Patents by Inventor Tomohito Kiyose

Tomohito Kiyose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4991059
    Abstract: An electronic component with leads each having a bonding portion is disclosed. Each bonding portion is formed with a through hole or a notch to provide for satisfactory soldering and reduce the possibility of defective soldering.
    Type: Grant
    Filed: September 8, 1988
    Date of Patent: February 5, 1991
    Assignee: Mitsubishi Denki K.K.
    Inventor: Tomohito Kiyose