Patents by Inventor Togo MATSUI
Togo MATSUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11961672Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.Type: GrantFiled: April 13, 2023Date of Patent: April 16, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Togo Matsui
-
Publication number: 20230253152Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.Type: ApplicationFiled: April 13, 2023Publication date: August 10, 2023Inventor: Togo MATSUI
-
Patent number: 11657967Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.Type: GrantFiled: July 20, 2021Date of Patent: May 23, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Togo Matsui
-
Patent number: 11600445Abstract: A multilayer ceramic electronic component includes a multilayer body including two major surfaces opposite to each other in a layer stacking direction, two side surfaces opposite to each other in a widthwise direction orthogonal or substantially orthogonal to the layer stacking direction, and two end surfaces opposite to each other in a lengthwise direction orthogonal or substantially orthogonal to the layer stacking direction and the widthwise direction, and external electrodes provided on the two end surfaces. A method for manufacturing the multilayer ceramic capacitor component includes preparing a plurality of multilayer bodies, stacking the plurality of multilayer bodies via a binder, rotating the plurality of multilayer bodies by about 90° with the lengthwise direction defining and functioning as an axis of rotation, and providing a side gap portion; and removing the binder from the multilayer body provided with the side gap portion.Type: GrantFiled: September 10, 2020Date of Patent: March 7, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yusuke Yokota, Togo Matsui
-
Publication number: 20220093340Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrodes alternately laminated therein, and external electrodes respectively on a first end surface and a second end surface of the multilayer body in a length direction intersecting a lamination direction. The internal electrodes each include an opposing portion, a thick portion extending from the opposing portion to one of the first end surface or the second end surface and coupled to one of the external electrodes, and is thicker than the opposing portion in the lamination direction, and a thin portion extending from the opposing portion to another of the first end surface or the second end surface and uncoupled with the external electrodes, and is thinner than the opposing portion in the lamination direction.Type: ApplicationFiled: September 20, 2021Publication date: March 24, 2022Inventors: Togo MATSUI, Yukito NISHIMURA
-
Publication number: 20210350981Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.Type: ApplicationFiled: July 20, 2021Publication date: November 11, 2021Inventor: Togo MATSUI
-
Patent number: 11101069Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.Type: GrantFiled: October 7, 2019Date of Patent: August 24, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Togo Matsui
-
Publication number: 20210090811Abstract: A multilayer ceramic electronic component includes a multilayer body including two major surfaces opposite to each other in a layer stacking direction, two side surfaces opposite to each other in a widthwise direction orthogonal or substantially orthogonal to the layer stacking direction, and two end surfaces opposite to each other in a lengthwise direction orthogonal or substantially orthogonal to the layer stacking direction and the widthwise direction, and external electrodes provided on the two end surfaces. A method for manufacturing the multilayer ceramic capacitor component includes preparing a plurality of multilayer bodies, stacking the plurality of multilayer bodies via a binder, rotating the plurality of multilayer bodies by about 90° with the lengthwise direction defining and functioning as an axis of rotation, and providing a side gap portion; and removing the binder from the multilayer body provided with the side gap portion.Type: ApplicationFiled: September 10, 2020Publication date: March 25, 2021Inventors: Yusuke YOKOTA, Togo MATSUI
-
Patent number: 10861647Abstract: A method for manufacturing a monolithic ceramic electronic component includes preparing a mother block including ceramic green sheets stacked on each other, and an internal electrode pattern arranged along interfaces between the ceramic green sheets, cutting the mother block along first and second cutting lines that are perpendicular or substantially perpendicular to each other to obtain green chips each having a laminated structure including ceramic layers and internal electrodes in a raw state, the internal electrodes being exposed on a cut side surface produced by cutting along the first cutting line, forming a raw ceramic protective layer on the cut side surface to obtain a raw component body, and firing the raw component body, wherein the cut side surface is treated with a degreasing agent.Type: GrantFiled: February 22, 2018Date of Patent: December 8, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yuya Takagi, Akira Fujita, Hideaki Tanaka, Togo Matsui
-
Patent number: 10650973Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a green mother laminate in which ceramic layers and inner electrode layers are stacked; cutting the mother laminate perpendicularly or substantially perpendicularly to a main surface of the mother laminate and in a first direction when the mother laminate is viewed in plan such that first sectional surfaces are formed, and pressing the mother laminate to obtain a bonded laminate in which the first sectional surfaces are bonded to each other; and separating the bonded laminate between the first sectional surfaces to obtain laminates. Then, the bonded laminate is cut perpendicularly or substantially perpendicularly to the main surface and in a second direction that intersects the first sectional surfaces such that second sectional surfaces are formed.Type: GrantFiled: May 19, 2016Date of Patent: May 12, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yuya Takagi, Togo Matsui, Hikaru Okuda
-
