Abstract: In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the plurality of p-type thermoelectric elements and n-type thermoelectric elements and the heat-radiating-side electrodes are joined together by solders. Heat-absorbing-side electrodes are brought into sliding contact with heat-absorbing-side end surfaces of these thermoelectric elements.

Abstract: In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the plurality of p-type thermoelectric elements and n-type thermoelectric elements and the heat-radiating-side electrodes are joined together by solders. Heat-absorbing-side electrodes are brought into sliding contact with heat-absorbing-side end surfaces of these thermoelectric elements.

Abstract: In order to make a thermoelectric device usable in a high temperature environment of 300° C. or above, the necessity for solder is eliminated by bonding each electrode of a second substrate to one end of each thermoelectric element by using gold. Further, a conductive member, capable of accommodating expansion and contraction of the thermoelectric elements, is provided between each electrode of a first substrate, on which bonding by gold is not performed, and the other end of each thermoelectric element. Additionally, a lid is placed outside to the second substrate, and the lid and the first substrate are coupled so that pressure can be applied between the first and second substrates. Thus, the second substrate, the electrodes and the thermoelectric elements are held. This prevents the thermoelectric elements from being damaged due to thermal deformation as in the case where electrodes are bonded to thermoelectric elements by solder.

Abstract: According to a method of manufacturing a semiconductor wafer and a semiconductor device, a rear surface of the semiconductor wafer is ground, and is dry—or wet—etched so that rear surfaces of semiconductor chips on the segmented semiconductor wafer have substantially equal surface roughness. The semiconductor chips are bonded onto a lead frame via bumps using thermo-compression and ultrasonic vibrations.

Abstract: In a thermoelectric device, metal fiber nets as conductive members having elasticity are placed between first electrodes and thermoelectric elements, in order to increase productivity and make it possible to reduce variations in performance without impairing the reliability of a slidable structure even if each component is heated to be thermally deformed. This placement prevents the temperature of the metal fiber nets from becoming high in the operation of the thermoelectric device and prevents the elasticity of the metal fiber nets from being lost. Further, this constitution eliminates the necessity for bonding the first electrodes to the thermoelectric elements using solder. Moreover, the elasticity of the metal fiber nets makes it possible to accommodate variations in height among the respective thermoelectric elements when the thermoelectric device is assembled.

Abstract: In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the plurality of p-type thermoelectric elements and n-type thermoelectric elements and the heat-radiating-side electrodes are joined together by solders. Heat-absorbing-side electrodes are brought into sliding contact with heat-absorbing-side end surfaces of these thermoelectric elements.

Abstract: A non-aqueous electrolytic secondary battery that can prevent a drop in the power even in a large current discharge is provided. Porosity of a separator is larger than or the same as porosity of a positive electrode mixture and a porosity of a negative electrode mixture. Particularly, the porosity of the positive electrode mixture is 20% to 50%, the porosity of the negative electrode mixture is 20% to 50%, and the porosity of the separator is 20% to 60%. The separator becomes rich in the volume of the electrolytic solution that infiltrates into interfacial aperture between the separator and the negative electrode. When the large current discharge is carried out in a short time, lithium-ions are released/occluded from the electrodes and the electrolytic solution can gain the released/occluded lithium-ions with a small interfacial resistance.

Abstract: In a stacked-type semiconductor unit having a plurality of semiconductor devices stacked on a base board including a base electrode, each semiconductor device has a wiring board including an external electrode provided in an end portion thereof. The semiconductor devices are stacked on the base board such that the external electrodes are aligned with one another. Then, the external electrodes are electrically connected to the base board by solder.

Abstract: A cylindrical lithium-ion battery with high safety, high capacity and high power has a winding group having a positive electrode, a negative electrode and at least one separator, and a connecting portion for connecting to respective terminals from the winding group accommodated in a battery container, and which is provided with an inner pressure-reducing mechanism for discharging gas according to an increase in inner pressure inside the battery container. The positive electrode includes a collector whose both surfaces are applied with composing material including lithium-manganese complex oxide, the thickness of the composing material on the both surfaces of the collector is at least 210 &mgr;m and the amount of the active material per one surface of the collector is at least 240 g/m2. The compounding ratio of the lithium-manganese complex oxide in the composing material is preferably at least 80 wt %.

Abstract: A non-aqueous electrolytic secondary battery that can prevent a drop in the power even in a large current discharge is provided. Porosity of a separator is larger than or the same as porosity of a positive electrode mixture and a porosity of a negative electrode mixture. Particularly, the porosity of the positive electrode mixture is 20% to 50%, the porosity of the negative electrode mixture is 20% to 50%, and the porosity of the separator is 20% to 60%. The separator becomes rich in the volume of the electrolytic solution that infiltrates into interfacial aperture between the separator and the negative electrode. When the large current discharge is carried out in a short time, lithium-ions are released/occluded from the electrodes and the electrolytic solution can gain the released/occluded lithium-ions with a small interfacial resistance.

Abstract: In a stacked-type semiconductor unit having a plurality of semiconductor devices stacked on a base board including a base electrode, each semiconductor device has a wiring board including an external electrode provided in an end portion thereof. The semiconductor devices are stacked on the base board such that the external electrodes are aligned with one another. Then, the external electrodes are electrically connected to the base board by solder.