Abstract: A surface treatment agent composition for non-chromium steel sheets for removing iron ions without reducing the amount of aluminum ions when subjecting the steel sheet to surface treatment by means of cathodic electrolysis using a surface treatment agent containing aluminum ions as the main component; and a method for producing a surface-treated steel sheet using the composition. A surface-treated steel sheet exhibiting high corrosion resistance, a surface-treated steel sheet with an organic coating, and a can lid, can body and seamless can produced using the surface-treated steel sheets. A surface treatment agent composition for steel sheets contains aluminum ions, fluorine ions and polycarboxylic acid and is used as the surface treatment bath used for forming a surface treatment coating film on the surface of the steel sheet by cathodic electrolysis.

Abstract: A surface treatment agent composition which contains aluminum as the coating film formation component and exhibits excellent properties for removing tin ions within a treatment bath when subjecting a tin-plated steel to electrolytic surface treatment, thereby forming a coating film exhibiting excellent corrosion resistance and yellowing resistance. This surface treatment agent composition is used for subjecting a tin-plated steel or a tin-based alloy-plated steel to electrolytic surface treatment and contains aluminum ions, fluorine ions, and polycarboxylic acid. The tin ions that eluted from the tin-plated steel are precipitated within and removed from the treatment bath by using this surface treatment agent composition.

Abstract: Providing a method for manufacturing a multilayer wiring board and a touch panel, which does not cause decreasing of yields, reliabilities and productivities even though the materials of each board to be stacked are different, and which manufactures the multilayer wiring board and the touch panel at low cost with high productivities. A multilayer wired board constituting at least part of a electrical circuit board in which a plurality of wired boards are stacked so as to face their wired surfaces each other, wherein: electrical connection parts between the multilayer wired boards are connected through an elastic conductive material part adhered to one of the wired boards; and at least part of a peripheral edge portion of the elastic conductive material part is adhered by a double-sided adhesive material part to seal the plurality of multilayer wired boards.

Abstract: A glass substrate excellent in strength properties and a glass cutting method are provided. When a glass substrate having predetermined size is to be formed by cutting a glass plate, any crack or chip is not generated on a cut face. Therefore, a pulverized powder is prevented from being generated from this portion. A glass substrate is obtained by cutting at least with laser light radiation so that a surface roughness of cut side faces and of the glass substrate are 50 nm or less and a depth of laser marks and on the cut side faces are 0.06 mm or more.

Abstract: A glass substrate excellent in strength properties and a glass cutting method are provided. When a glass substrate having predetermined size is to be formed by cutting a glass plate, any crack or chip is not generated on a cut face. Therefore, a pulverized powder is prevented from being generated from this portion. A glass substrate is obtained by cutting at least with laser light radiation so that a surface roughness of cut side faces and of the glass substrate are 50 nm or less and a depth of laser marks and on the cut side faces are 0.06 mm or more.

Abstract: Providing a method for manufacturing a multilayer wiring board and a touch panel, which does not cause decreasing of yields, reliabilities and productivities even though the materials of each board to be stacked are different, and which manufactures the multilayer wiring board and the touch panel at low cost with high productivities. A multilayer wired board constituting at least part of a electrical circuit board in which a plurality of wired boards are stacked so as to face their wired surfaces each other, wherein: electrical connection parts between the multilayer wired boards are connected through an elastic conductive material part adhered to one of the wired boards; and at least part of a peripheral edge portion of the elastic conductive material part is adhered by a double-sided adhesive material part to seal the plurality of multilayer wired boards.

Abstract: Antireflection coating on a substrate which is coated with a low refractive index layer having a specified refractive index which in turn is coated with a high refractive index layer having a higher refractive index than the low refractive index layer, is either characterized in that a roughened surface which scatters and reflects the incident light entered into the low refractive index layer in contact with the substrate is formed at the interface between the low refractive index layer and the substrate, or that a light-diffusing layer which scatters and reflects the incident light entered into the low refractive index layer in contact with the substrate is formed at the interface between the low refractive index layer and the substrate, or that a hard coating layer in contact with the low refractive index layer is formed by dispersing a light-diffusing material in the hard coating layer, which scatters and reflects the incident light entered into the low refractive index layer.

Abstract: Antireflection coating on a substrate which is coated with a low refractive index layer having a specified refractive index which in turn is coated with a high refractive index layer having a higher refractive index than the low refractive index layer, is either characterized in that a roughened surface which scatters and reflects the incident light entered into the low refractive index layer in contact with the substrate is formed at the interface between the low refractive index layer and the substrate, or that a light-diffusing layer which scatters and reflects the incident light entered into the low refractive index layer in contact with the substrate is formed at the interface between the low refractive index layer and the substrate, or that a hard coating layer in contact with the low refractive index layer is formed by dispersing a light-diffusing material in the hard coating layer, which scatters and reflects the incident light entered into the low refractive index layer.

Abstract: A process for forming a functional ceramic thin film eliminating the need of high temperature annealing which has been indispensable in the conventional process is provided. This can be achieved by the process for forming a functional ceramic thin film having a crystal of a composite oxide consisting of two or more metal elements and oxygen, which comprises steps of alternately stacking seeding layers having the same crystalline structure as said composite oxide and formable at a temperature lower than the crystallization temperature of the composite oxide, and layers containing a larger amount of a specified metal element than said seeding layers, and then annealing the resultant layers to form an integral body.

Abstract: A process for producing a copper-indium-sulfur-selenium thin film which comprises subjecting an electro-conductive substrate to an electrodeposition treatment in the presence of copper sulfate, indium sulfate, selenium dioxide, and thiourea. A process for producing a chalcopyrite crystal which comprises subjecting an electro-conductive substrate to an electrodeposition treatment in the presence of copper sulfate, indium sulfate, selenium dioxide, and thiourea, and then conducting a heat treatment.

Abstract: A process for producing a light absorption layer of a solar cell is disclosed, in which prior to heat-treatment, at least two of the following steps are performed in combination: (1) electrodeposition of a copper layer including selenium particles, (2) electrodeposition of an indium layer including selenium particles, (3) electrodeposition of a copper layer not including selenium, and (4) electrodeposition of an indium layer not including selenium. Control of copper, indium, and selenium contents becomes easier with this process.

Abstract: A novel palladium-nickel alloy plating solution provides a uniform electrodeposited film with excellent gloss at a high electric current density. A palladium-nickel alloy plating solution comprises a water-soluble palladium salt, a water-soluble nickel salt, ammonia, an ammonium salt, and 3-pyridinesulfonic acid, which are solved in water. Further additives may be added in the solution.

Abstract: To remove pores and lattice defects in gold film plated on a substrate, the gold plating film is irradiated with a first laser beam to bring at least the surface of the film into almost melted condition, and then cooled in air. Further, it is preferable to anneal the melted gold surface by a second laser beam weaker than the first laser beam before air cooling, thus reducing the thickness of the gold film and therefore the material cost of electric contacts, for instance.

Abstract: In an electric contact having a Cu-based layer, a Ni-based layer formed on the Cu-based layer, and a Pd-based layer formed on the Ni-based layer, the Ni-based layer having a thickness of at least 0.8 .mu.m is so formed as to include a noncrystal nickel alloy layer having a thickness of at least 0.08 .mu.m, in order to reduce the thickness of the Pd-based layer down to about 0.08 .mu.m, that is, the cost of the contact without deteriorating the contact durability, as compared with a 0.6 to 2 .mu.m thick prior-art Pd-based layer.