Patents by Inventor Tom P. Abadilla

Tom P. Abadilla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fuse structure
    Patent number: 7209027
    Abstract: A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region has a configuration that causes a void to be opened at a point of localized heating due to current crowding within the current flow region and that causes the void to propagate across the current flow region.
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: April 24, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stan E. Leigh, Tom P. Abadilla, Donald W. Schulte, Terry McMahon
  • Fuse structure
    Patent number: 7170387
    Abstract: A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region has a configuration that causes a void to be opened at a point of localized heating due to current crowding within the current flow region and that causes the void to propagate across the current flow region.
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: January 30, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stan E. Leigh, Tom P. Abadilla, Donald W. Schulte, Terry McMahon
  • Fuse structure
    Patent number: 6960978
    Abstract: A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region has a configuration that causes a void to be opened at a point of localized heating due to current crowding within the current flow region and that causes the void to propagate across the current flow region.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: November 1, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stan E. Leigh, Tom P. Abadilla, Donald W. Schulte, Terry McMahon