Abstract: According to one embodiment, a wireless communication device includes a receiver configured to receive a plurality of first frames which are transmitted by multiplexing; and a transmitter configured to transmit a second frame containing check results indicating whether the plurality of first frames are successfully received and first information specifying at least one wireless communication device. The receiver is configured to receive a plurality of third frames transmitted by multiplexing in response to the second frame.

Abstract: According to one embodiment, a wireless communication device includes a receiver configured to receive a plurality of first frames which are transmitted by multiplexing; and a transmitter configured to transmit a second frame containing check results indicating whether the plurality of first frames are successfully received and first information specifying at least one wireless communication device. The receiver is configured to receive a plurality of third frames transmitted by multiplexing in response to the second frame.

Abstract: The present invention provides a coating composition, which can simply produce a porous siliceous film having excellent mechanical strength and, at the same time, possessing a stable very low level of dielectric and good chemical resistance to various chemicals, and to provide a process for producing a siliceous material using the same. The coating composition according to the present invention comprises a polyalkylsilazane compound, an acetoxysilane compound, an organic solvent, and, if necessary, a pore forming material. The present invention also provides a siliceous material produced by firing the coating composition and a process for producing the same.

Abstract: An objective of the present invention is to provide a phosphorous-containing siliceous material having a specific permittivity of not more than 3.5. The phosphorus-containing silazane composition according to the present invention is characterized by comprising a polyalkylsilazane and at least one phosphorus compound in an organic solvent. A phosphorus-containing siliceous film may be formed by coating the composition onto a substrate to form a film which is then prebaked at a temperature of 50 to 300° C. and is then baked in an inert atmosphere at a temperature of 300 to 700° C. The phosphorus compound according to the present invention is preferably a pentavalent phosphoric ester or phosphazene compound.

Abstract: There is provided a low-permittivity porous siliceous film that has high mechanical strength and is useful in an interlayer insulation film. The coating composition according to the present invention is characterized by comprising: an organic solvent and, contained in said organic solvent, 1) a polyalkylsilazane and 2) at least one organic resin component selected from the group consisting of homopolymers and copolymers of acrylic esters and methacrylic esters, group —COOH and/or group —OH being contained in at least a part of side groups contained in at least one type of the organic resin component.

Abstract: The present invention provides a coating composition, which can simply produce a porous siliceous film having excellent mechanical strength and, at the same time, possessing a stable very low level of dielectric and good chemical resistance to various chemicals, and to provide a process for producing a siliceous material using the same. The coating composition according to the present invention comprises a polyalkylsilazane compound, an acetoxysilane compound, an organic solvent, and, if necessary, a pore forming material. The present invention also provides a siliceous material produced by firing the coating composition and a process for producing the same.

Abstract: An objective of the present invention is to provide a phosphorous-containing siliceous material having a specific permittivity of not more than 3.5. The phosphorus-containing silazane composition according to the present invention is characterized by comprising a polyalkylsilazane and at least one phosphorus compound in an organic solvent. A phosphorus-containing siliceous film may be formed by coating the composition onto a substrate to form a film which is then prebaked at a temperature of 50 to 300° C. and is then baked in an inert atmosphere at a temperature of 300 to 700° C. The phosphorus compound according to the present invention is preferably a pentavalent phosphoric ester or phosphazene compound.

Abstract: A method for sealing a fine groove with a siliceous material, characterized as comprising applying a solution of a perhydropolysilazane having a weight average molecular weight in the range of 3,000 to 20,000 in terms of polystyrene to a substrate having at least one groove having a width of 0.2 &mgr;m or less at its deepest portion and having a ratio of the corresponding depth to the width of 2 or more, to thereby fill and seal the groove with the perhydropolysilazane, and then heating the perhydropolysilazane in an atmosphere containing water vapor to thereby convert the perhydropolysilazane to a siliceous material.

Abstract: A coating composition having an aluminum-containing polysilazane and a polyacrylate or polymethacrylate ester in an organic solvent and methods of producing the same.

Abstract: A photosensitive polysilazane which may be used as a positive-tone photoresist, and a method of forming a patterned polysilazane film by use of such a composition are provided. The photosensitive polysilazane composition of the invention is characterized by comprising a polysilazane, particularly polymethylsilazane or polyphenylsilazane, and an optically acid-generating agent. The patterned polysilazane film is obtained by exposing a coating of the photosensitive polysilazane composition of the invention to light in a pattern and dissolving off the exposed portion.

