Patents by Inventor Tomohiro Shimono
Tomohiro Shimono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230206301Abstract: Provided is a member registration system which is configured to: receive a start request issued by a user in a first service to start member registration of a second service; display, when the start request is received, fields for the member registration on one page in the first service; and request, based on input to the one page from the user, a second service server associated with the second service to execute the member registration.Type: ApplicationFiled: December 19, 2022Publication date: June 29, 2023Applicant: Rakuten Group, Inc.Inventors: Shizuka ENDO, Tatsuko OKUNO, Mariko OGURA, Tomohiro SHIMONO, Junpei HIRAKAWA, Hideaki YOSHIURA, Taichi WATANABE
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Publication number: 20220251254Abstract: To provide a curable resin composition of which a cured product has excellent heat-resistance and dielectric properties, and a cured product thereof, and a prepreg, a circuit board, a build-up film, a semiconductor sealing material, and a semiconductor apparatus having both excellent heat resistance and dielectric properties. The invention has an indane scaffold represented by the following general formula (1): in formula (1), Ra's are each independently an alkyl group, an alkyloxy group or an alkylthio group, which has 1 to 10 carbon atoms, an aryl group, an aryloxy group or an arylthio group, which has 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group, and q represents an integer value of 0 to 4.Type: ApplicationFiled: February 20, 2020Publication date: August 11, 2022Applicant: DIC CorporationInventors: Tomohiro Shimono, Tatsuya Okamoto
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Patent number: 11117872Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having the layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.Type: GrantFiled: November 24, 2016Date of Patent: September 14, 2021Assignee: DIC CorporationInventors: Tomohiro Shimono, Kazuo Arita, Junji Yamaguchi, Masato Otsu
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Patent number: 11117873Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.Type: GrantFiled: November 24, 2016Date of Patent: September 14, 2021Assignee: DIC CorporationInventors: Kazuo Arita, Tomohiro Shimono, Masato Otsu, Junji Yamaguchi, Etsuko Suzuki
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Patent number: 11104788Abstract: An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.Type: GrantFiled: December 14, 2017Date of Patent: August 31, 2021Assignee: DIC CorporationInventors: Masato Otsu, Kazuo Arita, Etsuko Suzuki, Junji Yamaguchi, Tomohiro Shimono
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Patent number: 11028059Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.Type: GrantFiled: November 24, 2016Date of Patent: June 8, 2021Assignee: DIC CorporationInventors: Tomohiro Shimono, Junji Yamaguchi, Masato Otsu, Kazuo Arita
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Patent number: 10981865Abstract: Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.Type: GrantFiled: June 1, 2017Date of Patent: April 20, 2021Assignee: DIC CorporationInventors: Junji Yamaguchi, Tomohiro Shimono, Kazuo Arita, Masato Otsu
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Patent number: 10913725Abstract: The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve the object.Type: GrantFiled: November 8, 2016Date of Patent: February 9, 2021Assignee: DIC CorporationInventors: Masato Otsu, Tomohiro Shimono, Kazuo Arita, Junji Yamaguchi
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Publication number: 20200325100Abstract: Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound represented by the following Formula (1) in which n and m each independently represent an integer from 1 to 5; Aly represents a group containing a substituted or unsubstituted allyl group and represented by the following Formula (2) (in Formula (2), Z represents a direct bond or a hydrocarbon group having 1 to 10 carbon atoms which may have a substituent; and R1, R2, and R3 each independently represent a hydrogen atom or a methyl group); MI represents a maleimide group represented by the following Formula (3) (in Formula (3), R4 and R5 each independently represent a hydrogen atom or a methyl group); and A represents a structure having two benzene rings and represented by the following Formula (4-1) or (4-2) (each benzene ring may have a substituent; and X represents a direct bond or a divalent linking group):Type: ApplicationFiled: June 1, 2017Publication date: October 15, 2020Applicant: DIC CorporationInventors: Junji YAMAGUCHI, Tomohiro SHIMONO, Kazuo ARITA, Masato OTSU
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Publication number: 20200325101Abstract: Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.Type: ApplicationFiled: June 1, 2017Publication date: October 15, 2020Applicant: DIC CorporationInventors: Junji YAMAGUCHI, Tomohiro SHIMONO, Kazuo ARITA, Masato OTSU
