Abstract: A hydraulic supply device includes: a first oil pump configured to supply oil to a supply passage; a second oil pump driven together with the first oil pump or driven when the first oil pump is stopped; a first check valve provided in a first oil passage that allows a suction side of the second oil pump to communicate with an oil source, and configured to close the first oil passage when the second oil pump is stopped; a second check valve provided in a second oil passage that allows a discharge side of the second oil pump to communicate with the supply passage, and configured to close the second oil passage when the second oil pump is stopped; and a third oil passage into which the oil supplied to the supply passage flows, wherein the oil flowing into the third oil passage is used as an auxiliary pressure for operation of the second check valve when the second oil passage is closed.

Abstract: An oil pressure supply device includes: a first oil pump configured to be operated by a traveling drive source of a vehicle; a second oil pump configured to be operated by a motor different from the traveling drive source and to be switched between an operation and a stop according to a traveling condition of the vehicle; a pressure regulating circuit configured to regulate an oil pressure generated by the first oil pump and the second oil pump and supply the regulated oil pressure to an oil chamber; an oil passage configured to connect the second oil pump with an oil source; and a check valve provided in the oil passage.

Abstract: An oil pressure supply device supplies, to an oil chamber, an oil pressure generated by suctioning oil from an oil source with an oil pump. The oil pressure supply device includes a first oil passage connected to a suction side of the oil pump; a first check valve provided in the first oil passage and configured to close the first oil passage and prevent oil from moving to the oil source side when the oil pump is stopped; a second oil passage connected to a discharge side of the oil pump; and a second check valve provided in the second oil passage and configured to close the second oil passage and prevent oil from moving to the oil pump side when the oil pump is stopped. When the oil pump is stopped, the second check valve closes the second oil passage earlier than the first check valve closes the first oil passage.

Abstract: A method for processing a substrate is provided. According to the method, a process gas is supplied to a surface of a substrate, and then a separation gas is supplied to the surface of the substrate. Moreover, a first plasma processing gas is supplied to the surface of the substrate in a first state in which a distance between the first plasma generation unit and the turntable is set at a first distance, and a second plasma processing gas is supplied to the surface of the substrate in a second state in which a distance between the second plasma generation unit and the turntable is set at a second distance shorter than the first distance. Furthermore, the separation gas is supplied to the surface of the substrate.

Abstract: A method for processing a substrate is provided. According to the method, a process gas is supplied to a surface of a substrate, and then a separation gas is supplied to the surface of the substrate. Moreover, a first plasma processing gas is supplied to the surface of the substrate in a first state in which a distance between the first plasma generation unit and the turntable is set at a first distance, and a second plasma processing gas is supplied to the surface of the substrate in a second state in which a distance between the second plasma generation unit and the turntable is set at a second distance shorter than the first distance. Furthermore, the separation gas is supplied to the surface of the substrate.

Abstract: A method for processing a substrate is provided. According to the method, a process gas is supplied to a surface of a substrate, and then a separation gas is supplied to the surface of the substrate. Moreover, a first plasma processing gas is supplied to the surface of the substrate in a first state in which a distance between the first plasma generation unit and the turntable is set at a first distance, and a second plasma processing gas is supplied to the surface of the substrate in a second state in which a distance between the second plasma generation unit and the turntable is set at a second distance shorter than the first distance. Furthermore, the separation gas is supplied to the surface of the substrate.

Abstract: A method for processing a substrate is provided. According to the method, a process gas is supplied to a surface of a substrate, and then a separation gas is supplied to the surface of the substrate. Moreover, a first plasma processing gas is supplied to the surface of the substrate in a first state in which a distance between the first plasma generation unit and the turntable is set at a first distance, and a second plasma processing gas is supplied to the surface of the substrate in a second state in which a distance between the second plasma generation unit and the turntable is set at a second distance shorter than the first distance. Furthermore, the separation gas is supplied to the surface of the substrate.