Patents by Inventor Tomihiro Hara

Tomihiro Hara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240087937
    Abstract: According to the present disclosure, there is provided a technique capable of suppressing an erroneous detection of a presence or absence of a substrate caused by a light receiver receiving a specularly reflected light. There is provided a technique that includes: a holding structure provided with a placing surface capable of accommodating a substrate thereon; a light detector including: a light emitter arranged to irradiate an irradiation light toward a back surface of the substrate placed on the placing surface; and a light receiver arranged to be capable of receiving a diffusely reflected light of the irradiation light irradiated from the light emitter without receiving a specularly reflected light of the irradiation light; and a controller configured to be capable of determining a presence or absence of the substrate based on a light receiving state of the light receiver.
    Type: Application
    Filed: August 14, 2023
    Publication date: March 14, 2024
    Applicant: Kokusai Electric Corporation
    Inventors: Naoki Hara, Tomihiro Amano, Shin Hiyama
  • Publication number: 20110139500
    Abstract: A method of connecting a flexible flat cable and a board is provided, which includes the steps of preparing the flexible flat cable having a first connection terminal composed of a plurality of exposed flat type conductors; preparing the board having a second connection terminal composed of a plurality of conductors; aligning each of the first and second connection terminals and placing an adhesive film on the first connection terminal; and thermocompressionally bonding the first and second connection terminals by heating and fusing the adhesive film while applying a pressure to the adhesive film, thereby sealing the first and second connection terminals, bringing each flat type conductor of the first connection terminal and the corresponding conductor of the second connection terminal into direct contact to form an electrical connection, and insulating adjacent ones of the plurality of flat type conductors of the first connection terminal by the adhesive film.
    Type: Application
    Filed: August 27, 2009
    Publication date: June 16, 2011
    Inventor: Tomihiro Hara
  • Publication number: 20110000700
    Abstract: A method of connecting circuit boards capable of easily accomplishing the connection maintaining reliability. A method of connection comprising the steps of obtaining a laminated body of a first circuit board, an adhesive sheet and a second circuit board, and accomplishing electric conduction between the first circuit and the second circuit by applying heat and pressure to the laminated body of the first circuit board, the adhesive sheet and the second circuit board, wherein an end of the circuit formed on at least either the first circuit board or the second circuit board is terminated at a position separated away from an end of the substrate, and the adhesive of the adhesive sheet is partly arranged between the end of the substrate of the circuit board and the end of the circuit so as to be adhered to the opposing circuit board.
    Type: Application
    Filed: October 11, 2007
    Publication date: January 6, 2011
    Inventors: Yoshiaki Sato, Kohichiro Kawate, Tomihiro Hara, Noriko Kikuchi
  • Publication number: 20090321015
    Abstract: To provide an adhesive composition which can exhibit high adhesion to a circuit board and also has ability capable of releasing the connection to the circuit board connected and reconnecting the circuit board (repairing properties). An adhesive composition comprising: (i) one or more aromatic-group-containing polyhydroxy ether resins, (ii) a compound having an alkoxysilyl group and an imidazole group in the molecule, and (iii) organic particles, wherein the content of the organic particles is 50% by weight or more based on the weight of the adhesive composition.
    Type: Application
    Filed: June 18, 2007
    Publication date: December 31, 2009
    Inventors: Kohichiro Kawate, Hitoshi Yamaguchi, Noriko Kikuchi, Tomihiro Hara, Yoshiyuki Ohkura
  • Publication number: 20040213973
    Abstract: A film adhesive for sealing a plurality of chip-type devices on a substrate at one time, including an adhesive layer of an adhesive composition which exhibits a minimum value of a storage modulus of elasticity before curing from 1×103 to 5×105 Pa measured by using a dynamic visco-elasticity measuring apparatus while elevating the temperature from 80° C. to 150° C. at an elevating temperature rate of 2.4° C./min and at a shearing rate of 6.28 rad/sec and a storage modulus of elasticity after curing from 5×105 to 5×107 Pa measured by using a dynamic visco-elasticity measuring apparatus at a sample temperature of 150° C. in a tensile mode at a measuring frequency of 6.28 rad/sec.
