Abstract: A blood processing filter includes a container having 2 ports respectively functioning as an inlet for a liquid to be processed and as an outlet for the processed liquid, and a filtration medium filled in the container, wherein an airflow resistance of the filtration medium is 55.0 kPa·s/m or more and less than 85.0 kPa·s/m, the filtration medium includes a filter material A having an airflow resistance per unit basis weight of 0.01 kPa·s·m/g or more and less than 0.04 kPa·s·m/g and a filter material B having an airflow resistance per unit basis weight of 0.04 kPa·s·m/g or more, at least a part of the filter material A is disposed on a side closer to the inlet for a liquid to be processed than the filter material B, and a sum of airflow resistances of the filter material A is 6.0 kPa·s/m or more.

Abstract: In a sound absorption panel formed by stacking a plate perforated with a hole having a hole size smaller than a fiber length such as expanded metal, a honeycomb material, and felt-like fiber between the perforated plate and the honeycomb material, and joining the perforated plate, the felt-like fiber, and the honeycomb material to each other with an adhesive, the adhesive applied to the perforated plate is permeated into a surface of the felt-like fiber exposed from the hole to fix the fiber on the surface.

Abstract: For forming a sound absorption/insulation honeycomb panel by stacking an air-permeable material, a honeycomb material filled with a sound absorption material and a reflector, and adhesively joining these materials, it is hard to join the honeycomb material and the air-permeable material adhesively due to a thin wall surface of the honeycomb material and a resultant line to surface adhesive joint therebetween, causing a problem of low adhesive strength. By using a water absorption honeycomb material, an adhesive joint is formed with an adhesive joint area increased by dipping an end of a wall surface of a cell forming the water absorption honeycomb material into a water-soluble adhesive, making the end flexible over a fixed period of time, and then pressing the end strongly against an air-permeable material as a counterpart of the adhesive joint to deform a tip into an inverted T-shape.

Abstract: For forming a sound absorption/insulation honeycomb panel by stacking an air-permeable material, a honeycomb material filled with a sound absorption material and a reflector, and adhesively joining these materials, it is hard to join the honeycomb material and the air-permeable material adhesively due to a thin wall surface of the honeycomb material and a resultant line to surface adhesive joint therebetween, causing a problem of low adhesive strength. By using a water absorption honeycomb material, an adhesive joint is formed with an adhesive joint area increased by dipping an end of a wall surface of a cell forming the water absorption honeycomb material into a water-soluble adhesive, making the end flexible over a fixed period of time, and then pressing the end strongly against an air-permeable material as a counterpart of the adhesive joint to deform a tip into an inverted T-shape.

Abstract: In a sound absorption panel formed by stacking a plate perforated with a hole having a hole size smaller than a fiber length such as expanded metal, a honeycomb material, and felt-like fiber between the perforated plate and the honeycomb material, and joining the perforated plate, the felt-like fiber, and the honeycomb material to each other with an adhesive, the adhesive applied to the perforated plate is permeated into a surface of the felt-like fiber exposed from the hole to fix the fiber on the surface.

Abstract: A jig pallet for conveying a workpiece that is placed on it and has a portion to be worked. The jig pallet has a conveyance carriage (A) movable along a production line, a workpiece receiving member (B) provided on the conveyance carriage (A) and on which the workpiece is placed, a pressing mechanism (E) to be placed so as to face a peripheral section of a to-be-worked portion of the workpiece placed on the workpiece receiving member (B), and an opening/closing member (D) on which the pressing mechanism (E) is provided. When the opening/closing member (D) is closed, the pressing mechanism (E) presses a peripheral section of the to-be-worked portion of the workpiece from above, and when being opened, the pressing is released, enabling the opening/closing member (D) to be opened and closed, with one end of the conveyance carriage (A) functioning as the support point, and allowing the workpiece to be taken out.

Abstract: A fabrication line that utilizes a jig pallet that is commonly used in processing equipment to efficiently finish and assemble semifinished products of plural shapes. The jig pallet includes a holding member D for holding a semifinished product W and an opening/closing device G1 for opening and closing the holding member D, and allows the semifinished product W to be mounted and dismounted by opening and closing the holding member D with the opening/closing device G1. The jig pallet is transported to processing equipment M1, M2, and M3 to allow the semifinished product to be processed in the fabrication line. An opening/closing driving device G2 that engages the opening/closing device G1 to open and close the holding member is provided along the fabrication line.

Abstract: A jig palette for conveying a workpiece that is placed on it and has a portion to be worked. The jig palette has a conveyance carriage (A) movable along a production line, a workpiece receiving member (B) provided at the conveyance carriage (A) and on which the workpiece is placed, a pressing mechanism (E) to be placed so as to face a peripheral section of the to-be-worked portion of the workpiece placed on the workpiece receiving member (B), and an opening/closing member (D) on which the pressing mechanism (E) is provided. When the opening/closing member (D) is being closed, the pressing mechanism (E) presses a peripheral section of the to-be-worked portion of the workpiece from above, and when being opened, the pressing is released, enabling the opening/closing member (D) to be opened and closed, with one end of the conveyance carriage (A) functioning as the support point, and allowing the workpiece to be taken out.

Abstract: A fabrication line that utilizes a versatile jig pallet that can be commonly used in processing equipment to efficiently finish and assembly of the production of semifinished products of plural shapes is disclosed. The jig pallet comprises a holding member for holding a semifinished product W and an opening/closing device G1 for opening and closing the holding member D, and allows the semifinished product W to be mounted and dismounted by opening and closing the holding member D by means of the opening/closing device G1. The jig pallet is transported to processing equipment M1, M2, and M3 to allow the semifinished product to be processed in the fabrication line. An opening/closing driving device G2 engaging the opening/closing device G1 to drive the holding member D to open and close is provided along the fabrication line.

Abstract: An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation.

Abstract: An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation.

Abstract: An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means and for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation.

Abstract: An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means and for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation.

Abstract: A method and apparatus is provided for squeeze-gluing a decoration onto a cast, which method consists of putting lower peripheral surfaces of a decoration, the upper surfaces of which decoration are treated with glue, and a cast, over the decoration so as to have a peripheral part of the cast be held, gluing outer parts of the decoration onto parts of the cast corresponding thereto, pressing inner parts of the decoration against parts of the cast corresponding thereto so as to glue the inner parts to the corresponding parts of the cast, and simultaneously with the pressing step, squeezing a peripheral part of the decoration into a squeezing groove in the cast.