Abstract: A protective device includes: a cling film sized and shaped to protect a surface of an electronic device, the protected surface of the electronic device comprising contacts for charging a battery of the electronic device; and a conductive pathway through the cling film corresponding to the contacts on the electronic device for charging the battery of the electronic device.

Abstract: A self-seating system is described. The self-seating system includes a guest interface for communicating with an arriving guest information relating to a seating assignment and a processing device communicating with the guest interface. The self-seating system also includes more than one directional display providing guidance to the guest as to the location of their seating assignment. The directional displays is selectively activated and deactivated through communication and signaling by the processing device. The self-seating system further includes a seating sensor communicating with the processing device as to when a guest is seated at a particular location.

Abstract: A protective device includes: a cling film sized and shaped to protect a surface of an electronic device, the protected surface of the electronic device comprising contacts for charging a battery of the electronic device; and a conductive pathway through the cling film corresponding to the contacts on the electronic device for charging the battery of the electronic device.

Abstract: Examples disclosed herein relate to an electronic wearable device electrode pad with a collection well. For example, the electronic wearable device may include an electrode pad used to recharge the electronic wearable device, a depression relative to the electrode pad to create a collection well, and an insulated area between the electrode pad and the collection well. The top surface of the electrode pad may be elevated relative to the bottom of the collection well when the electronic wearable device is positioned for recharging.

Abstract: Examples disclosed herein relate to an electronic wearable device electrode pad with a collection well. For example, the electronic wearable device may include an electrode pad used to recharge the electronic wearable device, a depression relative to the electrode pad to create a collection well, and an insulated area between the electrode pad and the collection welt The top surface of the electrode pad may be elevated relative to the bottom of the collection well when the electronic wearable device is positioned for recharging.

Abstract: An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (IPSFN) package may be affixed to a cover glass surface along a perimeter of a display. IPSFN packages may incorporate a photo-emitter chip and a photo-detector chip that may be inclined for a desired angle of incidence relative to the cover glass. A CMOS integrated optical transceiver package may include inclined photonic chips and a non-inclined CMOS chip having at least one of a photo-emitter driver, or a photo-detector TIA and/or ADC. A chip package lead frame may include cantilevered paddle tabs amenable to controlled deflection during package assembly. An inclined packaging assembly method may include attaching a chip to a lead frame paddle and form pressing the lead frame to incline the chip to a desired angle before encapsulation.

Abstract: Embodiments of the disclosure describe data transmission via a touchscreen display of a mobile computing device. The mobile computing device includes a peripheral component, integrated into a touchscreen display surface housing, and a plurality of photonic pulse transmitters and receivers disposed on edges of the touchscreen display surface. One or more receivers receive pulses from the photonic pulse transmitters for detecting user touch inputs on the touchscreen display surface. A photonic pulse modulator modulates a pulse to be transmitted from one of the photonic pulse transmitters based, at least in part, on peripheral component data. A photonic pulse demodulator demodulates the modulated pulse received by the pulse detector(s) to retrieve the peripheral component data. By utilizing these pulse transmitters/receivers, used for user touch input detection, to also exchange data via modulated light, the bezel area around the touchscreen display surface may be reduced.

Abstract: An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (IPSFN) package may be affixed to a cover glass surface along a perimeter of a display. IPSFN packages may incorporate a photo-emitter chip and a photo-detector chip that may be inclined for a desired angle of incidence relative to the cover glass. A CMOS integrated optical transceiver package may include inclined photonic chips and a non-inclined CMOS chip having at least one of a photo-emitter driver, or a photo-detector TIA and/or ADC. A chip package lead frame may include cantilevered paddle tabs amenable to controlled deflection during package assembly. An inclined packaging assembly method may include attaching a chip to a lead frame paddle and form pressing the lead frame to incline the chip to a desired angle before encapsulation.

Abstract: An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (IPSFN) package may be affixed to a cover glass surface along a perimeter of a display. IPSFN packages may incorporate a photo-emitter chip and a photo-detector chip that may be inclined for a desired angle of incidence relative to the cover glass. A CMOS integrated optical transceiver package may include inclined photonic chips and a non-inclined CMOS chip having at least one of a photo-emitter driver, or a photo-detector TIA and/or ADC. A chip package lead frame may include cantilevered paddle tabs amenable to controlled deflection during package assembly. An inclined packaging assembly method may include attaching a chip to a lead frame paddle and form pressing the lead frame to incline the chip to a desired angle before encapsulation.

