Patents by Inventor Tomokazu Kitagawa

Tomokazu Kitagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11691489
    Abstract: A door structure of a vehicle includes: an outer panel (4); an inner member (5, 11A) arranged on an inner side of the outer panel in a vehicle width direction; a rigid member (9) arranged between the inner member (5, 11A) and the outer panel (4); and a vibration suppression member (22) arranged between the outer panel (4) and the rigid member (9). The outer panel (4) includes a hem section (10f, 10r, 10u) disposed on a periphery thereof and connected to the inner member (5, 11A) by swaging. The vibration suppression member (22) includes a damping material (22A to 22C) located adjacent to the hem section (10f, 10r, 10u) and being in contact with the outer panel (4) and the rigid member (9).
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: July 4, 2023
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Kazuya Kumamoto, Tomokazu Kitagawa, Takashi Ikemoto
  • Publication number: 20220080815
    Abstract: A door structure of a vehicle includes: an outer panel (4); an inner member (5, 11A) arranged on an inner side of the outer panel in a vehicle width direction; a rigid member (9) arranged between the inner member (5, 11A) and the outer panel (4); and a vibration suppression member (22) arranged between the outer panel (4) and the rigid member (9). The outer panel (4) includes a hem section (10f, 10r, 10u) disposed on a periphery thereof and connected to the inner member (5, 11A) by swaging. The vibration suppression member (22) includes a damping material (22A to 22C) located adjacent to the hem section (10f, 10r, 10u) and being in contact with the outer panel (4) and the rigid member (9).
    Type: Application
    Filed: January 10, 2020
    Publication date: March 17, 2022
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Kazuya KUMAMOTO, Tomokazu KITAGAWA, Takashi IKEMOTO
  • Patent number: 7015783
    Abstract: A coil component includes a coil 2 having a through-hole 1, a magnetic core encapsulating the coil, and a terminal 4. The magnetic core includes a top portion 11 disposed at an upper part of the coil, a bottom portion 12 disposed at a lower part of the coil, and a middle portion 13. An outer layer thickness of the middle portion (W1) is less than a diameter of the through-hole, while the top portion and the bottom portion are higher in density than the middle portion. The configuration of the present invention provides a small size coil component with less occurrence of magnetic saturation to prevent lowering of inductance even with thin top 11 and bottom portions 11, 12. The coil component further has improved reliability.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: March 21, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Nakata, Tsunetsugu Imanishi, Hiroyuki Hamamoto, Hidetoshi Hiwatashi, Tomokazu Kitagawa
  • Publication number: 20040046626
    Abstract: A coil component comprising; a coil 2 having a through-hole 1, a magnetic core including the coil, and a terminal 4, wherein magnetic core comprises a top portion 11 disposed at an upper part of the coil, a bottom portion 12 disposed at a lower part of the coil, and a middle portion 13. An outer layer thickness of the middle portion (W1) is less than a diameter of the through-hole, while the top portion and the bottom portion are higher in density than the middle portion. The configuration of the present invention provides a small size coil component with less occurrence of magnetic saturation to prevent lowering of inductance even with thin top portion 11 and bottom portion 12. The coil component further has improved reliability.
    Type: Application
    Filed: June 26, 2003
    Publication date: March 11, 2004
    Inventors: Toshiyuki Nakata, Tsunetsugu Imanishi, Hiroyuki Hamamoto, Hidetoshi Hiwatashi, Tomokazu Kitagawa