Patents by Inventor Tomohito SHIMADA

Tomohito SHIMADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polypropylene-based resin expanded beads and polypropylene-based resin expanded beads molded article
    Patent number: 11732101
    Abstract: An expanded bead having a through hole and including a foamed core layer which defines the through hole therein and which is constituted of a resin composition containing two kinds of polypropylene-based resins having different melting points, and a cover layer covering the foamed core layer and constituted of a polyolefin-based resin. The expanded bead gives a DSC curve in which an endothermic peak intrinsic to the resin composition and another endothermic peak on a higher temperature side thereof appear in a specific heat of fusion ratio. Molded articles include a multiplicity of the expanded beads.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: August 22, 2023
    Assignee: JSP CORPORATION
    Inventors: Tomohito Shimada, Hajime Ohta
  • POLYPROPYLENE-BASED RESIN EXPANDED BEADS AND POLYPROPYLENE-BASED RESIN EXPANDED BEADS MOLDED ARTICLE
    Publication number: 20230074915
    Abstract: An expanded bead having a through hole and including a foamed core layer which defines the through hole therein and which is constituted of a resin composition containing two kinds of polypropylene-based resins having different melting points, and a cover layer covering the foamed core layer and constituted of a polyolefin-based resin. The expanded bead gives a DSC curve in which an endothermic peak intrinsic to the resin composition and another endothermic peak on a higher temperature side thereof appear in a specific heat of fusion ratio. Molded articles include a multiplicity of the expanded beads.
    Type: Application
    Filed: January 21, 2021
    Publication date: March 9, 2023
    Applicant: JSP CORPORATION
    Inventors: Tomohito SHIMADA, Hajime OHTA