments may be described and/or claimed.

Abstract: The diffusion opening in the cooling hole of an airfoil is formed by an EDM process in which the outwardly flaring sidewalls of the opening, rather then having surfaces that are approximated to be smooth by having many small ribs formed therein, are formed with a relatively few ribs with both longitudinally extending and radially extending surfaces that are substantially greater in dimension than those as normally formed. In this manner, the machining process is simplified and expedited, while at the same time, the cooling efficiency is increased.

Abstract: The diffusion opening in the cooling hole of an airfoil is formed by an EDM process in which the outwardly flaring sidewalls of the opening, rather then having surfaces that are approximated to be smooth by having many small ribs formed therein, are formed with relatively few ribs with both longitudinally extending and radially extending surfaces that are substantially greater in dimension than those as normally formed. In this manner, the machining process is simplified and expedited, while at the same time, the cooling efficiency is increased.

Abstract: In one embodiment, the present invention includes a universal cover to be adapted to burn-in sockets, where at least some of the burn-in sockets have different dimensions. In this way, the universal cover enables an actuator plate of an actuator system having a fixed configuration of actuation members to open and close burn-in socket covers of different form factors. Other embodiments are described and claimed.

Abstract: In one embodiment, the present invention includes a universal cover to be adapted to burn-in sockets, where at least some of the burn-in sockets have different dimensions. In this way, the universal cover enables an actuator plate of an actuator system having a fixed configuration of actuation members to open and close burn-in socket covers of different form factors. Other embodiments are described and claimed.