Patents by Inventor Tomiya Abe

Tomiya Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220145060
    Abstract: An electric wire uses a thermoplastic fluororesin composition as an insulating layer covering a periphery of a conductor. The thermoplastic fluororesin composition includes a fluororubber, a fluororesin and a compatibilizer. The fluororesin includes a first fluororesin constituted by perfluoroalkoxy alkane having a melting point of 280° C. or more and 290° C. or less, and the compatibilizer is a terpolymer of tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride. A weight ratio (%) of the fluororubber to the fluororesin ranges from 20:80 to 60:40, and the fluororubbers are crosslinked to one another by dynamic crosslinking.
    Type: Application
    Filed: January 27, 2022
    Publication date: May 12, 2022
    Inventors: lkuo SEKI, Takashi AOYAMA, Tomiya ABE
  • Publication number: 20200123369
    Abstract: A thermoplastic fluororesin composite that is excellent in mechanical property and heat resistance, and an electric wire and a cable using the thermoplastic fluororesin composite are provided. A method of manufacturing a thermoplastic fluororesin composite includes: a step (double bond forming step) of kneading a mixture containing a fluoro-rubber, a compatibilizer and a crosslinking accelerator to form a double bond in the fluoro-rubber by dehydrofluorination reaction; a step (fluororesin kneading step) of kneading a first product generated in the double bond forming step and a fluororesin; and a step (dynamic crosslinking step) of kneading a second product generated in the fluororesin kneading step and a polyol crosslinker to dynamically crosslink the fluoro-rubber in the second product.
    Type: Application
    Filed: October 9, 2019
    Publication date: April 23, 2020
    Inventors: Ikuo SEKI, Takashi AOYAMA, Tomiya ABE, Ryutaro KIKUCHI
  • Publication number: 20200109274
    Abstract: An electric wire uses a thermoplastic fluororesin composition as an insulating layer covering a periphery of a conductor. The thermoplastic fluororesin composition includes a fluororubber, a fluororesin and a compatibilizer. The fluororesin includes a first fluororesin constituted by perfluoroalkoxy alkane having a melting point of 280° C. or more and 290° C. or less, and the compatibilizer is a terpolymer of tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride. A weight ratio (%) of the fluororubber to the fluororesin ranges from 20:80 to 60:40, and the fluororubbers are crosslinked to one another by dynamic crosslinking.
    Type: Application
    Filed: April 18, 2019
    Publication date: April 9, 2020
    Inventors: lkuo SEKI, Takashi AOYAMA, Tomiya ABE
  • Patent number: 9484124
    Abstract: An insulated electric wire includes a conductor and an insulating coating provided around a perimeter of the conductor. The insulating coating includes a first insulating coating film around the perimeter of the conductor, the first insulating coating film being formed of a resin containing an imide structure in its molecule, and a second insulating coating film around a perimeter of the first insulating coating film, the second insulating coating film being formed of a polyimide resin comprising a repeat unit represented by Formula 1, and having an imide concentration of not less than 15% and not more than 36%, wherein R1 is a tetravalent group derived from decarboxylation of an aromatic tetracarboxylic acid, and R2 is a divalent group derived from deamination of an aromatic diamine.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: November 1, 2016
    Assignee: HITACHI METALS, LTD.
    Inventors: Yuki Honda, Shuta Nabeshima, Takami Ushiwata, Tomiya Abe, Hideyuki Kikuchi
  • Patent number: 9376596
    Abstract: There is provided an adhesive film, comprising: an insulator film; an adhesive layer formed on the insulator film; and an intermediate adhesive layer interposed between the insulator film and the adhesive layer, wherein the intermediate adhesive layer is made of a mixed resin composition of a copolyamide being a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and a non-crystalline resin, and the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts. wt. or more and 250 pts. wt. or less with respect to 100 pts. wt. of the mixed resin composition.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: June 28, 2016
    Assignee: HITACHI METALS, LTD.
    Inventors: Daisuke Shanai, Tomiya Abe
  • Patent number: 9368254
    Abstract: An adhesive resin composition includes 60 to 95 parts by mass of amorphous thermoplastic polyester-based resin (A), 5 to 40 parts by mass of polyphenylene ether-based polymer (B) including a hydroxyl group and a repeating unit of 2,6-dimethylphenylene ether in a molecule thereof, and 60 to 200 parts by mass of a flame retardant per total 100 parts by mass of the amorphous thermoplastic polyester based resin (A) and the polyphenylene ether-based polymer (B).
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: June 14, 2016
    Assignee: Hitachi Metals, Ltd.
