Abstract: An inductor component includes a base body including an insulator, an inductor wire extending inside the base body, extended electrodes connected to the inductor wire, each of the extended electrodes having a portion exposed to outside of the base body, and outer electrodes connected to respective ones of the extended electrodes. The base body, inductor wire, and extended electrodes form a component body. When a first sectional area is defined as an area of a section of the component body taken along a plane parallel to the bottom surface of the component body at an arbitrary position and when a second sectional area is defined as an area of another section of the component body taken along another plane parallel to the bottom surface closer to the bottom surface from the arbitrary position, the second sectional area is equal to or greater than the first sectional area.

Abstract: An electronic component includes a component body, a base electrode that has a surface exposed from the component body and contains at least one of silver and copper, an alloy layer deposited on the surface of the base electrode, and a nickel layer deposited on a surface of the alloy layer. The material of the alloy layer is an alloy containing nickel and tin.

Abstract: An electronic component includes a component body, a base electrode that has a surface exposed from the component body and contains at least one of silver and copper, an alloy layer deposited on the surface of the base electrode, and a nickel layer deposited on a surface of the alloy layer. The material of the alloy layer is an alloy containing nickel and tin.

Abstract: The monolithic ceramic electronic component includes a first external electrode 5, a second external electrode 6, and a ceramic sintered compact 4 including internal electrodes 2 and 3, the first and second external electrodes 5 and 6 being disposed on both end faces 4a and 4b of the ceramic sintered compact 4. The first and second external electrodes 5 and 6 have a multilayer structure in which sintered electrode layers 5a and 6a, intermediate electroplated layers 5b and 6b, and plated layers 5c and 6c are arranged in that order. Exposed surface regions 7a of insulating oxides 7 are exposed from the outer faces of the sintered electrode layers 5a and 6a, the oxides 7 being derived from a glass frit contained in the sintered electrode layers. Metals 8 are deposited on the exposed surface regions 7a and the intermediate electroplated layers 5b and 6b are then formed by electroplating.

Abstract: The monolithic ceramic electronic component includes a first external electrode 5, a second external electrode 6, and a ceramic sintered compact 4 including internal electrodes 2 and 3, the first and second external electrodes 5 and 6 being disposed on both end faces 4a and 4b of the ceramic sintered compact 4. The first and second external electrodes 5 and 6 have a multilayer structure in which sintered electrode layers 5a and 6a, intermediate electroplated layers 5b and 6b, and plated layers 5c and 6c are arranged in that order. Exposed surface regions 7a of insulating oxides 7 are exposed from the outer faces of the sintered electrode layers 5a and 6a, the oxides 7 being derived from a glass frit contained in the sintered electrode layers. Metals 8 are deposited on the exposed surface regions 7a and the intermediate electroplated layers 5b and 6b are then formed by electroplating.