    Type: Application
    Filed: March 30, 2004
    Publication date: October 28, 2004
    Inventors: Tomihiro Hara, Shigeyoshi Ishii
  • Publication number: 20040068061
    Abstract: A thermosetting adhesive film comprising a uniform adhesive matrix containing a thermosetting resin and a curing agent therefor, and a thermoplastic resin; and a filler material dispersed in the adhesive matrix, wherein the filler material comprises an inorganic material and a domain to incorporate the inorganic material, the domain consisting of an elastic polymer which is elongated and oriented in one direction substantially perpendicular to the thickness direction of the adhesive film. This adhesive film provides good properties of coefficient of thermal expansion and elastic modulus, without exhibiting reduced adhesive force which would be otherwise observed in association with the addition of large amounts of filler material.
    Type: Application
    Filed: July 31, 2003
    Publication date: April 8, 2004
    Inventors: Kohichiro Kawate, Shigeyoshi Ishii, Tomihiro Hara, Yuko Yoshida
  • Publication number: 20040063804
    Abstract: A thermosetting adhesive which produces no foul odor or discharged gas, or form no bubbles under irradiation, and which exhibits a satisfactorily high bonding property, even under low-dose irradiation. The thermosetting adhesive contains an ethylene-glycidyl (meth)acrylate copolymer, whose principal monomer components are an ethylene and a glycidyl (meth)acrylate, and a sulphonium salt-comprising cationic polymerization catalyst.
    Type: Application
    Filed: July 31, 2003
    Publication date: April 1, 2004
    Inventors: Masaaki Takeda, Kohichiro Kawate, Shigeyoshi Ishii, Naoyuki Toriumi, Koji Itoh, Tomihiro Hara
  • Patent number: 5462686
    Abstract: Methods of manufacturing a composite ferrite of two or more of metal oxides prepared from a chloride solution containing ions of these metals, one of the metals being zinc. The methods comprise (a) ejecting a high temperature gas to the solution or atomizing the solution and (b) supplying the atomized gas to a combustion gas containing oxygen, to evaporate moisture from mist particles of the solution in a short period of time so that the zinc chloride in the solution is not substantially evaporated and to induce a heat decomposition or chemical reaction for the remaining metal salt particles, thereby forming a composite ferrite.
    Type: Grant
    Filed: July 29, 1994
    Date of Patent: October 31, 1995
    Assignees: NKK Corporation, Kokan Mining Co., Ltd., Irox-NKK Co., Ltd.
    Inventors: Shunichi Sugiyama, Hiroshi Kametani, Hideyuki Yoshikoshi, Nobuaki Ikeda, Tomihiro Hara
  • Patent number: 4757781
    Abstract: An apparatus for hot dip plating on one side of a metal strip, comprising a plurality of nozzles disposed at an oblique angle to the direction of travel of the strip and having outlets which are tilted toward the edges of the strip, whereby splashing of the plating material is avoided, and occurence of plating material on the non-plated side of the strip is also avoided, and the plating is regular and without irregularity of plating or areas lacking plating material.
    Type: Grant
    Filed: January 8, 1987
    Date of Patent: July 19, 1988
    Assignee: Nippon Kokan Kabushiki Kaisha
    Inventors: Shuzo Fukuda, Yutaka Ohkubo, Tomihiro Hara
  • Patent number: 4659394
    Abstract: The present invention relates to a process for the preparation of a highly anticorrosive surface-treated steel plate. This process comprises the steps of subjecting a surface of a steel plate having a plating layer of the zinc or aluminum type deposited thereon to a chromate treatment to form a chromate film, treating the steel plate with an organic composite silica solution comprising an epoxy resin in an amount exceeding a certain level as an indispensable component and a curing agent optionally incorporated therein to form an organic composite silicate film comprising colloidal silica, organic resin and silane formed on the chromate film, and heat-treating the steel plate at a specific temperature.
    Type: Grant
    Filed: August 27, 1984
    Date of Patent: April 21, 1987
    Assignee: Nippon Kokan Kabushiki Kaisha
    Inventors: Tomihiro Hara, Takeshi Adaniya, Masaaki Yamashita, Akira Enatsu
  • Patent number: 4543300
    Abstract: An iron-zinc alloy electro-galvanized steel sheet having a plurality of iron-zinc alloy coatings, which comprises: at least one iron-zinc alloy coating as the lower layer, formed on the surface of a steel sheet, and at least two iron-zinc alloy coatings as the upper layer, formed on the at least one iron-zinc alloy coating as the lower layer. The ratio of iron content to the coating weight of each of the at least one iron-zinc alloy coating as the lower layer is within the range of from 1 to 15 wt. %, and the total coating weight of the at least one iron-zinc alloy coating as the lower layer is within the range of from 1 to 50 g/m.sup.2 per side of the steel sheet. The ratio of iron content to the coating weight of each of the at least two iron-zinc alloy coatings as the upper layer is over 15 wt.
