Abstract: A high density multiprobe including a multiprobe on a semiconductor substrate with contact pads selectively positioned in relation to the contacts of a device to be tested. Each of the selectively positioned contacts on the multiprobe semiconductor substrate include an elevated conductive surface that makes physical and electrical contact with the contacts of the device to be tested. In addition, the elevated conductive surfaces on the multiprobe are conductively connected to interface terminals on the semiconductor substrate to allow test signals to be input and output from the multiprobe device during testing. The multiprobe semiconductor substrate is also capable of containing onboard circuitry including buffers and logic circuitry for processing the test signals to be sent to and received from the device under test. A multiprobe testing device is also disclosed that includes the multiprobe semiconductor substrate with elevated contacts to allow for the testing of a semiconductor device.