Patents by Inventor Tomoko Komatsu
Tomoko Komatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240091126Abstract: Base coat as an example of a resin composition for a cosmetic is a resin composition for a cosmetic used in a cosmetic to be adhered to nail as a part of living body. The resin composition for a cosmetic includes a stimulus-responsive material that undergoes a volume change by external stimuli, the external stimuli excluding both an external stimulus due to contact with a solvent and an external stimulus due to contact with a solution, and a solidified matter of the resin composition for a cosmetic has a surface with a water contact angle between 30° and 110° (inclusive). The solidified matter of the resin composition for a cosmetic undergoes the volume change by application of the external stimuli to reduce strength of adhesion to the part of living body.Type: ApplicationFiled: January 31, 2022Publication date: March 21, 2024Inventors: Tomoko KAWASHIMA, Taiki UMEMOTO, Keitaro AMARI, Yuko TANIIKE, Haruka KUSUKAME, Shinsuke KAWAGUCHI, Toshiyuki KOMATSU
-
Publication number: 20230357820Abstract: Provided is a test method with which mild cognitive impairment (MCI) is detectable and a measurement reagent for use in the test method. A test method for MCI according to the present invention includes a step of measuring the activity of superoxide dismutase (SOD) in a biological sample of a subject.Type: ApplicationFiled: August 18, 2021Publication date: November 9, 2023Applicant: Bioradical Research Institute Corp.Inventors: Masaichi Lee, Tomoko Komatsu
-
Patent number: 8223250Abstract: A solid-state image sensing device comprises: a light receiving unit for receiving light; a microlens formed above the light receiving unit; a fluorine-containing resin material layer formed on the microlens; and a transparent substrate provided over the fluorine-containing resin material layer. A resin layer adheres the fluorine-containing resin material layer and the transparent substrate.Type: GrantFiled: March 8, 2011Date of Patent: July 17, 2012Assignee: Panasonic CorporationInventors: Toshihiro Higuchi, Tomoko Komatsu, Tomoki Masuda, Mamoru Honjo, Naoki Tomoda
-
Patent number: 8139131Abstract: A solid state imaging device of the present invention comprises: a semiconductor substrate; a plurality of light receiving elements arranged in a matrix configuration on the semiconductor substrate; a plurality of color filter segments provided above the light receiving elements; and a light collector provided above the color filter segments for collecting light on the light receiving elements. The color filter segments are mutually separated by interstices. The interstices contain a gas.Type: GrantFiled: January 18, 2006Date of Patent: March 20, 2012Assignee: Panasonic CorporationInventors: Tomoko Komatsu, Toshihiro Higuchi
-
Patent number: 8093672Abstract: Provided is a manufacturing method of a solid-state imaging device, which is able to realize a solid-state imaging device whose reflection prevention coating is even and that does not have image noise in case of adopting a spincoating method in applying a material of the reflection prevention coating onto microlenses of the solid-state imaging device. In the solid-state imaging device 1 according to the present invention, a barrier wall pattern 7 is formed, as a step alleviating structure, in dicing areas 5X formed between adjacent imaging areas 9. The barrier wall pattern 7 has a rectangular sectional form. With use of the barrier wall pattern 7 in the spincoating method, reflection prevention coating 8 is coated onto the microlenses 6 more evenly than in conventional cases.Type: GrantFiled: September 20, 2006Date of Patent: January 10, 2012Assignee: Panasonic CorporationInventors: Tomoki Masuda, Toshihiro Higuchi, Yasuo Takeuchi, Tomoko Komatsu
-
Publication number: 20110278692Abstract: A solid-state image sensing element includes an effective pixel section in a central area of a light receiving surface thereof, and a ridge-shaped protruding portion is provided around the effective pixel section. A liquid transparent adhesive is applied on the effective pixel section, and a light transparent substrate is placed thereon. The light transparent substrate is in contact with the protruding portion, and is therefore prevented from sliding with the liquid adhesive serving as a lubricant. Thus, the light transparent substrate can be fixed at a predetermined position.Type: ApplicationFiled: July 27, 2011Publication date: November 17, 2011Applicant: Panasonic CorporationInventors: Yasuo TAKEUCHI, Tomoko Komatsu, Masashi Kuroda, Tetsushi Nishio, Kiyokazu Itoi
-
Publication number: 20110156192Abstract: A solid-state image sensing device comprises: a light receiving unit for receiving light; a microlens formed above the light receiving unit; a fluorine-containing resin material layer formed on the microlens; and a transparent substrate provided over the fluorine-containing resin material layer. A resin layer adheres the fluorine-containing resin material layer and the transparent substrate.Type: ApplicationFiled: March 8, 2011Publication date: June 30, 2011Applicant: PANASONIC CORPORATIONInventors: Toshihiro HIGUCHI, Tomoko Komatsu, Tomoki Masuda, Mamoru Honjo, Naoki Tomoda
