Abstract: A device including an enclosure that encapsulates a plurality of particles dispersed in a matrix material. The particles are formed of a material having substantial bulk thermal conductivity of at least about one watt per meter-Kelvin (1 W/[mK]) at a standardized measurement temperature of about 68° F. In the device, the enclosure is configured upon deformation to allow a portion of the matrix material to escape while retaining at least a portion of the particles within the enclosure. A system that includes an enclosure that encapsulates a plurality of such particles dispersed in a matrix material, the enclosure being located between first and second objects. In the system, the enclosure has through-pores communicating between an interior of the enclosure and an exterior of the enclosure, and at least a portion of the particles have diameters that are larger than a maximum diameter of the through-pores.

Abstract: An acoustic noise attenuator is disclosed comprising a movable body, an energy storage element and an electrical energy dissipater. The movable body is configured to oscillate when a mechanical disturbance caused by a sound wave, such as acoustic noise, is incident thereon. The oscillation of the movable body induces an alternating electrical energy in the energy storage element. The electrical energy dissipater dissipates the induced electrical energy in the form of heat. An acoustic noise attenuator assembly and a metamaterial structure comprising such acoustic noise attenuators are also disclosed.

Abstract: An apparatus and a method are provided. Use is made of a wick structure configured to receive a liquid and generate vapor in when such wick structure is heated by heat transferred from heat sources to be cooled off. A vapor channel is provided configured to receive the vapor generated and direct said vapor away from the wick structure. In some embodiments, heat conductors are used to transfer the heat from the heat sources to the liquid in the wick structure.

Abstract: A solar thermoelectric generator (STEG) is disclosed. A STEG includes a thermoelectric generator (TEG) configured to convert light energy from solar light into electrical energy, and a heat transfer structure coupled to the TEG where a portion of the heat transfer structure is configured to be embedded in the earth. The TEG includes a first side and a second side, wherein the solar light is incident on the first side of the TEG and the heat transfer structure is configured to provide cooling for the second side of the TEG using geothermal cooling. The use of geothermal cooling to provide cooling for the second side of the TEG increases the temperature difference across the TEG of the STEG, thereby increasing the net generation efficiency of the STEG.

Abstract: An apparatus comprising an integrated circuit. The integrated circuit comprises a substrate having a planar surface, a plurality of active electronic and/or optical devices located over the planar surface in the integrated circuit, and, a planar channel having a hollow interior and being located between the active electronic and/or optical devices, and the substrate. A portion of a segment of the planar channel is formed of metal or graphene.

Abstract: An apparatus and a method are provided. Use is made of a wick structure configured to receive a liquid and generate vapor in when such wick structure is heated by heat transferred from heat sources to be cooled off. A vapor channel is provided configured to receive the vapor generated and direct said vapor away from the wick structure. In some embodiments, heat conductors are used to transfer the heat from the heat sources to the liquid in the wick structure.

Abstract: A vapor-based heat transfer apparatus comprising a hollow structure and a working liquid within the hollow structure, wherein the structure is made of a thermally conductive polymer. In some embodiments the apparatus comprises a vapor chamber. In some other embodiments, the apparatus comprises a vapor chamber, heat pipe and a heat sink.

Abstract: An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.

Abstract: A solar thermoelectric generator (STEG) is disclosed. A STEG includes a thermoelectric generator (TEG) configured to convert light energy from solar light into electrical energy, and a heat transfer structure coupled to the TEG where a portion of the heat transfer structure is configured to be embedded in the earth. The TEG includes a first side and a second side, wherein the solar light is incident on the first side of the TEG and the heat transfer structure is configured to provide cooling for the second side of the TEG using geothermal cooling. The use of geothermal cooling to provide cooling for the second side of the TEG increases the temperature difference across the TEG of the STEG, thereby increasing the net generation efficiency of the STEG.

