Abstract: A vibration damping system comprises a vibration applying device mounted on a frame and a control device that controls the vibration applying device, the control device comprising a voltage command producing part that produces a driving voltage command to drive the vibration applying device and a vibration failure diagnosis part that diagnoses whether there is failure based on a vibration detection signal output by a vibration detecting device, wherein the voltage command producing part produces the driving voltage command corresponding to a diagnosis frequency that is previously set at a frequency identical to a resonance frequency of the frame or the vibration applying device or at a predetermined frequency close to the resonance frequency and makes the vibration applying device generate the vibration applying force according to the driving voltage command, and the vibration failure diagnosis part diagnoses whether there is failure based on the vibration detection signal.

Abstract: A vibration damping system comprises a vibration applying device mounted on a frame and a control device that controls the vibration applying device, the control device comprising a voltage command producing part that produces a driving voltage command to drive the vibration applying device and a vibration failure diagnosis part that diagnoses whether there is failure based on a vibration detection signal output by a vibration detecting device, wherein the voltage command producing part produces the driving voltage command corresponding to a diagnosis frequency that is previously set at a frequency identical to a resonance frequency of the frame or the vibration applying device or at a predetermined frequency close to the resonance frequency and makes the vibration applying device generate the vibration applying force according to the driving voltage command, and the vibration failure diagnosis part diagnoses whether there is failure based on the vibration detection signal.

Abstract: A box-shaped enclosure of a storage box includes a deadening wall or walls defining a storage space between first and second planes. The storage space is open at the first and second planes. A deadening wall member extends along the first plane. An auxiliary box-shaped enclosure is connected to the box-shaped enclosure so as to close the first plane of the box-shaped enclosure. The auxiliary box-shaped enclosure defines an auxiliary space isolated from the storage space with a deadening wall member. The storage space is connected to the fresh air through the ventilation opening and the auxiliary space. The deadening wall or walls of the box-shaped enclosure and the deadening wall member serve to prevent the leakage of the operating sound.

Abstract: A box-shaped enclosure of a storage box includes a deadening wall or walls defining a storage space between first and second planes. The storage space is open at the first and second planes. A deadening wall member extends along the first plane. An auxiliary box-shaped enclosure is connected to the box-shaped enclosure so as to close the first plane of the box-shaped enclosure. The auxiliary box-shaped enclosure defines an auxiliary space isolated from the storage space with a deadening wall member. The storage space is connected to the fresh air through the ventilation opening and the auxiliary space. The deadening wall or walls of the box-shaped enclosure and the deadening wall member serve to prevent the leakage of the operating sound.

Abstract: A box-shaped enclosure of a storage box includes a deadening wall or walls defining a storage space between first and second planes. The storage space is open at the first and second planes. A deadening wall member extends along the first plane. An auxiliary box-shaped enclosure is connected to the box-shaped enclosure so as to close the first plane of the box-shaped enclosure. The auxiliary box-shaped enclosure defines an auxiliary space isolated from the storage space with a deadening wall member. The storage space is connected to the fresh air through the ventilation opening and the auxiliary space. The deadening wall or walls of the box-shaped enclosure and the deadening wall member serve to prevent the leakage of the operating sound.

Abstract: A box-shaped enclosure of a storage box includes a deadening wall or walls defining a storage space between first and second planes. The storage space is open at the first and second planes. A deadening wall member extends along the first plane. An auxiliary box-shaped enclosure is connected to the box-shaped enclosure so as to close the first plane of the box-shaped enclosure. The auxiliary box-shaped enclosure defines an auxiliary space isolated from the storage space with a deadening wall member. The storage space is connected to the fresh air through the ventilation opening and the auxiliary space. The deadening wall or walls of the box-shaped enclosure and the deadening wall member serve to prevent the leakage of the operating sound.

Abstract: The objective of this invention is to provide an ultrasonic flip-chip mounting method with little variance in the formed electrode joints between a semiconductor chip and a substrate. The ultrasonic method for mounting a flip chip of the present invention may include a step for forming several bump electrodes (106) on the main surface of one side of a semiconductor chip (100) and a step for respectively bringing several projecting electrodes (106) into contact with the corresponding conductor patterns (132) on a substrate and for applying ultrasonic vibration to the semiconductor chip, where the ultrasonic vibration direction is oriented in a direction oblique to the electrode patterns (132). In this way, an effective width for joining formation W1 is greater than the width of the conductor patterns W of the electrode patterns (132).

Abstract: A box-shaped enclosure of a storage box includes a deadening wall or walls defining a storage space between first and second planes. The storage space is open at the first and second planes. A deadening wall member extends along the first plane. An auxiliary box-shaped enclosure is connected to the box-shaped enclosure so as to close the first plane of the box-shaped enclosure. The auxiliary box-shaped enclosure defines an auxiliary space isolated from the storage space with a deadening wall member. The storage space is connected to the fresh air through the ventilation opening and the auxiliary space. The deadening wall or walls of the box-shaped enclosure and the deadening wall member serve to prevent the leakage of the operating sound.

Abstract: An object of the invention is to improve the position, shape, and size of a bump in order to realize highly reliable flip-chip mounting. In the case of the semiconductor device of this embodiment, a stacked bump 14 is provided on electrode pad 12 created on the main surface of semiconductor chip 10. That is, said bump 14 comprises columnar pedestal part 14a and columnar tail part 14b having a smaller diameter than that of pedestal part 14a. Peak plane of tail part 14b (peak plane of the bump) and the top surface of pedestal part 14a are both flat. Said bump 14 is created through gold plating, for example, using a resist (photolithography) technology and a plating technology.

Abstract: An object of the invention is to improve the position, shape, and size of a bump in order to realize highly reliable flip-chip mounting. In the case of the semiconductor device of this embodiment, a stacked bump 14 is provided on electrode pad 12 created on the main surface of semiconductor chip 10. That is, said bump 14 comprises columnar pedestal part 14a and columnar tail part 14b having a smaller diameter than that of pedestal part 14a. Peak plane of tail part 14b (peak plane of the bump) and the top surface of pedestal part 14a are both flat. Said bump 14 is created through gold plating, for example, using a resist (photolithography) technology and a plating technology.

Abstract: A semiconductor chip mounting method to prevent the occurrence of particles created while mounting the semiconductor chip onto a substrate using ultrasonic thermocompression bonding. The mounting method of the present invention utilizing ultrasonic vibrations involves the following steps: a semiconductor chip having conductive bumps on its main surface is held by its back via an elastic film using a suction tool having a suction hole, the semiconductor chip is positioned against a substrate provided with connection wires corresponding to said conductive bumps, and the semiconductor chip is mounted onto the substrate in such a manner that the conductive bumps connect to said connection wires, and ultrasonic vibrations are applied from the suction tool to the semiconductor chip via said film while said semiconductor chip is being pressed against said substrate in order to bond said conductive bumps with said connection wires.