Patents by Inventor Tomio Yamada
Tomio Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230347965Abstract: An operation control device includes a memory; and a processor connected to the memory, the processor being configured to: in a case in which the processor receives, at an operation unit that includes a first operation region and a second operation region adjacent to the first operation region, an operation performed on the first operation region in a direction of the second operation region, limit execution of processes corresponding to operations performed on the second operation region until a predetermined condition is met.Type: ApplicationFiled: April 21, 2023Publication date: November 2, 2023Inventors: Yuki KOZONO, Shu NAKAJIMA, Tomio YAMADA
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Patent number: 8581395Abstract: A hybrid integrated circuit device having high mount reliability includes a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include ones which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: GrantFiled: June 14, 2012Date of Patent: November 12, 2013Assignee: Renesas Electronics CorporationInventors: Shinji Moriyama, Tomio Yamada
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Publication number: 20120248630Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include ones which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: ApplicationFiled: June 14, 2012Publication date: October 4, 2012Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Shinji MORIYAMA, Tomio YAMADA
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Patent number: 8222734Abstract: A hybrid integrated circuit device having high mount reliability includes a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include ones which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: GrantFiled: November 29, 2011Date of Patent: July 17, 2012Assignee: Renesas Electronics CorporationInventors: Shinji Moriyama, Tomio Yamada
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Publication number: 20120106110Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include ones which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: ApplicationFiled: November 29, 2011Publication date: May 3, 2012Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Shinji MORIYAMA, Tomio YAMADA
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Patent number: 8084852Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: GrantFiled: February 3, 2011Date of Patent: December 27, 2011Assignee: Renesas Electronics CorporationInventors: Shinji Moriyama, Tomio Yamada
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Patent number: 7978037Abstract: A movable contact positioned in a sealed case is moved together with a movable contact spring provided with an armature by a magnetic shunt body which is moved outside the sealed case. The movement of the movable contact (movement of the movable contact spring) due to the movement of the magnetic shunt body is based on the change of the magnetically attracting force of a magnet with respect to the armature through a pair of yokes. The movable contact spring is provided with a bent portion which is bent in spaced-apart relation to the armature, the bent portion being provided between a fulcrum portion at a time when the movable contact spring moves and a portion where the armature is provided.Type: GrantFiled: February 10, 2009Date of Patent: July 12, 2011Assignees: Kabushiki Kaisha Tokai Rika Denki Seisakusho, NEC TOKIN CorporationInventors: Tomio Yamada, Tatsumi Ide, Yoshinori Ota
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Publication number: 20110121365Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: ApplicationFiled: February 3, 2011Publication date: May 26, 2011Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Shinji MORIYAMA, Tomio YAMADA
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Patent number: 7932796Abstract: A movable contact which is positioned inside a sealing case is moved by a magnetic shunt body which moves outside the sealing case. The movement of the movable contact by the movement of the magnetic shunt body is caused by a change of magnetic force of a magnet through a pair of yokes. The magnetic shunt body is assembled to a moving member, and elastically moves around the moving member resisting a first spring.Type: GrantFiled: October 2, 2008Date of Patent: April 26, 2011Assignees: Kabushiki Kaisha Tokai Rika Denki Seisakusho, NEC Tokin CorporationInventors: Tomio Yamada, Masahiko Miyata, Katsuhide Kumagai, Tatsumi Ide, Yoshinori Ota
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Patent number: 7902656Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: GrantFiled: April 28, 2010Date of Patent: March 8, 2011Assignee: Renesas Electronics CorporationInventors: Shinji Moriyama, Tomio Yamada
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Publication number: 20100207275Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: ApplicationFiled: April 28, 2010Publication date: August 19, 2010Applicant: RENESAS TECHNOLOGY CORP.Inventors: Shinji MORIYAMA, Tomio YAMADA
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Patent number: 7755182Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: GrantFiled: March 10, 2009Date of Patent: July 13, 2010Assignee: Renesas Technology Corp.Inventors: Shinji Moriyama, Tomio Yamada