Abstract: A device comprising a casing and a motorized air-mover. The casing encloses an air-inlet duct, air-outlet duct and a cavity located between the air-inlet duct and the air-outlet duct and in air-flow communication with the air-inlet duct and the air-outlet duct. The motorized air-mover is located in the cavity, the motorized air-mover configured to move air from the air-inlet duct to the air-outlet duct, wherein there is a gap between an outer-surface of the motorized air-mover and an interior wall of casing defining the cavity.

Abstract: An apparatus, comprising a heat sink located on a surface of an electronic device, the heat sink including a plurality of metal layers wherein: at least one exterior edge of the metal layers faces the surface, the metal layers form a stack running along the surface, and the metal layers have a plurality of openings in a major surface of the metal layers, the openings configured to carry a fluid there-through.

Abstract: An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.

Abstract: An apparatus comprising a rack having one or more shelves, a plurality of electronics circuit boards and heat conduits and a cooler. Each board is held by one of the one or more shelves, some of the boards having a localized heat source thereon. Each heat conduit forms a heat conducting path over and adjacent to a particular one of the boards from a region adjacent to the heat source thereon to a connection zone, the zone being remote from the heat source. The cooler is located on a side of the rack and coupled to the zones such that heat is transferable from the paths to the cooler. The cooler is configured to flow a cooling fluid therein to cool localized thermal interfaces at the cooler, each interface being adjacent to and at a corresponding one of the zones.

Abstract: An electronics module designed to efficiently remove heat from enclosed circuit boards via one or more configurable heat conduits. Each heat conduit is custom-configured to provide good thermal contact between the corresponding heat-generating electronic device of an enclosed circuit board and the clamshell housing that encloses the circuit board. Good thermal contact between the clamshell housing and the outer case of the electronic module facilitates efficient heat transfer to the finned exterior surface of the outer case, where the heat is dissipated into the ambient environment via thermal conduction, natural convection, forced convection, and/or thermal radiation. Depending on the topology of the circuit board and the individual characteristics of the electronic device to be cooled, the corresponding configurable heat conduit might be based on a nested heat-sink coupler, a fitted movable plug, or a flexible ribbon-shaped heat pipe.

Abstract: An improved apparatus and system are provided for heat dissipation in a bank of circuit components using heat pipes and/or vapor chambers, wherein the heat pipes and/or vapor chambers efficiently transport heat away from high heat components.

Abstract: Device including enclosure, plurality of particles, and matrix material. Particles are formed of material having substantial bulk thermal conductivity of at least about one watt per meter-Kelvin (1 W/[mK]) at standardized measurement temperature of about 68° F. Particles are dispersed in matrix material and encapsulated in enclosure. Enclosure is configured, upon deformation, to allow portion of matrix material to escape while retaining at least portion of particles within enclosure. System that includes device. Method that includes providing enclosure, first object having first surface, and second object having second surface. Method also includes placing enclosure between first and second surfaces and pressing first and second surfaces together, causing enclosure to be deformed allowing portion of matrix material to escape while retaining portion of particles within enclosure.

Abstract: An improved apparatus and system are provided for heat dissipation in a bank of circuit components using heat pipes and/or vapor chambers, wherein the heat pipes and/or vapor chambers efficiently transport heat away from high heat components.

Abstract: Example embodiments include a method for monitoring an optical network. The method provides received network data to a network model, which determines if there is an inconsistency within the optical network. The network models include a statistical model and a detailed-physical model, both of which model amplifier physics.

Abstract: Wide range linear tuning of optical gratings is possible by selecting a thin film heater such that the temperature variation in heater's resistivity ? matches the temperature variation in the heat transfer coefficient of air h. A tunable optical device, such as a fiber grating with such a grating heater, exhibits near linear tuning characteristics over a wide range of temperatures and tuning currents. The heater is useable in other heat tunable optical devices such as interferometers.

Abstract: Wide range linear tuning of optical gratings is possible by selecting a thin film heater such that the temperature variation in heater's resistivity &rgr; matches the temperature variation in the heat transfer coefficient of air h. A tunable optical device, such as a fiber grating with such a grating heater, exhibits near linear tuning characteristics over a wide range of temperatures and tuning currents. The heater is useable in other heat tunable optical devices such as interferometers.