Abstract: A force sensor module according to an embodiment of the present disclosure includes a plurality of force sensors. Each of the force sensor includes a plurality of sensor sections having force detection directions different from each other, and a flexible rubber member that is provided to cover the plurality of sensor sections. The rubber member is configured to transmit a force inputted from outside to the plurality of force sensors by deformation corresponding to the force.

Abstract: An information processing device includes an analyzing unit configured to analyze text data representing claims included in patent document data to identify constituent components of an invention for each claim included in the claims, and a display control unit configured to cause a display device to display texts indicating each claim in the claims, in a form in which the texts indicating each claim are partitioned into the constituent components.

Abstract: The objective of the present invention is to provide a reliable thin-film circuit substrate or via formed substrate that is provided with minute via plugs at a fine pitch. The objective is served by forming an insulation layer that functions as an etching stopper on a Si substrate, and then via holes are formed in the Si substrate, using a semiconductor process, until the etching stopper layer is exposed. Further, a thin-film circuit is formed on the insulation layer, and the insulation layer is removed at the via holes such that the thin-film circuit is exposed. As necessary, the thin film circuit is heat-treated, and then the via holes are filled with an electrically conductive material and vamp electrodes are formed.

Abstract: The objective of the present invention is to provide a reliable thin-film circuit substrate or via formed substrate that is provided with minute via plugs at a fine pitch. The objective is served by forming an insulation layer that functions as an etching stopper on a Si substrate, and then via holes are formed in the Si substrate, using a semiconductor process, until the etching stopper layer is exposed. Further, a thin-film circuit is formed on the insulation layer, and the insulation layer is removed at the via holes such that the thin-film circuit is exposed. As necessary, the thin film circuit is heat-treated, and then the via holes are filled with an electrically conductive material and vamp electrodes are formed.