Patents by Inventor Tomohiro SHIBASAKI

Tomohiro SHIBASAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11981525
    Abstract: A sheet processing device sandwiches a sheet-shaped medium in a two-ply sheet in which two sheets are overlaid and partially bonded. The sheet processing device includes a separator, a conveyor, and a switching member. The separator separates the two sheets of the two-ply sheet. The conveyor is disposed downstream from the separator in a sheet conveyance direction and conveys the two-ply sheet. The switching member is disposed downstream from the conveyor in the sheet conveyance direction. The switching member switches a conveyance path of the two-ply sheet to convey the two-ply sheet to a fixing path on which fixing processing is performed on the two-ply sheet or a non-fixing path on which no fixing processing is performed on the two-ply sheet.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: May 14, 2024
    Assignee: RICOH COMPANY, LTD.
    Inventors: Yoshito Suzuki, Tomohiro Furuhashi, Wataru Takahashi, Sho Asano, Shinya Monma, Joji Akiyama, Wataru Nozaki, Yohsuke Haraguchi, Yuji Suzuki, Yuusuke Shibasaki, Takuya Morinaga
  • Patent number: 11267204
    Abstract: The present invention relates to a band-like joint tape for covering a butting portion formed by butting an end portion of a one packing film to an end portion of another packing film and connecting the respective end portions of these packing films to each other. The joint tape is comprised of a laminate film formed by adhering a joint layer to a support layer at a peelable state, and covered so as to face the joint portion to the butting portion and heat-sealed so that the joint layer is fused to the butting portion and the fused portion of the joint layer is peeled off from the support layer.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: March 8, 2022
    Assignee: TAISEI LAMICK CO., LTD.
    Inventors: Naoki Yokoyama, Naoya Hamada, Tomohiro Shibasaki
  • Publication number: 20200223151
    Abstract: The present invention relates to a band-like joint tape for covering a butting portion formed by butting an end portion of a one packing film to an end portion of another packing film and connecting the respective end portions of these packing films to each other. The joint tape is comprised of a laminate film formed by adhering a joint layer to a support layer at a peelable state, and covered so as to face the joint portion. to the butting portion and heat-sealed so that the joint layer is fused to the butting portion and the fused portion of the joint layer is peeled off from the support layer.
    Type: Application
    Filed: September 24, 2019
    Publication date: July 16, 2020
    Applicant: TAISEI LAMICK CO., LTD.
    Inventors: Naoki YOKOYAMA, Naoya HAMADA, Tomohiro SHIBASAKI