Abstract: A logic gate array is provided. The logic gate comprises a silicon substrate, a first logic gate layer on top of the silicon substrate, a second logic gate layer on top of the first logic gate layer, and a routing layer between the first and second logic gate layers for routing magnetic gates in the first and second logic gate layers, wherein the first logic gate layer, the second logic gate layer, and the routing layer are electrically connected by vias.

Abstract: A magnetic transistor includes a first magnetic section, a second magnetic section, a conductive section, a first metal terminal, and a second metal terminal. The conductive section is disposed between and is in direct contact with both the first and second magnetic section. The first metal terminal is disposed on one end of an opposite surface to the conductive section of the first magnetic section. The second metal terminal is disposed on one end approximately diagonal to the first metal terminal on an opposite surface to the conductive section of the second magnetic section. While the magnetic transistor structure is turned on, a current flows through the first magnetic section and the second magnetic section via the conductive section.

Abstract: An integrated circuit with magnetic memory has a silicon transistor layer, at least one magnetic memory layer, and a metal routing layer. The silicon transistor layer is arranged to generate several logic operation functions. The magnetic memory layer is arranged to store the data required by the logic operation functions. The metal routing layer has several conducting lines to transmit the data between the silicon transistor layer and the magnetic memory layer.

Abstract: A solar power source includes a solar panel and a magnetic capacitor. The solar panel receives solar energy, and the magnetic capacitor stores energy and provides electricity. The solar panel has a first side facing the sun, and the magnetic capacitor is attached to a second side of the solar panel. The magnetic capacitor has high valued storage capacitance to handle the charge generated by the solar panel, and has a barrier to leakage current, so that storage time is increased. The solar power source is applicable for many applications and has low energy transport costs. The solar power source may have a higher number of re-charging cycles compared to batteries, and may be partially charged or discharged without a reduction in charge capacity. Two methods of manufacturing the solar power source are also provided.

Abstract: A DRAM cell includes a substrate, a transistor, and a magnetic capacitor. The substrate is composed of semiconductor material with a main surface, the transistor is formed at the main surface, and the magnetic capacitor is formed in a metal layer. The transistor includes a source region and a drain region formed at the main surface of the substrate. The transistor also includes a control gate placed between the source region and the drain region, and separated from the substrate by a thin control dielectric. The magnetic capacitor includes a first electrode layer, a dielectric layer formed on the surface of the first electrode layer, and a second electrode layer formed on the surface of the dielectric layer. The DRAM cell increases the density, simplifies the manufacturing process, and reduces or eliminates the refresh rate. A DRAM cell with the magnetic capacitor formed in multiple layers is also provided.

Abstract: A DRAM cell includes a substrate, a transistor, and a capacitor. The substrate is composed of semiconductor material with a main surface, the transistor is formed at the main surface, and the capacitor is formed in a metal layer. The transistor includes a source region and a drain region formed at the main surface of the substrate. The transistor also includes a control gate placed between the source region and the drain region, and separated from the substrate by a thin control dielectric. The capacitor includes a first electrode layer, a dielectric layer formed on the surface of the first electrode layer, and a second electrode layer formed on the surface of the dielectric layer. The DRAM cell increases the density and simplifies the manufacturing process. A DRAM cell with the capacitor formed in multiple layers is also provided.

Abstract: An electronics system module is provided. The electronics system module includes an electronics device and a power source. The power source includes a capacitor coupling to the electronics device and providing power thereto and an adjustable resistance connected in series between the capacitor and the electronics device. The resistance is adjusted by a control mechanism, so that the voltage supplied to the electronics device from the capacitor is constant.

Abstract: An apparatus to store electrical energy is provided. The apparatus includes a first magnetic section, a second magnetic section, and a semiconductor section configured between the first magnetic section and the second magnetic section, wherein the junction between the semiconductor section and the first and second magnetic section forms a diode barrier preventing current flow to store electrical energy.

Abstract: A logic gate array is provided. The logic gate comprises a silicon substrate, a first logic gate layer on top of the silicon substrate, a second logic gate layer on top of the first logic gate layer, and a routing layer between the first and second logic gate layers for routing magnetic gates in the first and second logic gate layers, wherein the first logic gate layer, the second logic gate layer, and the routing layer are electrically connected by vias.

