Patents by Inventor Tokichi Ito

Tokichi Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10559327
    Abstract: A base plate defines a portion of a housing of a disk drive device. The housing accommodates therein a disk, a spindle motor that rotationally drives the disk about a center axis that extends in a vertical direction, and an access portion that carries out at least one of reading or writing of information with respect to the disk. The base plate includes a cast metal base body and an electrodeposition coating film that covers the surface of the base body. The base body includes a bottom plate portion extending from the center axis to an outward in a radial direction and a wall portion with a rectangular or substantially rectangular shape viewed in the axial direction upward from an outer circumference portion of the bottom plate portion. An outside surface of the wall portion includes a coated surface covered with the electrodeposition coating film, a processing surface which is flat and on which a casting material is exposed from the electrodeposition coating film, and a parting line.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: February 11, 2020
    Assignee: NIDEC CORPORATION
    Inventors: Yuichiro Yoshimura, Yoshinori Sakemoto, Tokichi Ito
  • Publication number: 20190267044
    Abstract: A base plate defines a portion of a housing of a disk drive device. The housing accommodates therein a disk, a spindle motor that rotationally drives the disk about a center axis that extends in a vertical direction, and an access portion that carries out at least one of reading or writing of information with respect to the disk. The base plate includes a cast metal base body and an electrodeposition coating film that covers the surface of the base body. The base body includes a bottom plate portion extending from the center axis to an outward in a radial direction and a wall portion with a rectangular or substantially rectangular shape viewed in the axial direction upward from an outer circumference portion of the bottom plate portion. An outside surface of the wall portion includes a coated surface covered with the electrodeposition coating film, a processing surface which is flat and on which a casting material is exposed from the electrodeposition coating film, and a parting line.
    Type: Application
    Filed: January 10, 2019
    Publication date: August 29, 2019
    Inventors: Yuichiro YOSHIMURA, Yoshinori SAKEMOTO, Tokichi ITO
  • Patent number: 7254882
    Abstract: The present invention provides a method for sealing a metal housing member. A housing through hole is formed in a housing member for a lead wire sealing device. The housing member is provided with a housing through hole formed on the metal housing member and penetrates from a closed space to an open space. A resin coating layer is formed to cover a lower surface of the housing member. A metal surface exposed part is formed on a part of the resin coating layer. The circuit board having a board aperture is mounted on the metal surface exposed part via an adhesive layer while overlapping with the board aperture on the housing through hole. The lead wire is inserted in the housing through hole and the board aperture that are overlapped with each other. The sealing material is provided on the circuit board to cover the board aperture.
    Type: Grant
    Filed: August 3, 2006
    Date of Patent: August 14, 2007
    Assignee: Nidec Corporation
    Inventors: Tokichi Ito, Nobuaki Watanabe, Yoshito Oku, Hiroyuki Yonei
  • Publication number: 20060265871
    Abstract: A first metal housing member 111 is provided with a bottom plate part 1111 and a resin coating layer 1112 formed on a lower surface of the bottom plate part 1111. To a board mounted part 1113 which is a metal surface exposed part exposed from the resin coating layer 1112 around a housing through hole 113, an FPC 114 is mounted via an adhesive layer 115. A lead wire 1413 of a stator windings 1414 that is inserted in a board aperture 1144 is connected to the FPC 114 by a sealing material 117 as a solder and the board aperture 1144 is covered with the sealing material 117 to seal the housing through hole 113. A motor unit 10 can securely seal the housing through hole 113 by enhancing adhesiveness between the FPC 114 and the first metal housing member 111.
    Type: Application
    Filed: August 3, 2006
    Publication date: November 30, 2006
    Applicant: NIDEC CORPORATION
    Inventors: Tokichi Ito, Nobuaki Watanabe, Yoshito Oku, Hiroyuki Yonei
  • Patent number: 7105963
    Abstract: A first metal housing member 111 is provided with a bottom plate part 1111 and a resin coating layer 1112 formed on a lower surface of the bottom plate part 1111. To a board mounted part 1113 which is a metal surface exposed part exposed from the resin coating layer 1112 around a housing through hole 113, an FPC 114 is mounted via an adhesive layer 115. A lead wire 1413 of a stator windings 1414 that is inserted in a board aperture 1144 is connected to the FPC 114 by a sealing material 117 as a solder and the board aperture 1144 is covered with the sealing material 117 to seal the housing through hole 113. A motor unit 10 can securely seal the housing through hole 113 by enhancing adhesiveness between the FPC 114 and the first metal housing member 111.
    Type: Grant
    Filed: May 3, 2005
    Date of Patent: September 12, 2006
    Assignee: Nidec Corporation
    Inventors: Tokichi Ito, Nobuaki Watanabe, Yoshito Oku, Hiroyuki Yonei
  • Publication number: 20060138886
    Abstract: A first metal housing member 111 is provided with a bottom plate part 1111 and a resin coating layer 1112 formed on a lower surface of the bottom plate part 1111. To a board mounted part 1113 which is a metal surface exposed part exposed from the resin coating layer 1112 around a housing through hole 113, an FPC 114 is mounted via an adhesive layer 115. A lead wire 1413 of a stator windings 1414 that is inserted in a board aperture 1144 is connected to the FPC 114 by a sealing material 117 as a solder and the board aperture 1144 is covered with the sealing material 117 to seal the housing through hole 113. A motor unit 10 can securely seal the housing through hole 113 by enhancing adhesiveness between the FPC 114 and the first metal housing member 111.
    Type: Application
    Filed: May 3, 2005
    Publication date: June 29, 2006
    Applicant: NIDEC CORPORATION
    Inventors: Tokichi Ito, Nobuaki Watanabe, Yoshito Oku, Hiroyuki Yonei
  • Patent number: 7012191
    Abstract: According to a lead wire sealing device of an example of the present invention, a bush 116 is inserted in a housing through hole 113 formed in a bottom plate member 1110 and a lead wire 1343 is inserted in the inside of the bush 116. A first adhesive 117 is loaded in the inside of the bush 116, the first space S1, the second space S2 and the third space S3. A second adhesive 118 covers the first adhesive 117 at the edge where a flange portion 1162 of the bush 116 is provided. The first adhesive 117 having a lower viscosity is easily inserted in the first space S1 by a capillary action to be loaded without a space. As a result, it is possible to certainly seal the first space S1.
    Type: Grant
    Filed: May 3, 2005
    Date of Patent: March 14, 2006
    Assignee: Nidec Corporation
    Inventors: Nobuaki Watanabe, Tokichi Ito