Patents by Inventor Tomoaki Saiki

Tomoaki Saiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11634545
    Abstract: A solution is prepared that contains (A) a polymer compound that includes at least one of a hydrolyzable polymer compound or a thermally-decomposable polymer compound, (B) an oxoacid-based compound that includes at least one of a phosphate-based compound, a sulfate-based compound, a sulfonate-based compound, or a perchlorate-based compound, and (C) a laminate of layered substances, and the solution is irradiated with at least one of sonic waves or radio waves, or the solution is heated.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: April 25, 2023
    Assignee: ADEKA CORPORATION
    Inventors: Atsushi Kobayashi, Ryo Taniuchi, Tomoaki Saiki
  • Publication number: 20210269644
    Abstract: Provided is an exfoliated layered substance that has favorable dispersibility when added to a resin or the like and has an effect of significantly improving the properties of the resin or the like. There is provided a composite material in which the surface of an exfoliated layered substance is coated with a coating substance, wherein the coating substance is at least one substance selected from the group consisting of an antioxidant, a UV absorber, a hindered amine light stabilizer, a flame retardant, a plasticizer, a lubricant, a surfactant, a polyoxypropylene compound, a radically polymerized polymer having a hydrophilic unit and a hydrophobic unit, a process oil, and a quaternary ammonium salt compound, and the coating substance is contained in an amount of 0.1 to 100 parts by mass, with respect to 100 parts by mass of the exfoliated layered substance.
    Type: Application
    Filed: July 29, 2019
    Publication date: September 2, 2021
    Inventors: Hideyuki YOKOTA, Yuta NOHARA, Tomoaki SAIKI, Ryo TANIUCHI, Toru YANO
  • Publication number: 20210269650
    Abstract: Provided is a method for producing a composite material in which the dispersibility of an exfoliated layered substance in a resin or the like is improved and with which a synthetic resin having significantly improved properties, such as impact resistance, can be obtained. A method for producing a composite material including an exfoliated layered substance and a coating substance coating a surface of the exfoliated layered substance includes a disintegrating step of disintegrating secondary particles of an exfoliated layered substance in a solution containing a coating substance, or a method for producing a composite material including an exfoliated layered substance and a coating substance coating a surface of the exfoliated layered substance includes a disintegrating step of disintegrating secondary particles of an exfoliated layered substance in a solvent and a dissolving step of dissolving a coating substance in a dispersion containing the exfoliated layered substance that has been disintegrated.
    Type: Application
    Filed: July 29, 2019
    Publication date: September 2, 2021
    Inventors: Tomoaki SAIKI, Ryo TANIUCHI, Yuta NOHARA, Hikaru TATEISHI, Hideyuki YOKOTA, Toru YANO
  • Publication number: 20210221689
    Abstract: Provided is a composite material that has improved dispersibility of an exfoliated layered substance in a resin or the like and can thus significantly improve the properties, such as impact resistance, of a synthetic resin. A composite material in which the surface of an exfoliated layered substance is coated with a compound having a reactive group, wherein the compound having a reactive group is a compound having at least one reactive group selected from the group consisting of an epoxy group, an oxetanyl group, an isocyanate group, an acrylic group, a methacrylic group, a vinyl ether group, a vinyl ester group, and a hydrolyzable silyl group, and the compound having a reactive group is contained in an amount of 0.1 to 100 parts by mass, with respect to 100 parts by mass of the exfoliated layered substance.
    Type: Application
    Filed: July 29, 2019
    Publication date: July 22, 2021
    Inventors: Tomoaki SAIKI, Hideyuki YOKOTA, Ryo TANIUCHI, Toru YANO
  • Publication number: 20190322816
    Abstract: A solution is prepared that contains (A) a polymer compound that includes at least one of a hydrolyzable polymer compound or a thermally-decomposable polymer compound, (B) an oxoacid-based compound that includes at least one of a phosphate-based compound, a sulfate-based compound, a sulfonate-based compound, or a perchlorate-based compound, and (C) a laminate of layered substances, and the solution is irradiated with at least one of sonic waves or radio waves, or the solution is heated.
    Type: Application
    Filed: December 18, 2017
    Publication date: October 24, 2019
    Applicant: ADEKA CORPORATION
    Inventors: Atsushi KOBAYASHI, Ryo TANIUCHI, Tomoaki SAIKI
  • Publication number: 20180375445
    Abstract: A converter includes a first electrode, a second electrode, a dielectric elastomer film, and a high-dielectric-constant film. The dielectric elastomer film is disposed between the first electrode and the second electrode, and has relative dielectric constant ?1. The high-dielectric-constant film is disposed at one or both of: a location between the first electrode and the dielectric elastomer film; and a location between the second electrode and the dielectric elastomer film. The high-dielectric-constant film has relative dielectric constant ?2 that is higher than the relative dielectric constant ?1.
