Patents by Inventor Tomohiro JIROMARU

Tomohiro JIROMARU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate processing method
    Patent number: 8821737
    Abstract: A processing method of a substrate which includes: a first bonding step which bonds a ring-shaped first support member to a first surface of the substrate along the outer periphery of the substrate; a first processing step which processes the substrate; and a first separating step which separates the first support member from the substrate by separation at the bonded position.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: September 2, 2014
    Assignee: Seiko Epson Corporation
    Inventors: Tomohiro Jiromaru, Junichi Takeuchi
  • SUBSTRATE PROCESSING METHOD
    Publication number: 20120187084
    Abstract: A processing method of a substrate which includes: a first bonding step which bonds a ring-shaped first support member to a first surface of the substrate along the outer periphery of the substrate; a first processing step which processes the substrate; and a first separating step which separates the first support member from the substrate by separation at the bonded position.
    Type: Application
    Filed: January 25, 2012
    Publication date: July 26, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Tomohiro JIROMARU, Junichi TAKEUCHI