    Inventors: Daisuke Shanai, Tomiya Abe
  • Patent number: 9309119
    Abstract: There is provided a producing method of metal fine particles or metal oxide fine particles for producing metal fine particles or metal oxide fine particles by atomizing raw materials by performing processes including an oxidizing process and a reducing process to the raw materials composed of metal or a metal compound.
    Type: Grant
    Filed: March 23, 2011
    Date of Patent: April 12, 2016
    Assignee: HITACHI METALS, LTD.
    Inventors: Yamato Hayashi, Yoshihiro Sekiguchi, Hirotsugu Takizawa, Dai Ishikawa, Tomiya Abe
  • Patent number: 9156979
    Abstract: An insulated wire uses a resin composition. The insulated wire includes a conductor; and an insulating material provided on the conductor, the insulating material includes a polyester resin in 100 parts by weight, a non-bromine flame retardant agent in 1-30 parts by weight, a polyorganosiloxane core-graft copolymer in 1-50 parts by weight, an inorganic porous filler in 0.1-50 parts by weight; and a hydrolysis resistance modifier in 0.05-10 parts by weight.
    Type: Grant
    Filed: November 25, 2008
    Date of Patent: October 13, 2015
    Assignee: HITACHI METALS, LTD.
    Inventors: Kenichiro Fujimoto, Tomiya Abe, Kentaro Segawa, Hitoshi Kimura, Katsuhisa Shishido, Akira Suzuki, Takuya Suzuki
  • Patent number: 9034475
    Abstract: Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: May 19, 2015
    Assignee: Hitachi Metals, Ltd.
    Inventors: Satoru Amou, Tomiya Abe, Daisuke Shanai, Hiroaki Komatsu, Kenichi Murakami
  • Patent number: 9028970
    Abstract: Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: May 12, 2015
    Assignee: Hitachi Metals, Ltd.
    Inventors: Satoru Amou, Tomiya Abe, Daisuke Shanai, Hiroaki Komatsu, Kenichi Murakami
  • Patent number: 8975522
    Abstract: The adhesive film includes an insulating film, an adhesive layer provided over one side of the insulating film, and an anchor coat layer provided between the one side of the insulating film and the adhesive layer. The adhesive layer is a copolymer polyamide resin which is soluble in a solvent at 25 degrees Celsius and has a melting point of 100 degrees Celsius or more and 150 degrees Celsius or less. The anchor coat layer enhances the adhesion between the insulating film and the adhesive layer.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: March 10, 2015
    Assignee: Hitachi Metals, Ltd.
    Inventors: Daisuke Shanai, Tomiya Abe
  • Patent number: 8852463
    Abstract: A metal fine particle for a conductive metal paste includes a protective agent covering a surface of the metal fine particle. An amount of heat generated per unit mass (g) of the metal fine particle is not less than 500 J at a temperature of an external heat source temperature in a range of 200° C. to 300° C. when being calcined by the external heat source. The protective agent includes at least one selected from the group consisting of dipropylamine, dibutylamine, triethylamine, tripropylamine, tributylamine, butanethiol, pentanethiol, hexanethiol, heptanethiol, octanethiol, nonanethiol, decanethiol, undecanethiol and dodecanethiol. The content of the protective agent is in a range of 0.1 to 20% by mass with respect to the mass of the metal fine particle.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: October 7, 2014
    Assignee: Hitachi Metals, Ltd.
    Inventors: Dai Ishikawa, Tomiya Abe
  • Patent number: 8816207
    Abstract: The invention provides a coaxial cable including an internal insulating layer formed on an outer periphery of an electric conductor, a conductive layer formed on an outer periphery of the internal insulating layer, and an external insulating layer formed on an outer periphery of the conductive layer. The conductive layer is made of a metal nanoparticle paste sintered body obtained by sintering metal nanoparticles by irradiation of light toward a metal nanoparticles paste.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: August 26, 2014
    Assignee: Hitachi Cable, Ltd.
    Inventors: Tomiya Abe, Dai Ishikawa, Masanobu Ito, Tadayoshi Tsuchiya
  • Publication number: 20140158398
    Abstract: An adhesive resin composition includes 60 to 95 parts by mass of amorphous thermoplastic polyester-based resin (A), 5 to 40 parts by mass of polyphenylene ether-based polymer (B) including a hydroxyl group and a repeating unit of 2,6-dimethylphenylene ether in a molecule thereof, and 60 to 200 parts by mass of a flame retardant per total 100 parts by mass of the amorphous thermoplastic polyester based resin (A) and the polyphenylene ether-based polymer (B).
    Type: Application
    Filed: December 6, 2013
    Publication date: June 12, 2014
    Applicant: Hitachi Metals, Ltd.