-
Patent number: 7932948Abstract: A solid-state image sensing device comprises: a light receiving unit for receiving light; a microlens formed above the light receiving unit; a fluorine-containing resin material layer formed on the microlens; and a transparent substrate provided over the fluorine-containing resin material layer. A resin layer adheres the fluorine-containing resin material layer and the transparent substrate.Type: GrantFiled: July 19, 2006Date of Patent: April 26, 2011Assignee: Panasonic CorporationInventors: Toshihiro Higuchi, Tomoko Komatsu, Tomoki Masuda, Mamoru Honjo, Naoki Tomoda
-
Patent number: 7834926Abstract: A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.Type: GrantFiled: October 2, 2006Date of Patent: November 16, 2010Assignee: Panasonic CorporationInventors: Masanori Minamio, Tomoko Komatsu, Kiyokazu Itoi, Toshiyuki Fukuda
-
Publication number: 20100224948Abstract: A solid-state imaging element includes a semiconductor substrate formed with a valid pixel section including a plurality of photodetector sections, spacers formed on the valid pixel section, a transparent adhesive filling gaps among the spacers, and a transparent substrate which is bonded onto the spacers using the transparent adhesive and covers the valid pixel section when viewed in plan. Electrode pad sections are formed in a region of the semiconductor substrate located outside the valid pixel section.Type: ApplicationFiled: May 19, 2010Publication date: September 9, 2010Applicant: PANASONIC CORPORATIONInventors: Yasuo TAKEUCHI, Tomoko Komatsu, Masashi Kuroda, Tetsushi Nishio, Kiyokazu Itoi
-
Patent number: 7750360Abstract: Provided is a solid-state image pickup device capable of suppressing deterioration of characteristic caused due to an antireflection film itself absorbing a light. In the solid-state image pickup device of the present invention, a plurality of color filters 8a, 8b, and 8c having spectral characteristics, respectively, different from each other are provided so as to correspond to a plurality of light reception sections 2, respectively, aligned on a semiconductor substrate 1. Further, a plurality of microlenses 10 are provided above the plurality of color filters 8a, 8b, and 8c, respectively. A plurality of antireflection films 11a are selectively formed on surfaces of the microlenses 10 provided above color filters 8b each having a predetermined spectral characteristic.Type: GrantFiled: August 5, 2008Date of Patent: July 6, 2010Assignee: Panasonic CorporationInventors: Tomoki Masuda, Yasuo Takeuchi, Tomoko Komatsu, Tsuyoshi Ichinose
-
Publication number: 20100033607Abstract: A solid state imaging device includes: a solid state imaging element including a light receiving element, a microlens formed above the light receiving element, a first transparent layer formed on the microlens and a second transparent layer formed on or above the microlens and harder than the first transparent layer; a transparent component formed above the second transparent layer; and an adhesive layer for bonding the second transparent layer and the transparent component. The hard second transparent layer prevents the occurrence of scratches during a dicing step.Type: ApplicationFiled: October 15, 2009Publication date: February 11, 2010Applicant: PANASONIC CORPORATIONInventors: Tomoko KOMATSU, Tomoki Masuda, Nobukazu Teranishi
-
Patent number: 7646539Abstract: An optical device includes a substrate, a plurality of optical elements formed in an element formation region of the substrate, a plurality of lenses formed over the element formation region so as to correspond to the plurality of optical elements, and a protective layer formed so as to cover the plurality of lenses. A holding member is formed on the protective layer in a region outside the element formation region. The holding member holds a bottom surface of a transparent member. A gap between the protective layer and the transparent member is filled with an adhesive.Type: GrantFiled: March 11, 2009Date of Patent: January 12, 2010Assignee: Panasonic CorporationInventors: Kiyokazu Itoi, Tetsushi Nishio, Yutaka Harada, Tomoko Komatsu, Masashi Kuroda
-
Patent number: 7619678Abstract: A solid state imaging device includes: a solid state imaging element including a light receiving element, a microlens formed above the light receiving element, a first transparent layer formed on the microlens and a second transparent layer formed on or above the microlens and harder than the first transparent layer; a transparent component formed above the second transparent layer; and an adhesive layer for bonding the second transparent layer and the transparent component. The hard second transparent layer prevents the occurrence of scratches during a dicing step.Type: GrantFiled: October 23, 2006Date of Patent: November 17, 2009Assignee: Panasonic CorporationInventors: Tomoko Komatsu, Tomoki Masuda, Nobukazu Teranishi
-