Abstract: Embodiments of the disclosure describe data transmission via a touchscreen display of a mobile computing device. The mobile computing device includes a peripheral component, integrated into a touchscreen display surface housing, and a plurality of photonic pulse transmitters and receivers disposed on edges of the touchscreen display surface. One or more receivers receive pulses from the photonic pulse transmitters for detecting user touch inputs on the touchscreen display surface. A photonic pulse modulator modulates a pulse to be transmitted from one of the photonic pulse transmitters based, at least in part, on peripheral component data. A photonic pulse demodulator demodulates the modulated pulse received by the pulse detector(s) to retrieve the peripheral component data. By utilizing these pulse transmitters/receivers, used for user touch input detection, to also exchange data via modulated light, the bezel area around the touchscreen display surface may be reduced.

Abstract: An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (IPSFN) package may be affixed to a cover glass surface along a perimeter of a display. IPSFN packages may incorporate a photo-emitter chip and a photo-detector chip that may be inclined for a desired angle of incidence relative to the cover glass. A CMOS integrated optical transceiver package may include inclined photonic chips and a non-inclined CMOS chip having at least one of a photo-emitter driver, or a photo-detector TIA and/or ADC. A chip package lead frame may include cantilevered paddle tabs amenable to controlled deflection during package assembly. An inclined packaging assembly method may include attaching a chip to a lead frame paddle and form pressing the lead frame to incline the chip to a desired angle before encapsulation.

Abstract: Methods and systems may include a motion sensor and logic to sample an output signal of the motion sensor. The logic can also be configured to track an amount of time the motion sensor is triggered based on the output signal, and transmit the amount of time over a wireless link on a periodic basis.

Abstract: Methods and systems may include a motion sensor and logic to sample an output signal of the motion sensor. The logic can also be configured to track an amount of time the motion sensor is triggered based on the output signal, and transmit the amount of time over a wireless link on a periodic basis.

Abstract: Methods and systems may include a motion sensor and logic to sample an output signal of the motion sensor. The logic can also be configured to track an amount of time the motion sensor is triggered based on the output signal, and transmit the amount of time over a wireless link on a periodic basis.

Abstract: Methods and systems may include a motion sensor and logic to sample an output signal of the motion sensor. The logic can also be configured to track an amount of time the motion sensor is triggered based on the output signal, and transmit the amount of time over a wireless link on a periodic basis.

Abstract: A method and apparatus are provided for determining whether solder used during assembly of a printed circuit board is lead-free or not. This may include providing a pad on the printed circuit board and placing solder on the pad in a predetermined pattern. The solder may be heated so as to create reflow. The solder may later be examined to determine if the solder is lead-free.

Abstract: A side-mounted capacitor for a semiconductor die package is described. In one embodiment, a substrate has a die side to which an IC (integrated circuit) may be attached, and an edge adjacent the die side. A bypass capacitor is attached to the package substrate edge.

Abstract: Solder connections are created between the substrate of an electronic package and a circuit board having lengths that are longer than the width. The solder connections are created by locating solder balls of power or ground connections close enough to one another so that, upon reflow to the circuit board the solder balls combine, creating a larger solder connection. Signal solder balls, however, remain separated. The power or ground solder balls on a particular bond pad are separated from one another by portions of a removable solder mask that keep the solder balls spherical in shape during solder ball attachment to the electronic package. However, it is removed prior to reflow to the circuit board, thus creating a larger, longer solder connection between the electronic package and circuit board.

Abstract: An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hole of the printed circuit board and include a compressible section to compress when inserted into the first hole and to expand after passing through the first hole. The compressible section of the first leg may support solder between the anchoring mechanism and the first hole. Likewise, the second leg may mount through a second hole of the printed circuit board and include a compressible section to compress when inserted into the second hole and to expand after passing through the second hole. The compressible section of the second leg may support solder between the anchoring mechanism and the second hole.

Abstract: Embodiments of stiffening members in accordance with the present invention provide a mechanical support that is wave soldered to the frontside of the system substrate simultaneously with other wave soldered components. The stiffening member comprises a flat plate with a plurality of mounting pins. The number of mounting pins are predetermined to provide the plate with sufficient support to resist expected loading conditions when wave soldered in plated through holes on a system substrate. The mounting pins are adapted for insertion into plated through holes on the system substrate. The length of the mounting pins are predetermined to account for the height of the SMT component upon which it is attached, the thickness of the system substrate, and the desired amount of mounting pin protrusion from the backside of the system substrate. The stiffening members consume very little system substrate space while retaining a platform for heat dissipation.