Abstract: A magnetic memory cell is provided. The memory cell includes a metal device, a first word line, and a second word line. The metal device includes a first magnetic layer having a first dipole; a second magnetic layer having a second dipole; and an conductive layer located between the first and second magnetic layers. The first word line is positioned near the first magnetic layer to change the direction of the first dipole. The second word line is positioned near the second magnetic layer to change the direction of the second dipole. A method of reading/writing a bit in the magnetic memory cell is also provided.

Abstract: A magnetic transistor includes a magnetic section, a thin semiconductor layer, a first metal terminal, a second metal terminal, and a third metal terminal. The thin semiconductor layer is disposed on the magnetic section. The first metal terminal is disposed on one end of the magnetic section, acting as a gate of the magnetic transistor and capable of providing a conductive channel in the thin semiconductor layer. The second metal terminal and the third metal terminal are disposed respectively on one end and the other end of the thin semiconductor layer, capable of creating a conductive region. While the magnetic transistor is turned on, a current path is formed between the second metal terminal and the third metal terminal via the thin semiconductor layer.

Abstract: Capacitors including a first conductive material having a first upper finger located on an upper plane and a first lower finger located on a lower plane. The capacitor also includes a second conductive material having a second upper finger and a second lower finger, the second upper finger located on the upper plane such that the second upper finger is next to the first upper finger forming a first interface and on top of the first lower finger forming a second interface, the second lower finger located on the lower plane such that the second lower finger is next to the first lower finger forming a third interface and below the first upper finger forming a fourth interface. Finally, the capacitor includes a dielectric material located in the first interface, the second interface, the third interface, and the fourth interface.

Abstract: A magnetic AND/NOR circuit has a first, a second, a third, and a fourth magnetic transistor. These four magnetic transistors as ordinary transistors that can be turned on or turned off by the control of several metal devices respectively disposed around the magnetic transistors. The ‘AND’ and ‘NOR’ logic functions of the binary system can be implemented by the control of these metal devices.

Abstract: The method for reducing word line currents in magnetoresistive random access memory (MRAM) includes disposing the MRAM bit between a pair of word lines according to a magnetic field strength is increased when a distance between a magnetic section and its corresponding word line is decreased.

Abstract: An integrated circuit with magnetic memory has a silicon transistor layer, at least one magnetic memory layer, and a metal routing layer. The silicon transistor layer is arranged to generate several logic operation functions. The magnetic memory layer is arranged to store the data required by the logic operation functions. The metal routing layer has several conducting lines to transmit the data between the silicon transistor layer and the magnetic memory layer.

Abstract: A magnetic transistor circuit with the OR, NOR, NAND and AND functions has a first, a second, a third, a fourth magnetic transistor, and a routing line. These four magnetic transistors as ordinary transistors that can be turned on or turned off by the control of several metal devices respectively disposed around the magnetic transistors. The OR, NOR, NAND and AND logic functions of the binary system can be implemented by the control of these metal devices.

Abstract: An apparatus to store electrical energy has a first magnetic unit, a second magnetic unit, and a dielectric section. The first magnetic unit has a first magnetic section and a second magnetic section. The second magnetic unit has a third magnetic section and a fourth magnetic section. The dielectric section is configured between the first magnetic unit and the second magnetic unit. The dielectric section is arranged to store electrical energy, and dipoles of the first magnetic section, the second magnetic section, the third magnetic section, and the fourth magnetic section are arranged to prevent electrical energy leakage.

Abstract: An apparatus to store electrical energy has a first magnetic section, a second magnetic section and a dielectric section configured between the first magnetic section and the second magnetic section. The dielectric section is arranged to store electrical energy, and dipoles of the first magnetic section and the second magnetic section are arranged to prevent electrical energy leakage.

Abstract: A magnetic transistor circuit representing the data ‘1’ and ‘0’ of the binary system comprises a routing line and a magnetic transistor unit. The routing line has a current going through with a first current direction or a second current direction, wherein the first current direction and the second current direction are opposite to represent the data ‘1’ and the data ‘0’ respectively. The magnetic transistor unit couples to the routing line at an output end to control the direction of the current going through the routing line.

Abstract: A magnetic OR/NAND circuit has a first, a second, a third, and a fourth magnetic transistor. These four magnetic transistors that work as the ordinary transistors can be turned on or turned off by the control of several metal devices respectively disposed around the magnetic transistors. The ‘OR’ and ‘NAND’ logic functions of the binary system can be implemented by the control of these metal devices.