    Inventors: Daisuke SHANAI, Tomiya ABE
  • Patent number: 8741441
    Abstract: An insulated wire includes a conductor, and an insulating covering layer formed on a periphery of the conductor and including two or more insulating coatings. The insulating coatings include a polyamide-imide resin insulating material represented by chemical formula 1: where R indicates a divalent aromatic diamine including three or more aromatic rings. The insulating coatings are formed by applying and baking the polyamide-imide resin insulating material, and the polyamide-imide resin insulating material is obtained by reacting an imide group containing dicarboxylic acid with a diisocyanate, the imide group containing dicarboxylic acid being obtained by dehydration reaction of a diamine comprising a divalent aromatic diamine including three or more aromatic rings with an acid using an azeotropic solvent.
    Type: Grant
    Filed: July 2, 2010
    Date of Patent: June 3, 2014
    Assignee: Hitachi Metals, Ltd.
    Inventors: Yuki Honda, Tomiya Abe, Hideyuki Kikuchi, Daisuke Hino
  • Patent number: 8722137
    Abstract: A hydrated water-absorption polymer containing resin composition includes a liquid cross-link curable resin composition, and a water-absorption polymer dispersed in the liquid cross-link curable resin composition. The water-absorption polymer is preliminarily hydrated and swollen. The water-absorption polymer before being hydrated and swollen includes an average particle diameter of not more than 10 ?m. The water-absorption polymer includes an amount of water absorption of 10 to 100 g/g.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: May 13, 2014
    Assignee: Hitachi Metals, Ltd.
    Inventors: Yoshihisa Kato, Yuki Honda, Tomiya Abe, Takao Miwa
  • Patent number: 8679628
    Abstract: There is provided an insulated wire equipped with an insulation film made of polymer alloy, the polymer alloy comprising an amorphous thermosetting resin and an amorphous thermoplastic resin, in which: the insulation film has a sea-island structure; the amorphous thermosetting resin is a sea component of the sea-island structure; and the amorphous thermoplastic resin is an island component of the sea-island structure.
    Type: Grant
    Filed: June 16, 2010
    Date of Patent: March 25, 2014
    Assignees: Hitachi Cable, Ltd., Hitachi Metals, Ltd.
    Inventors: Yuki Honda, Tomiya Abe, Hideyuki Kikuchi, Daisuke Hino
  • Patent number: 8642179
    Abstract: An insulating varnish includes a polyamide-imide resin including a repeat unit represented by Formula (1) below derived from a synthesis reaction between a resin component (X) and a diisocyanate component (Y). The resin component (X) is derived from a synthesis reaction between a diamine component including aromatic diamines including g a divalent aromatic group (R) including three or more aromatic rings, and an acid component in the presence of an azeotrope solvent. The diisocyanate component (Y) includes a 2,4?-diphenylmethane diisocyanate (Y1) and a 4,4?-diphenylmethane diisocyanate (Y2). In Formula (1), R denotes the divalent aromatic group including three or more aromatic rings, and m and n denote an integer of from 1 to 99.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: February 4, 2014
    Assignee: Hitachi Cable, Ltd.
    Inventors: Shuta Nabeshima, Yuki Honda, Tomiya Abe, Hideyuki Kikuchi, Yasuhiro Funayama
  • Patent number: 8629352
    Abstract: There is provided an enameled insulated wire, which includes: a metal conductor; an intermediate layer around the metal conductor, the intermediate layer containing metal oxide particles, the metal oxide particles including at least one oxide selected from a group consisting of zinc oxides, tin oxides, compound oxides of zinc and the metal constituent of the metal conductor, and compound oxides of tin and the metal constituent of the metal conductor, diameter of the metal oxide particles being predominantly from 1 to 50 nm; and an insulation coating around the intermediate layer.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: January 14, 2014
    Assignees: Hitachi Cable, Ltd., Hitachi, Ltd.
    Inventors: Yoshiyuki Ando, Tomiya Abe, Shigehisa Motowaki, Ryoichi Kajiwara
  • Patent number: 8569628
    Abstract: There is provided an insulated wire having an insulation film composed of a plurality of layers provided on a conductor, in which: the insulation film includes a first film layer and a second film layer; the first film layer is made of a first resin composition formed by graft-polymerizing a graft compound with an ethylene-tetrafluoroethylene copolymer and is provided on a circumference of the conductor; and the second film layer is made of a second resin composition being a polymer alloy made of a polyphenylene sulfide resin and a polyamide resin, or being a polymer alloy made of a polyether ether ketone resin and a polyamide resin and is provided on a circumference of the first film layer.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: October 29, 2013
    Assignees: Hitachi Cable, Ltd., Hitachi Magnet Wire Corp.
    Inventors: Tomiya Abe, Takanori Yamazaki, Kiyoshi Watanabe, Hideyuki Kikuchi, Takahiko Hanada, Daisuke Hino