Abstract: To provide a fuel cell system configured to increase fuel cell performance even at high altitude. A fuel cell system for air vehicles, wherein the fuel cell system comprises: a fuel cell, an oxidant gas system for supplying oxidant gas to the fuel cell, an altitude sensor, and a controller; wherein the oxidant gas system comprises an air compressor and a bypass flow path bypassing the fuel cell; wherein the bypass flow path comprises a bypass valve; and wherein, when the controller detects an altitude increase measured by the altitude sensor, the controller increases a rotational speed of the air compressor, and the controller increases an opening degree of the bypass valve.

Abstract: A fuel cell system for air vehicles, wherein the fuel cell system comprises: a fuel cell, a fuel gas system for supplying fuel gas to the fuel cell, a potential sensor, and a controller; wherein the fuel gas system comprises a fuel gas supplier; wherein the controller determines whether or not a potential of the fuel cell measured by the potential sensor, is a reversal potential; and wherein, when the controller determines that the potential of the fuel cell is a reversal potential, the controller increases a fuel gas supply from the fuel gas supplier to the fuel cell.

Abstract: A fuel cell system for air vehicles, wherein the fuel cell system comprises: a fuel cell, a fuel gas system for supplying fuel gas to the fuel cell, a potential sensor, and a controller; wherein the fuel gas system comprises a fuel gas supplier; wherein the controller determines whether or not a potential of the fuel cell measured by the potential sensor, is a reversal potential; and wherein, when the controller determines that the potential of the fuel cell is a reversal potential, the controller increases a fuel gas supply from the fuel gas supplier to the fuel cell.

Abstract: To provide an air vehicle configured to stabilize the power output of a fuel cell by securing the generated water discharge property of the fuel cell. An air vehicle, wherein the air vehicle comprises two or more fuel cells; wherein each fuel cell comprises an anode outlet manifold; and wherein each fuel cell is disposed in the air vehicle so that water discharge directions of the anode outlet manifolds are different from each other.

Abstract: To provide a fuel cell system configured to prevent the freezing of the gas and water discharge valve of the fuel gas system even at high altitude. A fuel cell system for air vehicles, wherein the fuel cell system comprises: a fuel cell, a fuel gas system for supplying fuel gas to the fuel cell, a cooling system for controlling a temperature of the fuel cell, an altitude sensor, a temperature sensor, and a controller, and wherein, when the controller detects an altitude increase measured by the altitude sensor, and when a temperature of the gas and water discharge valve measured by the temperature sensor is less than a predetermined temperature, the controller increases a temperature of the refrigerant by controlling the three-way valve to circulate the refrigerant in the heating flow path and operating the circulation pump and the water heater to heat the refrigerant.

Abstract: To provide a fuel cell system configured to increase fuel cell performance even at high altitude. A fuel cell system for air vehicles, wherein the fuel cell system comprises: a fuel cell, an oxidant gas system for supplying oxidant gas to the fuel cell, an altitude sensor, and a controller; wherein the oxidant gas system comprises an air compressor and a bypass flow path bypassing the fuel cell; wherein the bypass flow path comprises a bypass valve; and wherein, when the controller detects an altitude increase measured by the altitude sensor, the controller increases a rotational speed of the air compressor, and the controller increases an opening degree of the bypass valve.

Abstract: Removal of substrates in a composite substrate is facilitated, and flaking of the composite substrate in an unintended process is prevented. A method for manufacturing a composite substrate includes: forming a first bonding material in a first surface of a first substrate; forming, in the first surface, at least one groove located more inward than a periphery in a plan view of the first substrate; forming the first bonding material along an inner wall of the at least one groove, the first bonding material not filling into space enclosed by the inner wall of the at least one groove; forming a second bonding material on a second surface of a second substrate; and bonding the first bonding material and the second bonding material together in a region except the at least one groove.

Abstract: A cooling apparatus of a vehicle driving system for driving a vehicle according to the invention activates a heat pump to cool a hybrid system by cooling medium and flows an engine cooling water in an engine water circulation passage through a condenser to cool the cooling medium by the engine cooling water at the condenser when an engine water circulation condition is satisfied. The engine water circulation condition is a condition that a heat pump activation condition is satisfied, and an engine cooling condition is not satisfied. The heat pump activation condition is a condition that a process of cooling the hybrid system by the cooling medium of the heat pump is requested. The engine cooling condition is a condition that a process of cooling an internal combustion engine by the engine cooling water is requested.

Abstract: The semiconductor manufacturing device includes: a lower substrate support base configured to support a diamond substrate; an upper substrate support base configured to support a semiconductor substrate; a support base drive unit configured to move the lower substrate support base and the upper substrate support base to bring the diamond substrate and the semiconductor substrate into close contact with each other under a state in which a pressure is applied to the diamond substrate and the semiconductor substrate in a thickness direction; and a second mechanism configured to deform a surface of the upper substrate support base opposed to the lower substrate support base so that a surface of the semiconductor substrate opposed to the diamond substrate forms a parallel surface or a parallel plane with respect to a surface of the diamond substrate opposed to the semiconductor substrate.

Abstract: In a semiconductor device including a crystalline nitride layer, in which diamond is used for heat dissipation thereof, it is an object of the present invention to suppress cracking of the crystalline nitride layer. The semiconductor device includes a layered body and a heat dissipation layer. The layered body includes a crystalline nitride layer and a composite layer. The composite layer includes a non-inhibiting portion which does not inhibit diamond growth on a surface thereof and an inhibiting portion which inhibits the diamond growth on the surface. A layered body main surface of the layered body has a first region in which the non-inhibiting portion is exposed and a second region in which the inhibiting portion is exposed. The heat dissipation layer is made of diamond, opposed to the main surface, adhered to the first region, and separated from the second region with a void interposed therebetween.