Abstract: There is provided a porous silica coating, suitable for an interlayer dielectric, which stably exhibits an extremely low specific dielectric constant and which also has resistance to various chemicals and a mechanical strength allowing the coating to withstand the latest highly integrating process including a CMP process. The porous coating of the present invention is obtained by baking a coating of a composition comprising a polyalkylsilazane and a polyacrylic or polymethacrylic ester, and is characterized by having a specific dielectric constant of less than 2.5.

Abstract: A porous silica coating having a dielectric constant of less than 2.5, a semiconductor device comprising the porous silica coating formed therein, and a coating composition for forming the porous silica coating.

Abstract: A porous silica coating having a dielectric constant of less than 2.5, a semiconductor device comprising the porous silica coating formed therein, and a coating composition for forming the porous silica coating.

Abstract: An amine residue-containing polysilazane having a number average molecular weight of 100-100,000 and having a molecular chain containing a silazane structure represented by the general formula (I) shown below and/or a silazane structure represented by the general formula (II) shown below: wherein R1 and R2 each stand for hydrogen, a hydrocarbyl group or a hydrocarbyl group-containing silyl group, A and A2 each stand for a divalent hydrocarbyl group, B stands for an N-hydrocarbyl group-substituted amine residue or a cyclic amine residue, B2 stands for a divalent linear amine residue or a divalent cyclic amine residue and p, r and q are each 0 or 1. The above polysilazane may be obtained by reacting a polysilazane with a mono- and/or dihydroxyl compound having an amine residue in an inert organic solvent containing no active hydrogen.

Abstract: Repetition of a process of impregnating a metal fiber or ceramic fiber preform or porous ceramic with (3) a mixture of polysilazane-type polymers with a number average molecular weight of 200-3000 and a viscosity adjusted to 100 Pa.s or lower at the impregnation temperature, prepared by mixing (1) one or more types of polysilazane-type polymers with a number average molecular weight of 200-3000 and a viscosity of less than 1 Pa.s at the impregnation temperature with (2) one or more types of polysilazane-type polymers with a number average molecular weight of 200-100,000 and having a viscosity of 1 Pa.s or higher or solid at the impregnation temperature, which are selected from polysilazanes whose main repeating unit is --[(SiH.sub.2).sub.n (NH).sub.r ]-- (where n and r are 1, 2 or 3), and copolymers, modified polymers and crosslinked polymers based thereon, and performing crosslinking curing and then firing, is performed for its conversion into a ceramic.

Abstract: A preceramic polymetalosilazane substantially free of Si-O groups is produced by reacting a polysilazane with a metal alkoxide in the presence of an alkylsilazane or alkylsilane. The preceramic polymer gives a high strength and heat resistant ceramic body which remains amorphous when calcined at 1,600.degree. C. for 10 hours in the atmosphere of nitrogen.

Abstract: Novel silane compound, alkoxy cyclopentyl diethoxysilane, is prepared by reacting cyclopentyl trihalosilane with ROH and then with ethanol, or by reacting cyclopentyl triethoxysilane with ROH, wherein alkyl in the alkoxy or R in ROH stands for an organic group selected from tile group consisting of isopropyl, sec-butyl, tert-buryl and tert-amyl groups. The silane compounds are useful as a catalytic component for olefin polymerization and as a silane coupling agent.

Abstract: Novel silane compound, alkoxy cyclopentyl dimethoxysilane, is prepared by reacting cyclopentyl trihalosilane with ROH and then with methanol, or by reacting cyclopentyl trimethoxysilane with ROH, wherein alkyl in the alkoxy or R in ROH stands for an organic group selected from the group consisting of sec-butyl, tert-amyl, cyclopentyl, oxa-3-cyclopentyl, cyclohexyl and 2-isopropyl-5-methyl cyclohexyl groups. The silane compounds are useful as a catalytic component for olefin polymerization and as a silane coupling agent.

Abstract: Novel silane compounds, tert.-butoxy cyclopentyl dimethoxysilane and isopropoxy cyclopentyl dimethoxysilane, are prepared by reacting cyclopentyl trihalosilane with ROH (where R stands for tert.-butyl or isopropyl group) and then with methanol, or by reacting cyclopentyl trimethoxysilane with ROH. The silane compounds are useful as a catlaytic component for olefin polymerization and as a silane coupling agent.