Publication number: 20090237796Abstract: An optical device includes a substrate, a plurality of optical elements formed in an element formation region of the substrate, a plurality of lenses formed over the element formation region so as to correspond to the plurality of optical elements, and a protective layer formed so as to cover the plurality of lenses. A holding member is formed on the protective layer in a region outside the element formation region. The holding member holds a bottom surface of a transparent member. A gap between the protective layer and the transparent member is filled with an adhesive.Type: ApplicationFiled: March 11, 2009Publication date: September 24, 2009Inventors: Kiyokazu ITOI, Tetsushi Nishio, Yutaka Harada, Tomoko Komatsu, Masashi Kuroda
-
Publication number: 20090206430Abstract: A pattern (6B) is formed by performing selective exposure and development on a photosensitive resist (6A), and then the pattern (6B) is decolorized by irradiating the pattern with ultraviolet or visible light. Then, a microlens (6) is formed by deforming the shape of the pattern (6B) into a microlens shape by heating. An inequality of h/a?1 is satisfied, where, (h) is the height of the microlens (6), and (2a) is the length of the bottom plane of the microlens (6) in a short side direction when viewed from the upper plane.Type: ApplicationFiled: April 25, 2006Publication date: August 20, 2009Inventors: Toshihiro Higuchi, Masayuki Aoyama, Tomoko Komatsu
-
Patent number: 7547955Abstract: A semiconductor imaging device includes: a semiconductor imaging element including an imaging region, a peripheral circuit region, and an electrode region, the imaging region including a plurality of micro lenses; a semiconductor package the semiconductor package in which a cavity for mounting the semiconductor imaging element is formed, the semiconductor package including a plurality of internal connection terminals formed inside the periphery of the cavity for being connected with a plurality of electrode terminals of the semiconductor imaging element and a plurality of external connection terminals connected with the internal connection terminals; a fixing member for fixing the semiconductor imaging element to the cavity; and an optical member fixed to the semiconductor package by a sealing member so as to cover the semiconductor imaging element arranged in the cavity. Wherein, a face obtained by connecting vertexes of the micro lenses is formed into a continuous concave curve.Type: GrantFiled: January 31, 2007Date of Patent: June 16, 2009Assignee: Panasonic CorporationInventors: Masanori Minamio, Tomoko Komatsu, Toshiyuki Fukuda
-
Publication number: 20090085139Abstract: A solid-state image sensing element includes an effective pixel section in a central area of a light receiving surface thereof, and a ridge-shaped protruding portion is provided around the effective pixel section. A liquid transparent adhesive is applied on the effective pixel section, and a light transparent substrate is placed thereon. The light transparent substrate is in contact with the protruding portion, and is therefore prevented from sliding with the liquid adhesive serving as a lubricant. Thus, the light transparent substrate can be fixed at a predetermined position.Type: ApplicationFiled: September 25, 2008Publication date: April 2, 2009Inventors: Yasuo Takeuchi, Tomoko Komatsu, Masashi Kuroda, Tetsushi Nishio, Kiyokazu Itoi
-
Publication number: 20090039454Abstract: Provided is a solid-state image pickup device capable of suppressing deterioration of characteristic caused due to an antireflection film itself absorbing a light. In the solid-state image pickup device of the present invention, a plurality of color filters 8a, 8b, and 8c having spectral characteristics, respectively, different from each other are provided so as to correspond to a plurality of light reception sections 2, respectively, aligned on a semiconductor substrate 1. Further, a plurality of microlenses 10 are provided above the plurality of color filters 8a, 8b, and 8c, respectively. A plurality of antireflection films 11a are selectively formed on surfaces of the microlenses 10 provided above color filters 8b each having a predetermined spectral characteristic.Type: ApplicationFiled: August 5, 2008Publication date: February 12, 2009Inventors: Tomoki MASUDA, Yasuo Takeuchi, Tomoko Komatsu, Tsuyoshi Ichinose
-
Publication number: 20070228502Abstract: A semiconductor imaging device includes: a semiconductor imaging element including an imaging region, a peripheral circuit region, and an electrode region, the imaging region including a plurality of micro lenses; a semiconductor package the semiconductor package in which a cavity for mounting the semiconductor imaging element is formed, the semiconductor package including a plurality of internal connection terminals formed inside the periphery of the cavity for being connected with a plurality of electrode terminals of the semiconductor imaging element and a plurality of external connection terminals connected with the internal connection terminals; a fixing member for fixing the semiconductor imaging element to the cavity; and an optical member fixed to the semiconductor package by a sealing member so as to cover the semiconductor imaging element arranged in the cavity. Wherein, a face obtained by connecting vertexes of the micro lenses is formed into a continuous concave curve.Type: ApplicationFiled: January 31, 2007Publication date: October 4, 2007Inventors: Masanori Minamio, Tomoko Komatsu, Toshiyuki Fukuda