Patents by Inventor Tomohisa Kato

Tomohisa Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11977099
    Abstract: A method for manufacturing a semiconductor device in which probes and the layout of the electrode pads of a test element group (TEG) are associated is provided. As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Thus, it is necessary to associate the probes and the layout of the electrode pad. According to the method, a layout of a TEG electrode pad corresponding to a plurality of probes arranged in a fan shape or probes manufactured by Micro Electro Mechanical Systems (MEMS) technology is provided.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: May 7, 2024
    Assignee: Hitachi High-Tech Corporation
    Inventors: Tomohisa Ohtaki, Takayuki Mizuno, Ryo Hirano, Toru Fujimura, Shigehiko Kato, Yasuhiko Nara, Katsuo Ohki, Akira Kageyama, Masaaki Komori
  • Publication number: 20230339032
    Abstract: An anodic oxidation-assisted grinding apparatus includes an electrolyte supply passage configured to pour an electrolyte at least between a cathode and a workpiece, a direct current power source configured to apply a direct current, via the electrolyte, to an anode, the cathode, and the workpiece to form an anodic oxidation film on a surface of the workpiece, and a grindstone configured to grind the anodic oxidation film formed on the surface of the workpiece.
    Type: Application
    Filed: April 20, 2023
    Publication date: October 26, 2023
    Applicant: JTEKT MACHINE SYSTEMS CORPORATION
    Inventors: Wataru YOSHIKAWA, Haruyuki HIRAYAMA, Tomohisa KATO
  • Patent number: 11655561
    Abstract: In an n-type 4H-SiC single crystal substrate of the present disclosure, the concentration of the element N as a donor and the concentration of the element B as an acceptor are both 3×1018/cm3 or more, and a threading dislocation density is less than 4,000/cm2.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: May 23, 2023
    Assignee: SHOWA DENKO K.K.
    Inventors: Hiromasa Suo, Kazuma Eto, Tomohisa Kato
  • Patent number: 11542631
    Abstract: A method for producing a p-type 4H—SiC single crystal includes sublimating a nitrided aluminum raw material and a SiC raw material. Further, there is a stacking of a SiC single crystal, which is co-doped with aluminum and nitrogen, on one surface of a seed crystal.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: January 3, 2023
    Assignees: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, SHOWA DENKO K.K., DENSO CORPORATION
    Inventors: Kazuma Eto, Tomohisa Kato, Hiromasa Suo, Yuichiro Tokuda
  • Patent number: 11300949
    Abstract: To provide a data processing device of production equipment that can generate data usable by an operator or an administrator by performing processing for a collected plurality of types of data. A data processing device includes a reference-data acquiring unit configured to acquire, in production equipment, reference data including information concerning time in which a reference for grouping of data operates, a target-data acquiring unit configured to acquire target data concerning a state of the production equipment detected by detectors provided in the production equipment, and a combined-data generating unit configured to generate, for each group of the reference data, combined data for each group obtained by combining, with the reference data, data detected in the same period of time as an operation period of time of the reference data in the target data.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: April 12, 2022
    Assignee: JTEKT CORPORATION
    Inventors: Tomohisa Kato, Akio Uchino, Toshihiko Yotsui, Yuki Ishigure, Asami Hara, Tatiana Kundozerova, Tatsuo Oshiumi
  • Patent number: 11156932
    Abstract: The present invention relates to a toner binder containing: a polyester resin (A); and a vinyl resin (B), wherein the polyester resin (A) has an acid value of 2 mg KOH/g or more, the vinyl resin (B) has a weight average molecular weight of 4,000 to 40,000, the vinyl resin (B) is a polymer essentially containing a monomer (m) whose homopolymer has an SP value of 11.5 to 16.5 as a constituent monomer, the weight percentage of the monomer (m) in monomers constituting the vinyl resin (B) is 1 wt % or more based on the total weight of the monomers constituting the vinyl resin (B), the polyester resin (A) and the vinyl resin (B) are present at a weight ratio (A)/(B) of 80/20 to 99.5/0.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: October 26, 2021
    Assignee: SANYO CHEMICAL INDUSTRIES, LTD.
    Inventors: Masaru Honda, Tomohisa Kato, Yasuhiro Ono
  • Patent number: 10892334
    Abstract: An n-type SiC single crystal substrate of the present invention is provided which is a substrate doped with both a donor and an acceptor, and has a difference between a donor concentration and an acceptor concentration in an outer peripheral portion which is smaller than a difference between a donor concentration and an acceptor concentration in a central portion, and is smaller than 3.0×1019/cm3.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: January 12, 2021
    Assignee: SHOWA DENKO K.K.