    Type: Grant
    Filed: April 27, 1984
    Date of Patent: September 24, 1985
    Assignee: Nippon Kokan Kabushiki Kaisha
    Inventors: Tomihiro Hara, Takeshi Adaniya, Masaru Sagiyama, Tsutomu Watanabe, Takashi Shimoma, Masaru Nabatame
  • Patent number: 4519878
    Abstract: A strip horizontally travels within an electroplating apparatus while the plating solution is applied between the strip and anode, in which relative speed of the solution to the strip and/or current density are varied, whereby an outer plated layer on the strip is provided with Fe-Zn alloy of high Fe content while an inner plated layer on the strip is provided with Fe-Zn alloy of low Fe content.
    Type: Grant
    Filed: April 11, 1983
    Date of Patent: May 28, 1985
    Assignee: Nippon Kokan Kabushiki Kaisha
    Inventors: Tomihiro Hara, Takeshi Adaniya, Akira Tonouchi
  • Patent number: 4487663
    Abstract: A steel sheet utilized to prepare cans comprises an iron base sheet, a Fe--Sn alloy layer formed on the iron base sheet and containing 0.05-0.7 g/m.sup.2 of tin and 40-80 atomic % of iron, and a composite oxide film formed on the alloy layer and containing Fe, Sn, Cr and O. The composite oxide film is formed by applying a cathodic dichromate treatment to the steel sheet which has been quenched and cooled to form an oxide film on the alloy layer, the oxide film containing both of tin and iron oxides being converted to the composite oxide film.
    Type: Grant
    Filed: April 11, 1983
    Date of Patent: December 11, 1984
    Assignee: Nippon Kokan Kabushiki Kaisha
    Inventors: Tomihiro Hara, Hiroshi Kagechika, Satoshi Doi, Yoshinori Yomura
  • Patent number: 4450209
    Abstract: A multi-layer surface-treated steel plate comprises a zinc-containing plated layer, a lithium silicate film layer formed on said plated layer and an organic composite silicate film layer composed of colloidal silica and an organic resin, which is formed on the lithium silicate film layer.
    Type: Grant
    Filed: December 7, 1982
    Date of Patent: May 22, 1984
    Assignee: Nippon Kokan Kabushiki Kaisha
    Inventors: Tomihiro Hara, Masahiro Ogawa, Masaaki Yamashita
  • Patent number: 4411964
    Abstract: A composite coating steel sheet is disclosed which has good corrosion resistance, paintability and corrosion resistance after paint coating. The steel sheet comprises a plated base steel sheet, such as a galvanized, zinc alloy plated or aluminum plated steel sheet, and a chromate film formed on the plated base steel sheet. A composite silicate resin film is formed on the chromate film. The composite silicate film is composed of a reaction product of a colloidal silica, an organic resin and a silane compound.
    Type: Grant
    Filed: December 17, 1981
    Date of Patent: October 25, 1983
    Assignee: Nippon Kokan Kabushiki Kaisha
    Inventors: Tomihiro Hara, Masahiro Ogawa, Masakazu Tsukada, Masaaki Yamashita
  • Patent number: 4407899
    Abstract: A steel sheet with its surface prepared for paint coating is disclosed. The surface treated steel sheet comprises a base sheet, and an iron-zinc alloy film plated on the base sheet in an amount of at least 0.1 g/m.sup.2 and having an iron content of from 3 to 30%. A composite silicate resin film is coated on the iron-zinc alloy film in an amount of from 0.05 to 5.0 g/m.sup.2. The resin film is composed of an acrylic copolymer, an epoxy resin, a silica sol and a trialkoxysilane compound. The treated surface provides superior paintability, degrease resistance and corrosion resistance after pain coating.
    Type: Grant
    Filed: December 17, 1981
    Date of Patent: October 4, 1983
    Assignee: Nippon Kokan Kabushiki Kaisha
    Inventors: Tomihiro Hara, Masahiro Ogawa, Masaaki Yamashita, Yasuhisa Tajiri