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Patent number: 7750771Abstract: Magnetic attractive force of a magnet exerted on a movable contact in a sealing case through yokes changes as a result of movement of a magnetic shunt element induced by movement of a movable element located outside the sealing case. As a result, the movable contact can be brought into or out of contact with a stationary contact without involvement of entry of the movable element into the sealing case.Type: GrantFiled: April 22, 2008Date of Patent: July 6, 2010Assignees: Kabushiki Kaisha Tokai Rika Denki Seisakusho, NEC Tokin CorporationInventors: Tomio Yamada, Katsuhide Kumagai, Masahiko Miyata, Yoshinori Ota, Tatsumi Ide
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Patent number: 7714242Abstract: A switch device including a switch operation shaft movable between a plurality of operation positions for setting a control amount for an apparatus. A follower is driven to follow the movement of the switch operation shaft. An attraction member generates magnetic force to attract the follower so that the follower becomes immovable and to hold the switch operation shaft at a single operation position.Type: GrantFiled: June 6, 2007Date of Patent: May 11, 2010Assignee: Kabushiki Kaisha Tokai Rika Denki SeisakushoInventors: Seiji Ishigaki, Masahiko Miyata, Tomio Yamada, Terukazu Hiroe
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Publication number: 20090201110Abstract: A movable contact positioned in a sealed case is moved together with a movable contact spring provided with an armature by a magnetic shunt body which is moved outside the sealed case. The movement of the movable contact (movement of the movable contact spring) due to the movement of the magnetic shunt body is based on the change of the magnetically attracting force of a magnet with respect to the armature through a pair of yokes. The movable contact spring is provided with a bent portion which is bent in spaced-apart relation to the armature, the bent portion being provided between a fulcrum portion at a time when the movable contact spring moves and a portion where the armature is provided.Type: ApplicationFiled: February 10, 2009Publication date: August 13, 2009Inventors: Tomio Yamada, Tatsumi Ide, Yoshinori Ota
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Publication number: 20090174060Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: ApplicationFiled: March 10, 2009Publication date: July 9, 2009Applicant: RENESAS TECHNOLOGY CORP.Inventors: Shinji MORIYAMA, Tomio YAMADA
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Patent number: 7518228Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.Type: GrantFiled: June 27, 2007Date of Patent: April 14, 2009Assignee: Renesas Technology Corp.Inventors: Shinji Moriyama, Tomio Yamada
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Publication number: 20090091408Abstract: A movable contact which is positioned inside a sealing case is moved by a magnetic shunt body which moves outside the sealing case. The movement of the movable contact by the movement of the magnetic shunt body is caused by a change of magnetic force of a magnet through a pair of yokes. The magnetic shunt body is assembled to a moving member, and elastically moves around the moving member resisting a first spring.Type: ApplicationFiled: October 2, 2008Publication date: April 9, 2009Inventors: Tomio Yamada, Masahiko Miyata, Katsuhide Kumagai, Tatsumi Ide, Yoshinori Ota
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Publication number: 20090072936Abstract: Magnetic attractive force of a magnet exerted on a movable contact in a sealing case through yokes changes as a result of movement of a magnetic shunt element induced by movement of a movable element located outside the sealing case. As a result, the movable contact can be brought into or out of contact with a stationary contact without involvement of entry of the movable element into the sealing case.Type: ApplicationFiled: April 22, 2008Publication date: March 19, 2009Applicants: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO, NEC TOKIN CorporationInventors: Tomio Yamada, Katsuhide Kumagai, Masahiko Miyata, Yoshinori Ota, Tatsumi Ide
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Patent number: 7468294Abstract: A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting the chip parts and the substrate terminals of the module substrate by soldering, gold wires for connecting the pads of the semiconductor chips and corresponding substrate terminals of the module substrate, and a sealing portion formed with a low elasticity resin such as an insulative silicone resin or a low elasticity epoxy resin for covering the semiconductor chips, chip parts, solder connection portions and gold wires which prevents flow out of the solder in the solder connection portion by re-melting thereby preventing short-circuit.Type: GrantFiled: November 10, 2004Date of Patent: December 23, 2008Assignee: Hitachi, Ltd.Inventors: Masashi Yamaura, Hirokazu Nakajima, Nobuyoshi Maejima, Mikio Negishi, Tomio Yamada, Tomomichi Koizumi, Tsuneo Endoh