Patents by Inventor Tomohiro Nagai
Tomohiro Nagai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11971342Abstract: The sample preparation apparatus includes a measurement unit configured to measure a sample containing particles acquired from a sample container and detect measurement target particles in the sample, a sample preparation unit capable of adjusting the concentration of measurement target particles in a sample acquired from a sample container and configured to prepare a measurement sample by mixing a sample and any of a plurality of types of particle detection reagents including a particle labeling substance, and a control unit for controlling the sample preparation unit so as to generate concentration information of the measurement target particles in the sample in the sample container based on the measurement data of the measurement unit and adjust the concentration of the measurement target particles in the sample acquired from the sample container according to the generated concentration information and the type of particle detection reagent used for preparing the measurement sample.Type: GrantFiled: December 6, 2021Date of Patent: April 30, 2024Assignee: SYSMEX CORPORATIONInventors: Takaaki Nagai, Shinichiro Oguni, Tomohiro Tsuji
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Patent number: 11973380Abstract: An aspect of an electric pump of the present invention is an electric pump attached to a predetermined object. The electric pump includes a motor having a rotor rotatable about a center axis extending in an axial direction, a pump mechanism coupled to the rotor, a circuit board located radially outside the motor and having a plate face directed in a radial direction, an electrolytic capacitor attached to the plate face of the circuit board, and a housing that houses the motor, the pump mechanism, the circuit board, and the electrolytic capacitor therein. The housing has a mounting face attached to a predetermined object. The mounting face is a face directed radially outward. The plate face of the circuit board is disposed along a direction intersecting the mounting face. The electrolytic capacitor is disposed at a position closer to the mounting face than the center axis in the direction orthogonal to the mounting face.Type: GrantFiled: January 17, 2022Date of Patent: April 30, 2024Assignee: NIDEC TOSOK CORPORATIONInventors: Yoshiyuki Kobayashi, Tomohiro Sakata, Yuzo Nagai, Hideo Nagai
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Patent number: 11932506Abstract: The present invention provides a sheet stacking device, a counter-ejector, and a carton former and is provided with: a hopper unit that stacks cardboard boxes; feed rollers that feed a cardboard box to the hopper unit; a first blower device that blows air from above the hopper unit toward the cardboard box fed by the feed rollers; and a second blower device that blows air between the cardboard box stacked in the hopper unit and the cardboard box fed by the feed roller.Type: GrantFiled: December 11, 2019Date of Patent: March 19, 2024Assignee: MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, LTD.Inventors: Hiroyuki Kanazawa, Yoshitomo Noda, Tomohiro Akaki, Koshi Tanimoto, Hideaki Nagai, Makoto Shimohatsubo
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Patent number: 11876318Abstract: An electronic device includes a circuit boards that have a same or substantially same shape, and flat cables that have a same or substantially same shape. The circuit boards are provided in a predetermined arrangement and are connected by the flat cables. Each of the flat cables is a semi-rigid cable, having a shape in accordance with the predetermined arrangement of the circuit boards.Type: GrantFiled: May 14, 2021Date of Patent: January 16, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Tomohiro Nagai
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Publication number: 20230412624Abstract: An estimation device includes processing circuitry configured to generate a feature quantity by performing invertible transformation on a payload of a packet character by character with respect to each packet determined to be abnormal or normal by an abnormality detector, and give a determination result as to whether a packet is abnormal or normal to the generated feature quantity, learn a model that classifies whether the packet is abnormal or normal by machine learning using the feature quantity of the payload of the packet and the determination result as to whether the packet is abnormal or normal as teacher data, extract a number of dimensions of the feature quantity in which a contribution degree to classification is equal to or greater than a predetermined value in the learned model, and estimate a cause part of abnormality in the payload of the packet determined to be abnormal.Type: ApplicationFiled: November 19, 2020Publication date: December 21, 2023Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Tomohiro NAGAI, Masanori YAMADA, Tomokatsu TAKAHASHI, Yasuhiro TERAMOTO, Yuki YAMANAKA
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Publication number: 20230328883Abstract: A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.Type: ApplicationFiled: June 13, 2023Publication date: October 12, 2023Inventor: Tomohiro NAGAI
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Publication number: 20230328884Abstract: A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.Type: ApplicationFiled: June 13, 2023Publication date: October 12, 2023Inventor: Tomohiro NAGAI