Abstract: A cooling apparatus of a vehicle driving system of the invention connects an engine water circulation passage to a hybrid system water circulation passage and flows cooling water in the engine water circulation passage and the hybrid system water circulation passage to cool a first hybrid system component by the cooling water cooled by an engine radiator and cool a second hybrid system component by the cooling water cooled by a hybrid system radiator when an engine cooling process is not requested, a first hybrid system cooling process is requested, a second hybrid system cooling process is requested, and a connection condition is satisfied. The connection condition is satisfied when the engine cooling process is not requested, and the cooling water flowing into the hybrid system water circulation passage from the engine water circulation passage, can cool the first hybrid system component.

Abstract: A cooling apparatus of an internal combustion engine according to the invention controls an activation of a flow rate changing valve such that a block water flow rate proportion when an engine output is relatively large in a range of the engine output equal to or larger than a predetermine engine output, is larger than the block water flow rate proportion when the engine output is relatively small in the range of the engine output equal to or larger than a predetermine engine output.

Abstract: A cooling apparatus of a vehicle of the invention comprises an engine cooling system, a device cooling system, and a connection apparatus configured to connect an engine circulation circuit of the engine cooling system and a device circulation circuit of the device cooling system to each other such that heat exchanging liquid cooled by a device radiator of the device cooling system, is supplied to an engine passage formed in an internal combustion engine without flowing through a device passage formed in the device including at least one of a motor of the vehicle, a battery for storing electric power to be supplied to the motor, and a power control unit for controlling a supply of the electric power from the battery to the motor.

Abstract: A semiconductor substrate according to the present invention includes a nitride semiconductor layer 203, an amorphous semiconductor layer 205 formed on one main surface side of the nitride semiconductor layer 203, a high-roughness layer 206 which is a semiconductor layer formed on the amorphous semiconductor layer 205 and has a surface roughness larger than the amorphous semiconductor layer 205, and a diamond layer 207 formed on the high-roughness layer 206. Damage to the nitride semiconductor layer can be reduced in forming the diamond layer on the nitride semiconductor layer and adhesion between the layers can be increased.

Abstract: An object is to provide a technology capable of suppressing a crack of a crystalline nitride layer which is generated due to a stress caused by difference in thermal expansion coefficients between a crystalline nitride and diamond. A semiconductor device includes a crystalline nitride layer, a structure containing silicon, and a diamond layer. The structure is disposed on a first main surface of the crystalline nitride layer. The diamond layer is disposed at least on a lateral portion of the structure and has a void between the diamond layer and the first main surface of the crystalline nitride layer. The void is a stress absorbing space, for example.

Abstract: An EGR cooler in the disclosure includes: a gas path configured to allow an EGR gas to flow; a refrigerant path configured to perform heat exchange between the EGR gas circulating along the gas path and a refrigerant; an exothermic body containing portion configured such that an exothermic body to generate heat by adsorbing a predetermined working gas is contained within the EGR cooler and at least a part of the exothermic body contacts with a wall surface of the gas path; a working gas tank in which the working gas is stored; and a gas moving apparatus configured to move the working gas stored in the working gas tank, from the working gas tank to the exothermic body containing portion.

Abstract: A cooling apparatus of a vehicle driving system of the invention connects an engine water circulation passage to a hybrid system water circulation passage and flows cooling water in the engine water circulation passage and the hybrid system water circulation passage to cool a first hybrid system component by the cooling water cooled by an engine radiator and cool a second hybrid system component by the cooling water cooled by a hybrid system radiator when an engine cooling process is not requested, a first hybrid system cooling process is requested, a second hybrid system cooling process is requested, and a connection condition is satisfied. The connection condition is satisfied when the engine cooling process is not requested, and the cooling water flowing into the hybrid system water circulation passage from the engine water circulation passage, can cool the first hybrid system component.

Abstract: The cooling apparatus of the engine sets the first shut-off valve to the closed position, sets the second shut-off valve to the open position, and performs the opposite flow connection operation to supplies the cooling water directly to the cylinder block water passage from the cylinder head water passage without flowing the cooling water through the radiator and to the heat exchanger from the cylinder head water block when the engine temperature is lower than the completely-warmed temperature, and the cooling water is requested to be supplied to the heat exchanger.

Abstract: The semiconductor manufacturing device includes: a lower substrate support base configured to support a diamond substrate; an upper substrate support base configured to support a semiconductor substrate; a support base drive unit configured to move the lower substrate support base and the upper substrate support base to bring the diamond substrate and the semiconductor substrate into close contact with each other under a state in which a pressure is applied to the diamond substrate and the semiconductor substrate in a thickness direction; and a second mechanism configured to deform a surface of the upper substrate support base opposed to the lower substrate support base so that a surface of the semiconductor substrate opposed to the diamond substrate forms a parallel surface or a parallel plane with respect to a surface of the diamond substrate opposed to the semiconductor substrate.

Abstract: A cooling apparatus of a vehicle driving system for driving a vehicle according to the invention activates a heat pump to cool a hybrid system by cooling medium and flows an engine cooling water in an engine water circulation passage through a condenser to cool the cooling medium by the engine cooling water at the condenser when an engine water circulation condition is satisfied. The engine water circulation condition is a condition that a heat pump activation condition is satisfied, and an engine cooling condition is not satisfied. The heat pump activation condition is a condition that a process of cooling the hybrid system by the cooling medium of the heat pump is requested. The engine cooling condition is a condition that a process of cooling an internal combustion engine by the engine cooling water is requested.