Patents by Inventor Tokiko Kokubu

Tokiko Kokubu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyetheresteramide and antistatic resin composition
    Patent number: 5886098
    Abstract: A polyetheresteramide having good heat resistance, permanent antistatic property and superior compatibility with thermoplastic resins and a resin composition containing the polyetheresteramide are disclosed, wherein the polyetherester-amide consists essentially of a polyamide oligomer with carboxylic chain ends having a number average molecular weight between 200 and 5,000 and a bisphenol compound with oxyalkylene units having a number average molecular weight between 300 and 3,000. Antistatic resin compositions with good antistatic property and heat resistance are obtained from compositions comprising 3 to 40% by weight of the polyetheresteramide and 60 to 97% by weight of thermoplastic resins. The antistatic resin compositions can contain as compatibilizers vinyl polymers having functional groups such as carboxyl and epoxy groups or block polymers containing polyolefin blocks and aromatic vinyl polymer blocks.
    Type: Grant
    Filed: November 10, 1997
    Date of Patent: March 23, 1999
    Assignee: Sanyo Chemical Industries, Ltd.
    Inventors: Yasuhiro Ueda, Eiichi Senda, Yoshitsugu Takai, Tokiko Kokubu, Toshiaki Okamoto, Eiji Ichihara
  • Polyetheresteramide and antistatic resin composition
    Patent number: 5652326
    Abstract: A polyetheresteramide having good heat resistance, permanent antistatic property and superior compatibility with thermoplastic resins and a resin composition containing of the polyetheresteramide are disclosed, wherein the polyetherester-amide consists essentially of a polyamide oligomer with carboxylic chain ends having a number average molecular weight between 200 and 5,000 and a bisphenol compound with oxyalkylene units having a number average molecular weight between 300 and 3,000. Antistatic resin compositions with good antistatic property and heat resistance are obtained from compositions comprising 3 to 40% by weight of the polyetheresteramide and 60 to 97% by weight of thermoplastic resins. The antistatic resin compositions can contain as compatibilizers vinyl polymers having functional groups such as carboxyl and epoxy groups or block polymers containing polyolefin blocks and aromatic vinyl polymer blocks.
    Type: Grant
    Filed: March 1, 1994
    Date of Patent: July 29, 1997
    Assignee: Sanyo Chemical Industries, Ltd.
    Inventors: Yasuhiro Ueda, Eiichi Senda, Yoshitsugu Takai, Tokiko Kokubu, Toshiaki Okamoto, Eiji Ichihara
  • Polyetheresteramide and antistatic resin composition
    Patent number: 5604284
    Abstract: A polyetheresteramide having good heat resistance, permanent antistatic property and superior compatibility with thermoplastic resins and a resin composition containing the polyetheresteramide are disclosed, wherein the polyetherester-amide consists essentially of a polyamide oligomer with carboxylic chain ends having a number average molecular weight between 200 and 5,000 and a bisphenol compound with oxyalkylene units having a number average molecular weight between 300 and 3,000. Antistatic resin compositions with good antistatic property and heat resistance are obtained from compositions comprising 3 to 40% by weight of the polyetheresteramide and 60 to 97% by weight of thermoplastic resins. The antistatic resin compositions can contain as compatibilizers vinyl polymers having functional groups such as carboxyl and epoxy groups or block polymers containing polyolefin blocks and aromatic vinyl polymer blocks.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: February 18, 1997
    Assignee: Sanyo Chemical Industries, Ltd.
    Inventors: Yasuhiro Ueda, Eiichi Senda, Yoshitsugu Takai, Tokiko Kokubu, Toshiaki Okamoto, Eiji Ichihara