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Patent number: 11784383Abstract: A transmission line includes first, second, and third signal lines defining a parallel portion. No conductor connecting the first ground conductor and the second ground conductor is between the first signal line and the second signal line, and the first signal line is closer to the ground connection conductor than the second signal line. A closest frequency difference between a fundamental wave of one of the first signal and the second signal and a fundamental wave or a higher harmonic wave of the other of the first signal and the second signal is equal to or larger than a closest frequency difference between a fundamental wave of one of the first signal and the third signal and a fundamental wave or a higher harmonic wave of the other of the first signal and the third signal.Type: GrantFiled: September 2, 2021Date of Patent: October 10, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Tomohiro Nagai
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Publication number: 20230119857Abstract: A multilayer resin substrate includes resin layers that are laminated, a first copper foil on the resin layers and including first and second main surfaces having first and second surface roughnesses, respectively, and a second copper foil on the resin layers and including third and fourth main surfaces having third and fourth surface roughnesses, respectively. A distance between the first main surface and the second copper foil is shorter than a distance between the second main surface and the second copper foil. When the first, second, third, and fourth surface roughnesses are denoted as SR1, SR2, SR3, and SR4 respectively, a relationship SR1<SR3?SR4<SR2 is satisfied.Type: ApplicationFiled: December 15, 2022Publication date: April 20, 2023Inventors: Yoshimasa NISHI, Tomohiro NAGAI
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Publication number: 20230100141Abstract: A transmission line includes an element body and a signal conductor layer in the element body and having a linear shape. The transmission line includes a first, second, and third impedance sections, an impedance conversion section, and a reflection section. The second impedance section, the reflection section, the first impedance section, the impedance conversion section, and the third impedance section are positioned in this order along the signal conductor layer. Characteristic impedance of the first impedance section is lower than characteristic impedance in the second impedance section and characteristic impedance in the third impedance section. A change amount of characteristic impedance per unit length in the reflection section is larger than a change amount of characteristic impedance per unit length in the impedance conversion section.Type: ApplicationFiled: November 30, 2022Publication date: March 30, 2023Inventors: Ryutatsu MIZUKAMI, Shuichi KEZUKA, Kuniaki YOSUI, Tomohiro NAGAI
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Publication number: 20230068119Abstract: An electronic device includes a first substrate and a second substrate. On or in the first substrate, a signal conductor extending in a transmission direction of a high-frequency signal and including a turn portion when viewed in plan is provided. On or in the second substrate, a base overlapping the signal conductor in plan view and including a turn portion while extending along the signal conductor is provided. The base is defined by, for example, a metal plate, has electrical conductivity, and serves as a ground conductor. A gap is provided between the signal conductor and the base having electrical conductivity.Type: ApplicationFiled: November 9, 2022Publication date: March 2, 2023Inventors: Tomohiro NAGAI, Nobuo IKEMOTO
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Publication number: 20230036907Abstract: A multilayer substrate module includes a first substrate portion including a first substrate portion body including first insulator layers stacked in a vertical direction and a first conductor layer and/or a first interlayer connection conductor provided at the first substrate portion body. A second substrate portion includes a second substrate portion body including second insulator layers stacked in the vertical direction and a second conductor layer and a second interlayer connection conductor provided at the second substrate portion body, and is mounted on an upper surface of the first substrate portion. A mount device is mounted on an upper surface or a lower surface of the second substrate portion. At least a portion of an inductance component is defined by the first conductor layer and the first interlayer connection conductor.Type: ApplicationFiled: October 11, 2022Publication date: February 2, 2023Inventors: Noriaki OKUDA, Tomohiro NAGAI, Kosuke NISHIO
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Patent number: 11553588Abstract: A transmission line board includes an insulating substrate including a first principal surface, first and second signal lines, first and second signal electrodes, which are provided at the insulating substrate. The first signal electrode is connected to the first signal line, and is connected by capacitive coupling to a different circuit board. The second signal electrode is connected to the second signal line, and is connected to the different circuit board via a conductive binder. The first signal line is provided to transmit a signal in a first frequency band, and the second signal line is provided to transmit a signal in a second frequency band lower than the first frequency band.Type: GrantFiled: February 11, 2021Date of Patent: January 10, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Tomohiro Nagai, Kazuhiro Yamaji, Shigeru Tago
