Patents by Inventor Tomio Wakamatsu

Tomio Wakamatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8052880
    Abstract: A method for manufacturing a light reflecting metal wall including a step (a) forming a cavity structure on a metal plate on which back surface a substrate is laminated, the cavity structure including on its side wall a light reflecting wall, the step (a) including the steps of (b) forming a first mask on a surface of the metal plate, the first mask having a mask opening portion corresponding to an opening portion of the cavity structure, and (c) forming the light reflecting wall on a side wall of the metal plate by carrying out wet etching with respect to the metal plate with the first mask, in the step (c), in the middle of the wet etching, the first mask being bent by press working along the light reflecting wall formed by the wet etching. As a result, the light reflecting metal wall is stably formed by securing both (i) an area of an LED chip mounting surface and (ii) a thickness of the light reflecting metal wall even if a packaged light-emitting element has a narrow lateral width of its short side.
    Type: Grant
    Filed: May 15, 2008
    Date of Patent: November 8, 2011
    Assignees: Sharp Kabushiki Kaisha, Fuji Machinery Mfg. & Electronics Co., Ltd.
    Inventors: Masashi Takemoto, Syuji Takahashi, Tomio Wakamatsu, Yoshiteru Ogawa
  • Publication number: 20080283492
    Abstract: A method for manufacturing a light reflecting metal wall including a step (a) forming a cavity structure on a metal plate on which back surface a substrate is laminated, the cavity structure including on its side wall a light reflecting wall, the step (a) including the steps of (b) forming a first mask on a surface of the metal plate, the first mask having a mask opening portion corresponding to an opening portion of the cavity structure, and (c) forming the light reflecting wall on a side wall of the metal plate by carrying out wet etching with respect to the metal plate with the first mask, in the step (c), in the middle of the wet etching, the first mask being bent by press working along the light reflecting wall formed by the wet etching. As a result, the light reflecting metal wall is stably formed by securing both (i) an area of an LED chip mounting surface and (ii) a thickness of the light reflecting metal wall even if a packaged light-emitting element has a narrow lateral width of its short side.
    Type: Application
    Filed: May 15, 2008
    Publication date: November 20, 2008
    Applicants: SHARP KABUSHIKI KAISHA, FUJI MACHINERY MFG. & ELECTRONICS CO., LTD.
    Inventors: Masashi Takemoto, Syuji Takahashi, Tomio Wakamatsu, Yoshiteru Ogawa