Patents by Inventor Tomokazu Horie

Tomokazu Horie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing semiconductor device
    Publication number: 20050136595
    Abstract: A method for manufacturing a semiconductor device is provided including the steps of covering the first nitride film formed on the first oxide film within the first region where the first gate insulation film for the first transistor that operates at one voltage is to be formed; performing plasma nitridation for the second nitride film, having a thickness virtually the same as that of the first nitride film, formed on the second oxide film within the second region where the second gate insulation film for the second transistor that operates at another voltage lower than the one voltage is to be formed; and growing the second nitride film.
    Type: Application
    Filed: December 21, 2004
    Publication date: June 23, 2005
    Inventor: Tomokazu Horie
  • Methods of manufacturing semiconductor devices
    Patent number: 6617663
    Abstract: A planarization method includes forming a dummy pattern in a film over a substrate. The dummy pattern includes a plurality of concave and convex portions. A chemical-mechanical polishing process is applied to the film, with the dummy pattern providing planarization of enhanced uniformity in comparison with known techniques.
    Type: Grant
    Filed: March 1, 2002
    Date of Patent: September 9, 2003
    Assignee: Seiko Epson Corporation
    Inventors: Tomokazu Horie, Shinichi Sugiyama
  • Methods of manufacturing semiconductor devices
    Publication number: 20020123207
    Abstract: A planarization method includes forming a dummy pattern in a film over a substrate. The dummy pattern includes a plurality of concave and convex portions. A chemical-mechanical polishing process is applied to the film, with the dummy pattern providing planarization of enhanced uniformity in comparison with known techniques.
    Type: Application
    Filed: March 1, 2002
    Publication date: September 5, 2002
    Inventors: Tomokazu Horie, Shinichi Sugiyama