Patents by Inventor Tom W. Collins

Tom W. Collins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020041683
    Abstract: A method provided for determining an optimal number k of prime factors p1, p2, . . . pk for developing a modulus N for use in a cryptographic system providing computational performance that increases as the number of constituent prime factors of the modulus increases, wherein use of the optimal number k of prime factors enables the system to provide optimal computational performance while maintaining a determined level of security.
    Type: Application
    Filed: September 27, 2001
    Publication date: April 11, 2002
    Inventors: Dale W. Hopkins, Tom W. Collins
  • Patent number: 5959840
    Abstract: An electrical component, mounted for example to a printed circuit board, is enclosed in a sealed chamber with an inert gas that permits the electrical leads of the electrical component to be formed from a material having high heat and electrical conductivity, such as silver, that is protected from corrosion and/or oxidation by the inert gas. The housing is fabricated from a heat conductive material, and heat is thereby drawn from the electrical leads for dissipation by the outer surface of the housing.
    Type: Grant
    Filed: June 25, 1997
    Date of Patent: September 28, 1999
    Assignee: Tandem Computers Incorporated
    Inventors: Tom W. Collins, William J. Avery, John S. Suy, David M. Tichane
  • Patent number: 5615086
    Abstract: Apparatus for cooling a plurality of electrical components mounted to a circuit board includes a base plate mounted in proximate relation to component sites on the circuit board at which electrical components are mounted. The base plate includes alignment elements that engage a alignment plate. The electrical components are carried by the alignment plate so that when the alignment plate is installed on the base plate, engaging the alignment elements, the electrical components are registered to and installed at corresponding component sites in a manner that aligns electrical leads of the components to printed circuit pads at the component sites. The base plate and alignment plate are sealed, and a coolant circulated therethrough.
    Type: Grant
    Filed: May 17, 1994
    Date of Patent: March 25, 1997
    Assignee: Tandem Computers Incorporated
    Inventors: Tom W. Collins, William J. Avery, John S. Suy, David M. Tichane