Patents by Inventor Tomohiro Shimbo

Tomohiro Shimbo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6294035
    Abstract: A method of fabricating a thin-sheet-coated composite substrate bonds together a thin sheet and a substrate which unavoidably has an irregular thickness with an adhesive so that the outer surface of the thin sheet has the highest possible flatness. A surface plate having a flat surface of high flatness is held by a chuck included in a spinner with the flat surface facing upward. The thin sheet is placed on the surface plate in close contact with the flat surface of the surface plate. A liquid adhesive is dropped on the thin sheet and the substrate is placed on the adhesive. The chuck is rotated at high rotational speed to spread the adhesive in the space between the thin sheet and the substrate and to remove a surplus portion of the adhesive from the space between the thin sheet and the substrate by centrifugal force.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: September 25, 2001
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Tomohiro Shimbo