    Inventors: Kazuma Eto, Hiromasa Suo, Tomohisa Kato
  • Patent number: 10879359
    Abstract: A silicon carbide epitaxial wafer (10) of the present invention is a silicon carbide epitaxial wafer including: a silicon carbide substrate (1) and a silicon carbide layer (2) provided on a first principal plane (1A) of the silicon carbide substrate (1) and having a film thickness of 100 ?m or more, wherein a warpage amount of the silicon carbide epitaxial wafer is ?20 ?m or more and 20 ?m or less.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: December 29, 2020
    Inventors: Keiko Masumoto, Satoshi Segawa, Kazutoshi Kojima, Tomohisa Kato, Toshiyuki Ohno
  • Publication number: 20200325595
    Abstract: A method for producing a p-type 4H-SiC single crystal includes sublimating a nitrided aluminum raw material and a SiC raw material. Further, there is a stacking of a SiC single crystal, which is co-doped with aluminum and nitrogen, on one surface of a seed crystal.
    Type: Application
    Filed: June 29, 2020
    Publication date: October 15, 2020
    Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, SHOWA DENKO K.K., DENSO CORPORATION
    Inventors: Kazuma ETO, Tomohisa KATO, Hiromasa SUO, Yuichiro TOKUDA
  • Patent number: 10793819
    Abstract: A liquid injection method for injecting a liquid into a culture vessel includes tilting the culture vessel around a horizontal axis at a tilt angle (X°) of greater than 0° and 50° or less, wherein adherent cells are adhered to the culture vessel; and injecting the liquid into the culture vessel at a predetermined linear velocity (Y mm/s) via a wall surface of the culture vessel tilted at the tilt angle (X°), wherein the tilt angle (X) and the linear velocity (Y) satisfy the following (formula 1): Y?5.075X+123 (formula 1).
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: October 6, 2020
    Assignees: KANEKA CORPORATION, KYOTO UNIVERSITY
    Inventors: Tomohisa Kato, Kazuya Hamada, Haruhisa Inoue, Takayuki Kondo
  • Publication number: 20200264528
    Abstract: The present invention relates to a toner binder containing: a polyester resin (A); and a vinyl resin (B), wherein the polyester resin (A) has an acid value of 2 mg KOH/g or more, the vinyl resin (B) has a weight average molecular weight of 4,000 to 40,000, the vinyl resin (B) is a polymer essentially containing a monomer (m) whose homopolymer has an SP value of 11.5 to 16.5 as a constituent monomer, the weight percentage of the monomer (m) in monomers constituting the vinyl resin (B) is 1 wt % or more based on the total weight of the monomers constituting the vinyl resin (B), the polyester resin (A) and the vinyl resin (B) are present at a weight ratio (A)/(B) of 80/20 to 99.5/0.
    Type: Application
    Filed: November 6, 2018
    Publication date: August 20, 2020
    Applicant: SANYO CHEMICAL INDUSTRIES, LTD.
    Inventors: Masaru HONDA, Tomohisa KATO, Yasuhiro ONO
  • Publication number: 20200071849
    Abstract: In an n-type 4H-SiC single crystal substrate of the present disclosure, the concentration of the element N as a donor and the concentration of the element B as an acceptor are both 3×1018/cm3 or more, and a threading dislocation density is less than 4,000/cm2.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 5, 2020
    Applicant: SHOWA DENKO K.K.
    Inventors: Hiromasa SUO, Kazuma ETO, Tomohisa KATO
  • Publication number: 20200056158
    Abstract: Disclosed are a method for screening for a growth-promoting factor for pluripotent stem cells with a conditioned medium which is generated by culturing feeder cells in a serum-free medium that contains L-ascorbic acid, insulin, transferrin, selenium, and sodium bicarbonate and does not contain a serum nor serum replacement; a method for growing pluripotent stem cells via feeder-free culture using the conditioned medium; and a method for growing pluripotent stem cells by carrying out feeder-free culture of pluripotent stem cells cultured in advance on feeder cells in the serum-free medium.
    Type: Application
    Filed: July 23, 2019
    Publication date: February 20, 2020
    Applicants: KANEKA CORPORATION, NATIONAL HOSPITAL ORGANIZATION
    Inventors: Tomohisa KATO, Yonehiro KANEMURA, Tomoko SHOFUDA, Hayato FUKUSUMI
  • Publication number: 20190333998
    Abstract: A high quality silicon carbide epitaxial wafer using a p-type silicon carbide single crystal substrate of low resistivity. The silicon carbide epitaxial wafer includes a p-type 4H—SiC single crystal substrate that has a first main surface having an off angle with respect to (0001) plane, and has a resistivity of less than 0.4 ?cm, and a silicon carbide epitaxial layer that is disposed on the first main surface of the p-type 4H—SiC single crystal substrate, in which an off direction of the off angle is the <01-10> direction.