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Publication number: 20220285808Abstract: A distributed constant filter includes a resonator that is not grounded and a first ground electrode. The first ground electrode faces the resonator in a first direction (Z). The resonator is a distributed constant line resonator. The resonator includes a plurality of distributed constant lines and a via conductor. The plurality of distributed constant lines are arranged in layers in the first direction (Z). The via conductor extends in the first direction (Z). Each of the plurality of distributed constant lines is connected to the via conductor only at one end portion of both end portions of the distributed constant line.Type: ApplicationFiled: May 26, 2022Publication date: September 8, 2022Applicant: Murata Manufacturing Co., Ltd.Inventors: Yoshinori TAGUCHI, Kengo ONAKA, Hitoshi TADA, Yasuo YAMADA, Muneyoshi YAMAMOTO, Tomohiro NAGAI, Keiichi HIROSE
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Publication number: 20220270804Abstract: A transmission line component includes an insulation substrate, signal line conductors, and a common-mode choke coil. The insulation substrate is made of a flexible material, and has a shape extending in a first direction. The signal line conductors are on or in the insulation substrate, and extend mainly in the first direction. The common-mode choke coil includes linear conductors on or in the insulation substrate, and is connected to the signal line conductors. The insulation substrate includes a first signal line portion in which the signal line conductors are provided, and a coil portion in which the common-mode choke coil is provided in the first direction. The insulation substrate includes a bent portion in the first signal line portion.Type: ApplicationFiled: May 10, 2022Publication date: August 25, 2022Inventors: Noriaki OKUDA, Kosuke NISHIO, Tomohiro NAGAI
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Publication number: 20220200118Abstract: A transmission line includes a first interlayer connection conductor connecting a first signal conductor and a first mounting electrode, a second interlayer connection conductor connecting a second signal conductor and a second mounting electrode, a third and fourth interlayer connection conductors respectively including third and fourth interlayer connection conductors, and each connecting first and second ground conductors between the first and second signal conductors.Type: ApplicationFiled: March 15, 2022Publication date: June 23, 2022Inventors: Tomohiro NAGAI, Nobuyuki TENNO
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Patent number: 11291125Abstract: A multilayer substrate includes a laminate, first and second signal lines, first and second ground conductors, and interlayer connection conductors. The first and second signal lines extend along a transmission direction and include parallel extending portions that extend in parallel or substantially in parallel with each other. The first and second ground conductors sandwich the first and second signal lines in a laminating direction. The first and second ground conductors respectively include a first opening and a third opening between the signal lines when viewed from the laminating direction, and respectively include second openings and fourth openings disposed outside in a width direction orthogonal or substantially orthogonal to the transmission direction in the parallel extending portions when viewed from the laminating direction. The interlayer connection conductors are disposed in the transmission direction and at least between the signal lines.Type: GrantFiled: November 16, 2020Date of Patent: March 29, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Tomohiro Nagai, Shigeru Tago, Kazuhiro Yamaji
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Patent number: 11246214Abstract: A resin multilayer board includes an insulating substrate including a first main surface and mounting electrodes only on the first main surface. The insulating substrate includes first and second resin layers that are laminated. The Young's modulus of the second resin layers is higher than that of the first resin layers. The first and second resin layers are arranged in a distributed manner along a lamination direction of the first and second resin layers. The insulating substrate includes a first and second portions that are two equally divided portions of the insulating substrate in the lamination direction and are respectively positioned closer to the first main surface and farther from the first main surface, and a volume ratio of the second resin layers in the first portion is higher than a volume ratio of the second resin layers in the second portion.Type: GrantFiled: February 26, 2021Date of Patent: February 8, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Tomohiro Nagai, Shigeru Tago
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Publication number: 20210399398Abstract: A transmission line includes first, second, and third signal lines defining a parallel portion. No conductor connecting the first ground conductor and the second ground conductor is between the first signal line and the second signal line, and the first signal line is closer to the ground connection conductor than the second signal line. A closest frequency difference between a fundamental wave of one of the first signal and the second signal and a fundamental wave or a higher harmonic wave of the other of the first signal and the second signal is equal to or larger than a closest frequency difference between a fundamental wave of one of the first signal and the third signal and a fundamental wave or a higher harmonic wave of the other of the first signal and the third signal.Type: ApplicationFiled: September 2, 2021Publication date: December 23, 2021Inventor: Tomohiro NAGAI
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Publication number: 20210274651Abstract: A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.Type: ApplicationFiled: May 17, 2021Publication date: September 2, 2021Inventor: Tomohiro NAGAI