Patents by Inventor Tomoaki SHINOZUKA

Tomoaki SHINOZUKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board and method for manufacturing printed wiring board
    Patent number: 11277923
    Abstract: A printed wiring board includes a conductor layer, an outermost resin insulating layer having a first surface and a second surface on the opposite side with respect to the first surface and laminated on the conductor layer such that the second surface faces the conductor layer, and metal posts formed in the outermost resin insulating layer such that the metal posts are penetrating through the outermost resin insulating layer and reaching the conductor layer. The metal posts include first metal posts and second metal posts such that each of the first metal posts has a first upper surface positioned above the first surface of the outermost resin insulating layer and having an entirely flat surface and that each of the second metal posts has a second upper surface positioned above the first surface of the outermost resin insulating layer and having a partly flat surface.
    Type: Grant
    Filed: November 27, 2020
    Date of Patent: March 15, 2022
    Assignee: IBIDEN CO., LTD.
    Inventors: Yukinobu Mikado, Tomoaki Shinozuka
  • PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    Publication number: 20210176870
    Abstract: A printed wiring board includes a conductor layer, an outermost resin insulating layer having a first surface and a second surface on the opposite side with respect to the first surface and laminated on the conductor layer such that the second surface faces the conductor layer, and metal posts formed in the outermost resin insulating layer such that the metal posts are penetrating through the outermost resin insulating layer and reaching the conductor layer. The metal posts include first metal posts and second metal posts such that each of the first metal posts has a first upper surface positioned above the first surface of the outermost resin insulating layer and having an entirely flat surface and that each of the second metal posts has a second upper surface positioned above the first surface of the outermost resin insulating layer and having a partly flat surface.
    Type: Application
    Filed: November 27, 2020
    Publication date: June 10, 2021
    Applicant: IBIDEN CO., LTD.
    Inventors: Yukinobu MIKADO, Tomoaki SHINOZUKA