    Type: Application
    Filed: January 6, 2017
    Publication date: December 27, 2018
    Applicants: KCM CORPORATION, ADEKA CORPORATION
    Inventors: Noriyuki OYA, Hideyuki YOKOTA, Masatoshi HOMMA, Keiichi ODAGIRI, Hiromi TAKENOUCHI, Tomoaki SAIKI, Seiki CHIBA, Mikio WAKI
  • Patent number: 9403925
    Abstract: Provided are: a curable composition from which a cured article having excellent molding processability and high heat resistance as well as such a high Tg that it can be used as a molding resin for a SiC power semiconductor can be obtained; and a cured article thereof. The curable composition comprises: 100 parts by mass of a compound having at least two partial structures represented by the following Formula (1) in the molecule as a component (A); 0.5 to 3 parts by mass of a thermal radical generator as a component (B); and 0 to 50 parts by mass of other radical-reactive compound as a component (C): (wherein, ring A represents a benzene ring or a cyclohexyl ring; R1 represents an alkylene group having 1 to 6 carbon atoms; R2 represents an alkyl group having 1 to 4 carbon atoms; a represents a number of 0 or 1; b represents an integer of 0 to 3; and c represents a number of 1 or 2).
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: August 2, 2016
    Assignee: ADEKA CORPORATION
    Inventors: Kenichiro Hiwatari, Atsuo Tomita, Tomoaki Saiki, Kiyoshi Murata
  • Patent number: 8937122
    Abstract: A compound has excellent thermal resistance and compatibility with resins, improves thermal resistance of resins, and specifically provides a compound represented by the following general formula (1). In formula (1), R1 to R4 each represent a C1-12 alkyl group or a C6-12 aryl group, y represents a number 1-2,000, and X1 represents a group represented by the formula (2) or (3). In formula (2), R5 represents a hydrogen atom, O., a C1-12 alkyl group or a C1-12 alkoxy group, L1 represents a C1-6 alkylene group or a C6-12 arylene group. In formula (3), R6 represents a C1-4 alkyl group or a C6-12 aryl group, X2 represents a group represented by the formula (2) or a hydrogen atom, s represents a number 2-6, L2 represents a C1-6 alkylene group or a C6-12 arylene group, and at least one of s number of X2s is the group represented by the formula (2).
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: January 20, 2015
    Assignee: Adeka Coporation
    Inventors: Ken-ichiro Hiwatari, Tomoaki Saiki
  • Publication number: 20140187715
    Abstract: Provided are: a curable composition from which a cured article having excellent molding processability and high heat resistance as well as such a high Tg that it can be used as a molding resin for a SiC power semiconductor can be obtained; and a cured article thereof. The curable composition comprises: 100 parts by mass of a compound having at least two partial structures represented by the following Formula (1) in the molecule as a component (A); 0.5 to 3 parts by mass of a thermal radical generator as a component (B); and 0 to 50 parts by mass of other radical-reactive compound as a component (C): (wherein, ring A represents a benzene ring or a cyclohexyl ring; R1 represents an alkylene group having 1 to 6 carbon atoms; R2 represents an alkyl group having 1 to 4 carbon atoms; a represents a number of 0 or 1; b represents an integer of 0 to 3; and c represents a number of 1 or 2).
    Type: Application
    Filed: August 24, 2012
    Publication date: July 3, 2014
    Applicant: ADEKA CORPORATION
    Inventors: Kenichiro Hiwatari, Atsuo Tomita, Tomoaki Saiki, Kiyoshi Murata
  • Publication number: 20130018132
    Abstract: A compound has excellent thermal resistance and compatibility with resins, improves thermal resistance of resins, and specifically provides a compound represented by the following general formula (1). In formula (1), R1 to R4 each represent a C1-12 alkyl group or a C6-12 aryl group, y represents a number 1-2,000, and X1 represents a group represented by the formula (2) or (3). In formula (2), R5 represents a hydrogen atom, O., a C1-12 alkyl group or a C1-12 alkoxy group, L1 represents a C1-6 alkylene group or a C6-12 arylene group. In formula (3), R6 represents a C1-4 alkyl group or a C6-12 aryl group, X2 represents a group represented by the formula (2) or a hydrogen atom, s represents a number 2-6, L2 represents a C1-6 alkylene group or a C6-12 arylene group, and at least one of s number of X2s is the group represented by the formula (2).
    Type: Application
    Filed: November 15, 2011
    Publication date: January 17, 2013
    Applicant: ADEKA CORPORATION
    Inventors: Ken-ichiro Hiwatari, Tomoaki Saiki