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Publication number: 20200109276Abstract: An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.Type: ApplicationFiled: December 14, 2017Publication date: April 9, 2020Inventors: Masato Otsu, Kazuo Arita, Etsuko Suzuki, Junji Yamaguchi, Tomohiro Shimono
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Patent number: 10577307Abstract: A task is to provide a method for producing a polycyclic aromatic aminophenol compound through a reduced number of steps at a low cost with high safety. The method for producing a polycyclic aromatic aminophenol compound includes the step of reacting a compound represented by the general formula (1) below and an aromatic amino compound with each other: Wherein n represents an integer of 1 to 8, Ar represents a benzene ring optionally having a substituent, or a naphthalene ring optionally having a substituent, each of R1 and R2 independently represents a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms and optionally having a substituent, or an aromatic group optionally having a substituent, and R3 represents a hydroxyl group, a methoxy group, or a halogen atom.Type: GrantFiled: June 1, 2017Date of Patent: March 3, 2020Assignee: DIC CorporationInventors: Kazuo Arita, Tomohiro Shimono, Junji Yamaguchi
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Patent number: 10399312Abstract: The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having the cured product layer. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve an object.Type: GrantFiled: November 8, 2016Date of Patent: September 3, 2019Assignee: DIC CorporationInventors: Masato Otsu, Tomohiro Shimono, Kazuo Arita, Junji Yamaguchi
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Patent number: 10301471Abstract: The present invention provides a curable resin composition having excellent fluidity and giving a cured product having excellent physical properties such as heat resistance, moisture resistance/solder resistance, flame retardance, and dielectric characteristics. The curable resin composition contains a resin (A) which has a benzoxazine structure represented by structural formula (A1) below and an epoxy resin (B) at such a ratio that when the total number of moles of the benzoxazine structure of the structural formula (A1) is ?, and the number of moles of epoxy groups in the epoxy resin (B) is ?, a ratio [?/?] is 0.1 to 0.5.Type: GrantFiled: February 19, 2015Date of Patent: May 28, 2019Assignee: DIC CorporationInventors: Tomohiro Shimono, Kazuo Arita
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Publication number: 20190144372Abstract: A task is to provide a method for producing a polycyclic aromatic aminophenol compound through a reduced number of steps at a low cost with high safety. The method for producing a polycyclic aromatic aminophenol compound includes the step of reacting a compound represented by the general formula (1) below and an aromatic amino compound with each other: Wherein n represents an integer of 1 to 8, Ar represents a benzene ring optionally having a substituent, or a naphthalene ring optionally having a substituent, each of R1 and R2 independently represents a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms and optionally having a substituent, or an aromatic group optionally having a substituent, and R3 represents a hydroxyl group, a methoxy group, or a halogen atom.Type: ApplicationFiled: June 1, 2017Publication date: May 16, 2019Inventors: Kazuo Arita, Tomohiro Shimono, Junji Yamaguchi
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Publication number: 20180362479Abstract: The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve the object.Type: ApplicationFiled: November 8, 2016Publication date: December 20, 2018Inventors: Masato Otsu, Tomohiro Shimono, Kazuo Arita, Junji Yamaguchi
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Publication number: 20180362477Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.Type: ApplicationFiled: November 24, 2016Publication date: December 20, 2018Inventors: Tomohiro Shimono, Junji Yamaguchi, Masato Otsu, Kazuo Arita
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Publication number: 20180362478Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having the layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.Type: ApplicationFiled: November 24, 2016Publication date: December 20, 2018Inventors: Tomohiro SHIMONO, Kazuo ARITA, Junji YAMAGUCHI, Masato OTSU
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Publication number: 20180362480Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.Type: ApplicationFiled: November 24, 2016Publication date: December 20, 2018Applicant: DIC CorporationInventors: Kazuo ARITA, Tomohiro SHIMONO, Masato OTSU, Junji YAMAGUCHI, Etsuko SUZUKI
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Publication number: 20180333941Abstract: The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having the cured product layer. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve an object.Type: ApplicationFiled: November 8, 2016Publication date: November 22, 2018Applicant: DIC CorporationInventors: Masato Otsu, Tomohiro Shimono, Kazuo Arita, Junji Yamaguchi