Patents by Inventor Tomoki Iwanaga

Tomoki Iwanaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151007
    Abstract: An energy calculation unit calculates an energy amount for each of a plurality of sides of a support polygon of a work machine in which the energy amount is required to cause the work machine to fall when the side serves as a rotation axis. An evaluation unit evaluates a possibility of the work machine falling based on the calculated energy amount for each of the sides.
    Type: Application
    Filed: February 24, 2022
    Publication date: May 9, 2024
    Inventors: Tomoki HIRAYAMA, Takahiro NOYORI, Yoshihiro IWANAGA
  • Patent number: 11819978
    Abstract: A grinding material includes a base sheet and a grinding layer overlaid on a front face side of the base sheet and including abrasive grains and a binder for the abrasive grains. The grinding layer includes the abrasive grains of a plurality of types. Of the abrasive grains of the plurality of types, provided that first abrasive grains have the largest average diameter and second abrasive grains have the second largest average diameter, the percentage of the average diameter of the second abrasive grains with respect to that of the first abrasive grains is 5-70%. The total content of the abrasive grains in the grinding layer is preferably 50-85% by volume. The content of the first abrasive grains in the grinding layer is preferably 1-25% by volume. The first abrasive grains are preferably diamond abrasive grains and the second abrasive grains are preferably alumina abrasive grains.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: November 21, 2023
    Assignee: BANDO CHEMICAL INDUSTRIES, LTD.
    Inventors: Daisuke Takagi, Tomoki Iwanaga, Kazuo Saito, Toshikazu Taura
  • Patent number: 11027398
    Abstract: The purpose of the present invention is to provide a grinding material which has a superior grinding rate and planarizing accuracy, with the grinding rate being less likely to be reduced over a relatively long period of time. The present invention is directed to a grinding material including a base, a grinding layer overlaid on a front face side of the base and including grinding grains and a binder for the grinding grains, and an adhesion layer overlaid on a back face side of the base, in which the grinding grains are diamond grinding grains, a wear quantity of the grinding layer as determined by a Taber abrasion test is no less than 0.03 g and no greater than 0.18 g, and, an Asker D hardness measured from a front face side of the grinding layer is no less than 80° and no greater than 98°.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: June 8, 2021
    Assignee: BANDO CHEMICAL INDUSTRIES, LTD.
    Inventors: Kazuo Saito, Kenji Shimoyama, Tomoki Iwanaga, Toshikazu Taura
  • Publication number: 20200376628
    Abstract: An object of the present invention is to provide a grinding material in which grinding portions can be increased in thickness while a decrease in grinding rate is inhibited. The grinding material according to the present invention includes a base, and a grinding layer overlaid on a front face side of the base and containing abrasive grains and a binder. The grinding layer includes a plurality of columnar grinding portions. The plurality of the grinding portions are configured so that the grinding portions are arranged in a staggered manner. The average thickness of the grinding portions is no less than 300 ?m. The area of a top face of each of the grinding portions is no less than 6 mm2. The average thickness of the base is no less than 300 ?m and no greater than 3,000 ?m.
    Type: Application
    Filed: November 15, 2018
    Publication date: December 3, 2020
    Applicant: BANDO CHEMICAL INDUSTRIES, LTD.
    Inventors: Soichiro NAKANE, Tomoki IWANAGA
  • Publication number: 20200298374
    Abstract: A grinding material includes a base sheet and a grinding layer overlaid on a front face side of the base sheet and including abrasive grains and a binder for the abrasive grains. The grinding layer includes the abrasive grains of a plurality of types. Of the abrasive grains of the plurality of types, provided that first abrasive grains have the largest average diameter and second abrasive grains have the second largest average diameter, the percentage of the average diameter of the second abrasive grains with respect to that of the first abrasive grains is 5-70%. The total content of the abrasive grains in the grinding layer is preferably 50-85% by volume. The content of the first abrasive grains in the grinding layer is preferably 1-25% by volume. The first abrasive grains are preferably diamond abrasive grains and the second abrasive grains are preferably alumina abrasive grains.
    Type: Application
    Filed: January 19, 2017
    Publication date: September 24, 2020
    Applicant: BANDO CHEMICAL INDUSTRIES, LTD.
    Inventors: Daisuke TAKAGI, Tomoki IWANAGA, Kazuo SAITO, Toshikazu TAURA
  • Patent number: 10456888
    Abstract: It is an object of the present invention to provide an abrasive material which enables: processing efficiency and finished planarity of a substrate material to be simultaneously improved at a high level; polishing costs to be reduced; and a difficult-to-process substrate composed of sapphire or silicon carbide to be polished efficiently and precisely. An abrasive material comprises a substrate and an abrasive layer laminated on a front face side of the substrate, wherein the abrasive layer includes a binder containing an inorganic substance as a principal component, and abrasive particles dispersed in the binder, wherein a front face of the abrasive layer comprises a plurality of regions provided through dividing by grooves, and wherein a maximum peak height (Rp) on the front face of the abrasive layer is no less than 2.5 ?m and no greater than 70 ?m.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: October 29, 2019
    Assignee: BANDO CHEMICAL INDUSTRIES, LTD.
