Patents by Inventor Tom Miltich

Tom Miltich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnection of conductor to feedthrough
    Patent number: 10561851
    Abstract: A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 ?m. The lead includes at least one of niobium, platinum, titanium, tantalum, palladium, gold, nickel, tungsten, and oxides and alloys thereof.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: February 18, 2020
    Assignee: MEDTRONIC, INC.
    Inventors: Mark Breyen, Tom Miltich, Gordon Munns
  • INTERCONNECTION OF CONDUCTOR TO FEEDTHROUGH
    Publication number: 20170296832
    Abstract: A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 ?m.
    Type: Application
    Filed: June 29, 2017
    Publication date: October 19, 2017
    Inventors: MARK BREYEN, TOM MILTICH, GORDON MUNNS
  • Interconnection of conductor to feedthrough
    Patent number: 9724524
    Abstract: A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 ?m. The lead includes at least one of niobium, platinum, titanium, tantalum, palladium, gold, nickel, tungsten, and oxides and alloys thereof.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: August 8, 2017
    Assignee: MEDTRONIC, INC.
    Inventors: Mark Breyen, Tom Miltich, Gordon Munns
  • Electrical leads for a feedthrough
    Patent number: 9627833
    Abstract: A lead frame for attaching leads to a hermetic feedthrough includes a cross-member and a plurality of leads. Each of the leads has an elongate body extending from the cross-member in a direction substantially parallel with one another, and each lead includes at least one of a notch on an end thereof opposite to the cross-member or a hole proximate to the end.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: April 18, 2017
    Assignee: MEDTRONIC, INC.
    Inventors: Tom Miltich, Joyce Yamamoto, Andy Thom, Markus Reiterer, Gordon Munns, Mark Breyen
  • ELECTRICAL LEADS FOR A FEEDTHROUGH
    Publication number: 20130035732
    Abstract: A lead frame for attaching leads to a hermetic feedthrough includes a cross-member and a plurality of leads. Each of the leads has an elongate body extending from the cross-member in a direction substantially parallel with one another, and each lead includes at least one of a notch on an end thereof opposite to the cross-member or a hole proximate to the end.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Inventors: Tom Miltich, Joyce Yamamoto, Andy Thom, Markus Reiterer, Gordon Munns, Mark Breyen
  • INTERCONNECTION OF CONDUCTOR TO FEEDTHROUGH
    Publication number: 20130035733
    Abstract: A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 ?m.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Inventors: Mark Breyen, Tom Miltich, Gordon Munns