    Type: Application
    Filed: December 19, 2018
    Publication date: October 31, 2019
    Inventors: Keiko MASUMOTO, Takashi MITANI, Kazuma ETO, Kazutoshi KOJIMA, Tomohisa KATO
  • Patent number: 10453693
    Abstract: A surface machining method for a single crystal SiC substrate, including: a step of mounting a grinding plate which includes a soft pad and a hard pad sequentially attached onto a base metal having a flat surface, a step of generating an oxidation product by using the grinding plate, and a step of grinding the surface while removing the oxidation product, wherein abrasive grains made of at least one metallic oxide that is softer than single crystal SiC and has a bandgap are fixed to the surface of the hard pad.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: October 22, 2019
    Assignee: SHOWA DENKO K.K.
    Inventors: Takanori Kido, Tomohisa Kato
  • Patent number: 10415018
    Abstract: This invention relates to a method for screening for a growth-promoting factor for pluripotent stem cells with a conditioned medium which is generated by culturing feeder cells in a serum-free medium that contains L-ascorbic acid, insulin, transferrin, selenium, and sodium bicarbonate and does not contain a serum nor serum replacement; a method for growing pluripotent stem cells via feeder-free culture using the conditioned medium; and a method for growing pluripotent stem cells by carrying out feeder-free culture of pluripotent stem cells cultured in advance on feeder cells in the serum-free medium.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: September 17, 2019
    Assignees: KANEKA CORPORATION, NATIONAL HOSPITAL ORGANIZATION
    Inventors: Tomohisa Kato, Yonehiro Kanemura, Tomoko Shofuda, Hayato Fukusumi
  • Publication number: 20190273136
    Abstract: A silicon carbide epitaxial wafer (10) of the present invention is a silicon carbide epitaxial wafer including: a silicon carbide substrate (1) and a silicon carbide layer (2) provided on a first principal plane (1A) of the silicon carbide substrate (1) and having a film thickness of 100 ?m or more, wherein a warpage amount of the silicon carbide epitaxial wafer is ?20 ?m or more and 20 ?m or less.
    Type: Application
    Filed: February 20, 2019
    Publication date: September 5, 2019
    Inventors: Keiko MASUMOTO, Satoshi SEGAWA, Kazutoshi KOJIMA, Tomohisa KATO, Toshiyuki OHNO
  • Publication number: 20190252504
    Abstract: An n-type SiC single crystal substrate of the present invention is provided which is a substrate doped with both a donor and an acceptor, and has a difference between a donor concentration and an acceptor concentration in an outer peripheral portion which is smaller than a difference between a donor concentration and an acceptor concentration in a central portion, and is smaller than 3.0×1019/cm3.
    Type: Application
    Filed: September 25, 2017
    Publication date: August 15, 2019
    Applicant: SHOWA DENKO K.K.
    Inventors: Kazuma ETO, Hiromasa SUO, Tomohisa KATO
  • Patent number: 10377984
    Abstract: It is an object of the present invention to provide a cell culture medium capable of enhancing cell growth efficiency without using feeder cells, in particular which does not comprise serum. The present invention provides a cell culture medium which comprises growth arrest-specific 6 (GAS6) and does not comprise serum.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: August 13, 2019
    Assignees: KANEKA CORPORATION, NATIONAL HOSPITAL ORGANIZATION
    Inventors: Tomohisa Kato, Yonehiro Kanemura, Tomoko Shofuda, Hayato Fukusumi
  • Patent number: 10354867
    Abstract: A method for manufacturing an epitaxial wafer comprising a silicon carbide substrate and a silicon carbide voltage-blocking-layer, the method includes: epitaxially growing a buffer layer on the substrate, doping a main dopant for determining a conductivity type of the buffer layer and doping an auxiliary dopant for capturing minority carriers in the buffer layer at a doping concentration less than the doping concentration of the main dopant, so that the buffer layer enhances capturing and extinction of the minority carriers, the minority carriers flowing in a direction from the voltage-blocking-layer to the substrate, so that the buffer layer has a lower resistivity than the voltage-blocking-layer, and so that the buffer layer includes silicon carbide as a main component; and epitaxially growing the voltage-blocking-layer on the buffer layer.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: July 16, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Hidekazu Tsuchida, Tetsuya Miyazawa, Yoshiyuki Yonezawa, Tomohisa Kato, Kazutoshi Kojima, Takeshi Tawara, Akihiro Otsuki