    Inventors: Fumihiro Mukai, Tomoki Iwanaga, Daisuke Takagi, Kazuo Saito, Toshikazu Taura
  • Publication number: 20180185985
    Abstract: The purpose of the present invention is to provide a grinding material which has a superior grinding rate and planarizing accuracy, with the grinding rate being less likely to be reduced over a relatively long period of time. The present invention is directed to a grinding material including a base, a grinding layer overlaid on a front face side of the base and including grinding grains and a binder for the grinding grains, and an adhesion layer overlaid on a back face side of the base, in which the grinding grains are diamond grinding grains, a wear quantity of the grinding layer as determined by a Taber abrasion test is no less than 0.03 g and no greater than 0.18 g, and, an Asker D hardness measured from a front face side of the grinding layer is no less than 80° and no greater than 98°.
    Type: Application
    Filed: May 24, 2016
    Publication date: July 5, 2018
    Applicant: BANDO CHEMICAL INDUSTRIES, LTD.
    Inventors: Kazuo SAITO, Kenji SHIMOYAMA, Tomoki IWANAGA, Toshikazu TAURA
  • Publication number: 20170312886
    Abstract: It is an object of the present invention to provide an abrasive material which enables: processing efficiency and finished planarity of a substrate material to be simultaneously improved at a high level; polishing costs to be reduced; and a difficult-to-process substrate composed of sapphire or silicon carbide to be polished efficiently and precisely. An abrasive material comprises a substrate and an abrasive layer laminated on a front face side of the substrate, wherein the abrasive layer includes a binder containing an inorganic substance as a principal component, and abrasive particles dispersed in the binder, wherein a front face of the abrasive layer comprises a plurality of regions provided through dividing by grooves, and wherein a maximum peak height (Rp) on the front face of the abrasive layer is no less than 2.5 ?m and no greater than 70 ?m.
    Type: Application
    Filed: October 6, 2015
    Publication date: November 2, 2017
    Applicant: BANDO CHEMICAL INDUSTRIES, LTD.
    Inventors: Fumihiro MUKAI, Tomoki IWANAGA, Daisuke TAKAGI, Kazuo SAITO, Toshikazu TAURA
  • Patent number: 6139620
    Abstract: A method of manufacturing a calcium silicate board having a bulk specific gravity of approximately 0.5 to 0.8, which method achieves a decrease in the bulk specific gravity and an increase in the matrix strength of the board without impairing productivity, and the calcium silicate board obtained by this method. The method is characterized in that a material slurry comprising 5 to 30 wt % of calcium silicate hydrate slurry as a solid component, 17 to 50 wt % of calcareous material, 13 to 45 wt % of silica containing material, 2 to 8 wt % of fiber material, and 5 to 40 wt % of inorganic fillers is formed through conventional processes and the obtained molded body is subjected to a hydrothermal reaction in a pressure container.
    Type: Grant
    Filed: February 18, 1998
    Date of Patent: October 31, 2000
    Assignee: ASK Corporation
    Inventors: Seishiro Suzuki, Masato Sakiyama, Takuya Asami, Tomoki Iwanaga, Yasuhide Oshio, Shigemitsu Shiromoto, Toru Sugiyama, Masaaki Oda
  • Patent number: 5952087
    Abstract: The object of the present invention is to improve the overall strength and interlaminar strength of a compact (green sheet) before hydrothermal reaction by using alunites, alums and aluminum sulfate having a specified specific surface area which does not require the addition of a setting retarder or a curing accelerator together with a curing agent in order to provide a method of manufacture for a lightweight calcium silicate board which does not give rise to interlaminar peeling or bursting during hydrothermal reaction and to provide such a calcium silicate board. The method of manufacture for a calcium silicate board according to the present invention is characterized by use of one or more species selected from alunites and alums with a Blaine specific surface area of 4000 cm.sup.2 /g or more or aluminum sulfate with a Blaine specific surface area of 2000 cm.sup.2 /g or more.
    Type: Grant
    Filed: August 19, 1998
    Date of Patent: September 14, 1999
    Assignee: ASK Corporation
    Inventors: Masato Sakiyama, Takuya Asami, Tomoki Iwanaga, Yasuhide Oshio, Masaaki Oda
  • Patent number: 5851354
    Abstract: The object of the present invention is to improve the overall strength and interlaminar strength of a compact (green sheet) before hydrothermal reaction by using alunites, alums and aluminum sulfate having a specified specific surface area which does not require the addition of a setting retarder or a curing accelerator together with a curing agent in order to provide a method of manufacture for a lightweight calcium silicate board which does not give rise to interlaminar peeling or bursting during hydrothermal reaction and to provide such a calcium silicate board. The method of manufacture for a calcium silicate board according to the present invention is characterized by use of one or more species selected from alunites and alums with a Blaine specific surface area of 4000 cm.sup.2 /g or more or aluminum sulfate with a Blaine specific surface area of 2000 cm.sup.2 /g or more.
    Type: Grant
    Filed: February 25, 1997
    Date of Patent: December 22, 1998
    Assignee: Ask Corporation
    Inventors: Masato Sakiyama, Takuya Asami, Tomoki Iwanaga, Yasuhide Oshio, Masaaki Oda