Publication number: 20200118746Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.Type: ApplicationFiled: October 7, 2019Publication date: April 16, 2020Inventor: Togo MATSUI
-
Patent number: 10515762Abstract: An electronic component includes a laminate including dielectric layers and internal electrode layers stacked in a lamination direction. A first external electrode is on a first end surface of the laminate, and connected with a first of the internal electrode layers. A second external electrode is on a second end surface of the laminate, and connected with a second of the internal electrode layers. The first external electrode includes a first metallic layer connected to the first internal electrode layer, and a second metallic layer disposed on the first metallic layer. The first metallic layer has a higher specific resistance than the second metallic layer, and a difference between a thickness of an outermost portion of the first metallic layer in the lamination direction and a thickness of a center portion of the first metallic layer in a center in the lamination direction is about 5 ?m or less.Type: GrantFiled: March 10, 2017Date of Patent: December 24, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Toshikazu Makino, Hidehiko Tanaka, Makoto Matsuda, Togo Matsui
-
Publication number: 20180240593Abstract: A method for manufacturing a monolithic ceramic electronic component includes preparing a mother block including ceramic green sheets stacked on each other, and an internal electrode pattern arranged along interfaces between the ceramic green sheets, cutting the mother block along first and second cutting lines that are perpendicular or substantially perpendicular to each other to obtain green chips each having a laminated structure including ceramic layers and internal electrodes in a raw state, the internal electrodes being exposed on a cut side surface produced by cutting along the first cutting line, forming a raw ceramic protective layer on the cut side surface to obtain a raw component body, and firing the raw component body, wherein the cut side surface is treated with a degreasing agent.Type: ApplicationFiled: February 22, 2018Publication date: August 23, 2018Inventors: Yuya TAKAGI, Akira FUJITA, Hideaki TANAKA, Togo MATSUI
-
Publication number: 20170271083Abstract: An electronic component includes a laminate including dielectric layers and internal electrode layers stacked in a lamination direction. A first external electrode is on a first end surface of the laminate, and connected with a first of the internal electrode layers. A second external electrode is on a second end surface of the laminate, and connected with a second of the internal electrode layers. The first external electrode includes a first metallic layer connected to the first internal electrode layer, and a second metallic layer disposed on the first metallic layer. The first metallic layer has a higher specific resistance than the second metallic layer, and a difference between a thickness of an outermost portion of the first metallic layer in the lamination direction and a thickness of a center portion of the first metallic layer in a center in the lamination direction is about 5 ?m or less.Type: ApplicationFiled: March 10, 2017Publication date: September 21, 2017Inventors: Toshikazu MAKINO, Hidehiko TANAKA, Makoto MATSUDA, Togo MATSUI
-
Publication number: 20160351334Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a green mother laminate in which ceramic layers and inner electrode layers are stacked; cutting the mother laminate perpendicularly or substantially perpendicularly to a main surface of the mother laminate and in a first direction when the mother laminate is viewed in plan such that first sectional surfaces are formed, and pressing the mother laminate to obtain a bonded laminate in which the first sectional surfaces are bonded to each other; and separating the bonded laminate between the first sectional surfaces to obtain laminates. Then, the bonded laminate is cut perpendicularly or substantially perpendicularly to the main surface and in a second direction that intersects the first sectional surfaces such that second sectional surfaces are formed.Type: ApplicationFiled: May 19, 2016Publication date: December 1, 2016Inventors: Yuya TAKAGI, Togo MATSUI, Hikaru OKUDA
-
Patent number: 9240333Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.Type: GrantFiled: August 8, 2014Date of Patent: January 19, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Togo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
-
Patent number: 9111692Abstract: A method for manufacturing a laminated ceramic electronic component, which includes the steps of preparing a laminate chip having opposed end edges of internal electrodes exposed at opposed side surfaces of the laminate chip; forming a first insulator section and a second insulator section, respectively, on opposed side surfaces of the laminate chip by pressing against a metal plate with a volume of grooves filled with a paste, and swinging the metal plate in any direction when pulling the laminate chip away from the metal plate; and firing the laminate chip with the first insulator section and second insulator section formed thereon. The paste has a viscosity of 500 Pa·s to 2500 Pa·s, and a content C (vol %) of an inorganic solid satisfies a predetermined condition.Type: GrantFiled: December 13, 2013Date of Patent: August 18, 2015Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kenichi Hamanaka, Eiji Ito, Yasuharu Yamashita, Kenichi Okajima, Togo Matsui
-
Patent number: 8956486Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.Type: GrantFiled: August 29, 2013Date of Patent: February 17, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Togo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
-
Patent number: 8914956Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.Type: GrantFiled: June 12, 2013Date of Patent: December 23, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Togo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
-
Publication number: 20140345779Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.Type: ApplicationFiled: August 8, 2014Publication date: November 27, 2014Inventors: Togo MATSUI, Minoru DOOKA, Hiroyoshi TAKASHIMA, Kenichi OKAJIMA