Patents by Inventor Tomi Simula
Tomi Simula has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11914184Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: June 22, 2023Date of Patent: February 27, 2024Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
-
Patent number: 11906774Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: May 31, 2023Date of Patent: February 20, 2024Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
-
Publication number: 20240021764Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.Type: ApplicationFiled: September 28, 2023Publication date: January 18, 2024Inventors: Antti KERÄNEN, Sami TORVINEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
-
Publication number: 20240004120Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective laver towards the plastic layer.Type: ApplicationFiled: June 22, 2023Publication date: January 4, 2024Inventors: Antti KERÄNEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
-
Publication number: 20240004119Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: ApplicationFiled: May 31, 2023Publication date: January 4, 2024Inventors: Antti KERÄNEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
-
Publication number: 20240003516Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.Type: ApplicationFiled: June 22, 2023Publication date: January 4, 2024Inventors: Antti KERÄNEN, Sami TORVINEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
-
Patent number: 11817534Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.Type: GrantFiled: July 2, 2022Date of Patent: November 14, 2023Assignee: TACTOTEK OYInventors: Antti Keränen, Sami Torvinen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
-
Publication number: 20230309242Abstract: The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.Type: ApplicationFiled: March 28, 2023Publication date: September 28, 2023Inventors: Tomi SIMULA, Tapio RAUTIO
-
Patent number: 11729915Abstract: The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.Type: GrantFiled: March 22, 2022Date of Patent: August 15, 2023Assignee: TACTOTEK OYInventors: Tomi Simula, Tapio Rautio
-
Patent number: 11703627Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source; the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: September 15, 2022Date of Patent: July 18, 2023Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
-
Patent number: 11530808Abstract: An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.Type: GrantFiled: August 17, 2022Date of Patent: December 20, 2022Assignee: TACTOTEK OYInventors: Vinski Bräysy, Ilpo Hänninen, Mikko Heikkinen, Pälvi Apilo, Jarmo Sääski, Tomi Simula, Topi Wuori, Giovanni Ferri, Pasi Korhonen
-
Patent number: 11528802Abstract: A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.Type: GrantFiled: December 23, 2019Date of Patent: December 13, 2022Assignee: TACTOTEK OYInventors: Tapio Rautio, Tomi Simula, Minna Pirkonen, Jarkko Torvinen, Tuukka Junkkari, Janne Asikkala, Hasse Sinivaara
-
Patent number: 11500142Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: July 2, 2022Date of Patent: November 15, 2022Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
-
Patent number: 11460185Abstract: An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.Type: GrantFiled: March 25, 2022Date of Patent: October 4, 2022Assignee: TACTOTEK OYInventors: Vinski Bräysy, Ilpo Hänninen, Mikko Heikkinen, Pälvi Apilo, Jarmo Sääski, Tomi Simula, Topi Wuori, Giovanni Ferri, Pasi Koronen
-
Patent number: 11357111Abstract: A method for manufacturing an integrated multilayer structure includes obtaining a substrate film having first and second sides, providing at least on the first side one or more first functional features, arranging at least one layer upon at least the first side; removing, at least a portion of the substrate film so that space is released in the structure wherein a detachment-enhancing feature provided to the substrate film is configured to facilitate the removal of the at least a portion of the substrate film such that the adjacent remaining film material, if any, the arranged layer and the one or more first functional features are preserved and preferably remain substantially intact; and providing at least one second functional feature into the space released for use so that the at least one second functional feature operatively connects with at least one of the one or more first functional features.Type: GrantFiled: August 27, 2018Date of Patent: June 7, 2022Assignee: TACTOTEK OYInventors: Janne Asikkala, Tomi Simula, Antti Keränen
-
Publication number: 20210368630Abstract: A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.Type: ApplicationFiled: October 16, 2020Publication date: November 25, 2021Inventors: Tomi SIMULA, Mika PAANI, Miikka KÄRNÄ, Outi RUSANEN, Johanna JUVANI, Tapio RAUTIO, Marko SUO-ANTTILA, Mikko HEIKKINEN
-
Patent number: 11175438Abstract: An optoelectronically functional multilayer structure and related methods of manufacturing an optoelectronically functional multilayer structure, such structure including an optionally thermoplastic formable substrate film, electronics comprising preferably light-emitting and/or light-sensitive elements, an optically transmissive layer, and a light-blocking layer defining a number of structural channels extending in at least a first direction.Type: GrantFiled: May 17, 2021Date of Patent: November 16, 2021Assignee: TACTOTEK OYInventors: Juha-Matti Hintikka, Miikka Kärnä, Heikki Tuovinen, Tuomas Nieminen, Johannes Soutukorva, Ville Wallenius, Tero Rajaniemi, Tomi Simula, Jari Lihavainen, Mikko Heikkinen, Jarmo Sääski, Hasse Sinivaara, Antti Keränen, Ilpo Hänninen
-
Patent number: 11175014Abstract: An optoelectronically functional multilayer structure as well as related methods of manufacturing an optoelectronically functional multilayer structure are described herein.Type: GrantFiled: May 17, 2021Date of Patent: November 16, 2021Assignee: TACTOTEK OYInventors: Juha-Matti Hintikka, Miikka Kärnä, Heikki Tuovinen, Tuomas Nieminen, Johannes Soutukorva, Ville Wallenius, Tero Rajaniemi, Tomi Simula, Jari Lihavainen, Mikko Heikkinen, Jarmo Sääski, Hasse Sinivaara, Antti Keränen, Ilpo Hänninen
-
Patent number: 11166363Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.Type: GrantFiled: January 11, 2019Date of Patent: November 2, 2021Assignee: TACTOTEK OYInventors: Antti Keränen, Tomi Simula, Mikko Heikkinen, Jarmo Sääski, Pasi Raappana, Minna Pirkonen
-
Patent number: 11166380Abstract: A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.Type: GrantFiled: October 16, 2020Date of Patent: November 2, 2021Assignee: TACTOTEK OYInventors: Tomi Simula, Mika Paani, Miikka Kärnä, Outi Rusanen, Johanna Juvani, Tapio Rautio, Marko Suo-Anttila, Mikko Heikkinen