Patents by Inventor Tomio Kitsuwa

Tomio Kitsuwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7601433
    Abstract: A plated steel wire having a plated layer and an intermediate layer is characterized in that a content of manganese contained in both the plated layer and the intermediate layer is 0.02-0.30% in terms of average mass percentage, a content of aluminum is 8-25% in terms of average mass percentage, and a content of zinc and inevitable components is 74.70-91.98% in terms of average mass percentage, and that a total deposition amount of the intermediate layer and the plated layer per unit area of the steel wire surface is set to 700-1000 g/m2. The plated steel wire has excellent corrosion resistance and excellent workability, with the increased total deposition amount of the plated layer and the intermediate layer.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: October 13, 2009
    Assignee: Sakuratech Co., Ltd.
    Inventor: Tomio Kitsuwa
  • Patent number: 7220316
    Abstract: An apparatus for plating a wire material is provided in which a range of the plated layer where the temperature is high and flowability is large, thus, easily generating thickness deviation, and a range of the plated layer where the temperature is low and the flowability is small, thus generating thickness deviation only with difficulty are allowed to cool in an appropriate manner, respectively, whereby a plated wire material whose thickness deviation is not more than 2.0 can be produced with high productivity in a stable manner.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: May 22, 2007
    Assignee: Sakuratech Co. Ltd.
    Inventor: Tomio Kitsuwa
  • Publication number: 20060141280
    Abstract: A plated steel wire having a plated layer and an intermediate layer is characterized in that a content of manganese contained in both the plated layer and the intermediate layer is 0.02-0.30% in terms of average mass percentage, a content of aluminum is 8-25% in terms of average mass percentage, and a content of zinc and inevitable components is 74.70-91.98% in terms of average mass percentage, and that a total deposition amount of the intermediate layer and the plated layer per unit area of the steel wire surface is set to 700-1000 g/m2. The plated steel wire has excellent corrosion resistance and excellent workability, with the increased total deposition amount of the plated layer and the intermediate layer.
    Type: Application
    Filed: December 6, 2005
    Publication date: June 29, 2006
    Inventor: Tomio Kitsuwa
  • Publication number: 20050103263
    Abstract: An apparatus for plating a wire material is provided in which a range of the plated layer where the temperature is high and flowability is large, thus, easily generating thickness deviation, and a range of the plated layer where the temperature is low and the flowability is small, thus generating thickness deviation only with difficulty are allowed to cool in an appropriate manner, respectively, whereby a plated wire material whose thickness deviation is not more than 2.0 can be produced with high productivity in a stable manner.
    Type: Application
    Filed: August 21, 2002
    Publication date: May 19, 2005
    Inventor: Tomio Kitsuwa